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Wednesday 27th November 2002
IBM and Singapore foundry Chartered Semiconductor Manufacturing have made a joint development and manufacturing agreement. The two companies plan to develop and align on 90nm and 65nm logic processes for foundry chip production on 300mm silicon wafers.
Wednesday 27th November 2002
Kopin has developed a new ohmic contact technology for gallium nitride (GaN) devices (Applied Physics Letters, November 18, 2002).
Wednesday 27th November 2002
Trikon Technologies has produced a new module for a high rate, anisotropic, deep silicon etch processes for the fabrication of micro-electro-mechanical systems (MEMS).
Tuesday 26th November 2002
Agility Communications, Alcatel Optronics and Bookham Technology announced a multi-source agreement (MSA) for tunable laser sources.
Thursday 21st November 2002
The good news doesn’t end there. We are also offering companies a special sponsorship opportunity. Pay per click offer available for newsletter sponsorship until 19th December 2002. We are offering companies the chance to pay per individual click thru they receive whilst sponsoring the newsletter. This means that you pay an initial £250 for banner design and tracking device on your banners then £25 for any clicks through to your website/request form there after (after the £1,595 is reached includes £250 payment (c.42 enquiries) then all other enquiries/clicks are Free Of Charge). All click-through will have a tracker attached so click-through can be monitored by your company via password For more info please contact: Jane Ryall +44 (0)1926 512424
Thursday 21st November 2002
JSR Micro opened a new materials manufacturing facility in Leuven, Belgium yesterday with an internationally attended reception at the new site. The day was attended by the Japanese ambassador and representatives of every major European semiconductor manufacturer.
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Thursday 21st November 2002
The Eurosemi PLUS team are delighted to announce that our newsletter product has undergone a dramatic change! Having launched the original Eurosemi PLUS as a partly free and partly paid for product we have now decided to make ALL CONTENT FREE OF CHARGE! That means no need for a Username and no need for a Password. As a result all content is more accessible for ALL of our subscribers. View all bulletins and all news items FREE. Our product is fast becoming the information resource you can not do with out. And the reason for this evolution of our product? Well basically the reason is YOU. Having launched our original product we promised to continually improve our newsletter to provide you with the best possible information source available for Semiconductor news. That is what we have done. Based on your feedback we are making the changes outlined above. The voice of our subscribers does count to us. As long as you continue to give us your honest opinion on the product we provide we will promise we will do what we can do give you what you want. Our subscribers asked for FREE content which is more accessible. That is what we are now giving. We hope you continue to enjoy Eurosemi PLUS. Got a view on Eurosemi PLUS? Pleased with the new format of the newsletter? Click here and send us any feedback on our product.
Thursday 21st November 2002
MEMSCAP launched a one-stop software/service package for design and prototyping of MEMS-based products. The MUMPStart package is the first to combine the capabilities of MEMSCAP with its newly acquired US unit, formerly JDS Uniphase’s Cronos MEMS business unit. The package provides a three-month license for MEMSCAPs MEMS Pro CAD tool suite, one day of software training, access to the CaMEL library of existing micro-electro-mechanical design elements, and space on the companys PolyMUMPs (multi-user MEMS processes) wafer runs.
Thursday 21st November 2002
austriamicrosystems announced availability of its 0.35µm SiGe BiCMOS process, which is based on its 0.35µm CMOS mixed-signal base technology licensed from TSMC. The process offers high-speed 70GHz heterojunction bipolar (HBT) transistors. A variety of options include 5V I/O transistors, high precision linear capacitors metal2/metal3 (MIM), poly1/poly2 (PIP) capacitors and resistive poly. The company is aiming at high performance RF applications up to 20Gbit/s.
Thursday 21st November 2002
X-FAB Semiconductor Foundries is offering a new 0.8µm process CX08 for 42V PowerNet automotive applications. Brendan Bold, technology development director, reports: "New elements of our 0.8µm process include NMOS and PMOS transistors with gate-to-drain breakdown voltage of over 80V, allowing operating voltages of up to 60V."
