Germanys Institut fuer Mikrotechnik Mainz (IMM) has applied for a patent on miniaturised analysis system for the detection of TNT (2,4,6-trinitrotoluene) in environmental samples. The system provides for a fast on-site analysis of TNT, its decomposition products (metabolites) and pesticides in water and soil.
Swedish mask writing tool producer Micronic has withdrawn its forecast for 2002 and is to reduce costs. The company says that a weak semiconductor market continues to affect its customers. Micronic has been notified of a further push out in the shipment of the companys second Sigma system, planned for delivery in Q4, 2002.
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SEMI reports a preliminary book-to-bill ratio for the North American
semiconductor equipment industry of 0.73 in October, based on $766mn in orders and billings of $1.05bn. These figures represent growths of 19% and 18% on 2001, respectively. The book-to-bill was 0.80 in September and 1.02 in August.
Christ Water Technology Group (CWT) is to deliver a high-performance
ultrapure water system to mainland China. This unit will produce
270m3/hour of ultrapure water for semiconductor production. The value of the order is a two-digit million-dollar figure
Spectrian has agreed to pay Cree Microwave $5mn in exchange for the
termination of a December 2000 purchase and supply agreement that was scheduled to expire in June 2003.
Akrion has received a repeat order for a $2mn GAMA advanced
front-end-of-line (AFeOL) cleaning tool to be installed at a European facility. The customer will use the new GAMA in the production of micro-electro-mechanical systems (MEMS). The wet station uses a patented DIO3 (high concentration ozonated DI
water) organic cleaning tank.
Motorola is to use Optonics EmiScope-I diagnostic solution for node level timing measurement of flip-chip and silicon-on-insulator (SOI) devices. EmiScope-I is currently in production in two Motorola diagnostic facilities. EmiScope provides a multi-GHz bandwidth and highly accurate, extendible diagnostic platform to measure switching (timing) events through photon emission measurement.
The North American MEMS Industry Group (MIG) and Europes NEXUS (Grenoble, France) have entered into a partnership to foster greater development and commercialisation of microsystem technology in Europe and North America.
Trikon Technologies has produced a new module for a high rate, anisotropic, deep silicon etch processes for the fabrication of micro-electro-mechanical systems (MEMS). The etch process was developed by Germanys Robert Bosch.
National Semiconductor began construction of its first semiconductor
assembly and test facility in China with groundbreaking ceremonies at the Suzhou Industrial Park, 80km from Shanghai. The new plant will include three buildings with 51,800m2 of total floor space. It is expected to begin operations with about 500 employees in 2004.
STMicroelectronics says it has started production of one of the most complex system-on-chip (SoC) devices ever built for a scientific experiment. The "ALTRO" chip was jointly developed at the CERN particle research centre in Switzerland by ST and the ALICE experimental collaboration.
IBM and Singapore foundry Chartered Semiconductor Manufacturing have made a joint development and manufacturing agreement. The two companies plan to develop and align on 90nm and 65nm logic processes for foundry chip production on 300mm silicon wafers.
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JSR Micro opened a new materials manufacturing facility in Leuven, Belgium yesterday with an internationally attended reception at the new site. The day was attended by the Japanese ambassador and representatives of every major European semiconductor manufacturer.
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MEMSCAP launched a one-stop software/service package for design and prototyping of MEMS-based products. The MUMPStart package is the first to combine the capabilities of MEMSCAP with its newly acquired US unit, formerly JDS Uniphase’s Cronos MEMS business unit.
The package provides a three-month license for MEMSCAPs MEMS Pro CAD tool suite, one day of software training, access to the CaMEL library of existing micro-electro-mechanical design elements, and space on the companys PolyMUMPs (multi-user MEMS processes) wafer runs.
austriamicrosystems announced availability of its 0.35µm SiGe BiCMOS process, which is based on its 0.35µm CMOS mixed-signal base technology licensed from TSMC. The process offers high-speed 70GHz heterojunction bipolar (HBT) transistors. A variety of options include 5V I/O transistors, high precision linear capacitors metal2/metal3 (MIM), poly1/poly2 (PIP) capacitors and resistive poly. The company is aiming at high performance RF applications up to 20Gbit/s.