Thursday 21st November 2002
Germany’s Infineon Technologies and Nanya Technology of Taiwan have signed final contracts for strategic cooperation on standard DRAM memory. The cooperation will share costs for joint DRAM development of advanced 0.09µm and 0.07µm production technologies on 300mm wafers. The companies have also set up a 50-50 joint venture for the production of DRAM chips. A new joint 300mm facility will be built in Taiwan. Maximum production capacity will approach 50,000 wafer starts a month once the facility is fully operational. Initial production of the first 300mm wafers in the new facility is expected in late 2003.
Thursday 21st November 2002
Cree and Nichia have entered into a patent cross license agreement, settling litigation between the companies concerning gallium nitride-based optoelectronic technology. The technology is used for next generation high brightness LEDs, laser diodes and LED based lighting.
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Thursday 21st November 2002
UK-based fab equipment producer Trikon Technologies reports Q3 revenues down 77% on last year at $4.5mn. Revenues in Q3 2001 were $19.7mn. The Q3 2002 net loss is reported at $7.1mn, compared with a net income of $0.9mn last year.
Thursday 21st November 2002
MEMSCAP launched a one-stop software/service package for design and prototyping of MEMS-based product. Samsung Electronics will integrate Cognexs In-Sight 1700 wafer reader in all of its chip manufacturing plants in Hwasung, South Korea.
Thursday 21st November 2002
AMD is to reduce its global workforce by 2000 people, representing 15% of its staff. The action is to be completed by the end of Q2 2003. The company wants to reduce its breakeven point and cut costs by $350mn in 2003.
Thursday 21st November 2002
Shipments of USB Flash drives are currently less than 10mn units a year, according to market researcher Semico Research - but by 2006 they will have mushroomed to nearly 50mn units, it is forecast. "The utility of this device has resonated with computer users, and adoption is growing quickly," says Jim Handy, director for the non-volatile memory sector.
Thursday 21st November 2002
X-FAB Semiconductor Foundries is offering a new 0.8micron process CX08 for 42V PowerNet automotive applications
Thursday 21st November 2002
Germanys Infineon Technologies and Nanya Technology of Taiwan have signed final contracts for strategic cooperation on standard DRAM memory. The cooperation will share costs for joint DRAM development of advanced 0.09micron and 0.07micron production technologies on 300mm wafers. The companies have also set up a 50-50 joint venture for the production of DRAM chips.
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Wednesday 20th November 2002
Matsushita Electric Industrial Co and IMEC, Europe’s leading independent microelectronics R&D centre, will collaborate on the development and implementation of high-k gate stacks for (sub)-65nm devices.
Wednesday 20th November 2002
Wacker Siltronic’s 300 mm argon annealed wafers have been qualified at one of its customers production sites. Wacker Siltronic achieved the qualification of annealed wafers for a 300 mm volume production line.
Wednesday 20th November 2002
SUSS MicroTec announced a key order for its 200mm Mask Aligner from Shipley Company. Shipley a supplier of photoresist to the advanced packaging market, chose SUSS MicroTecs Mask Aligner technology over alternative technologies due to its low cost of ownership and flexibility for processing wafers of different sizes and photo resist thickness.
Thursday 14th November 2002
15% discount if you book your newsletter sponsorship for any dates in 2002/3! Newsletter is broadcast weekly every Monday, Details available on request!(email: [email protected])(Tel:+44 (0)1926 512424)What does your Sponsorship include?YOUR companies exclusive banner on the newsletterand news articles also found on our website"200 word article relating to your promotion!(leading article in the newsletter)Banner and article can link to data capture forms and/or pages on your websiteAll year round exposure on the European Semiconductor website
Thursday 14th November 2002
Arch Microelectronic Materials has been granted two US patents in the field of chemical mechanical planarisation (CMP) slurries. STMicroelectronics has filed a US lawsuit for patent infringement against Broadcom. Thomson Derwent launched a micro/nano-electro-mechanical systems (MEMS & NEMS) Industry and Technology Patents profile (ITP) service.
Thursday 14th November 2002
Infineon Technologies reports Q4 revenues at EUR1.38bn, up 28% year-on-year. Net losses come in at EUR506mn, compared with a EUR523mn loss in 2001. Aixtrons Q3 sales were EUR35.3mn, compared with EUR69.1 in 2001. Net income was EUR4.6mn, compared with 2001s EUR10.6mn. Excimer laser producer Lambda Physik reports sales of EUR98.5mn in the year ended September 30, 2002.

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