SZ Testsysteme creditors have decided to shut the business down. A creditors committee is currently considering a continuation of the operational business by a rescue company. In this regard there are two offers.
A leading European semiconductor manufacturer has placed an
order for NuTool’s integrated 300mm LuminaCu system.
The system is configured with patented electrochemical
mechanical deposition (ECMD) and reverse linear chemical
mechanical planarisation (RL-CMP) process modules for Cu
damascene development at the 65nm technology node and beyond.
The LuminaCu system delivers up to 60 wafers per hour for
typical Cu CMP applications. For Cu plating applications, the
LuminaCu ECMD system with its patented super planar deposition
technology delivers up to 90 wafers per hour. NuTool will ship the
system to the customer in Q1 2003.
Singapore foundry Chartered Semiconductor Manufacturing reports
improved expectations in Q4. Revenues, shipments and fab
utilisation levels are all set to be higher than previous guidance
(October 25, 2002) suggested.
Researchers from Agere Systems claim that electrical breakdown in
thin-film dielectrics is based on an uncorrelated build-up of defects
(Nature, November 28, 2002). This contrasts with thick films where
the presence of defects makes it easier for new ones to form
resulting in a catastrophic failure. The scientists compared
measurements on 100 FETs with an uncorrelated model and found
The draft Sixth Framework Program (FP6) information society
technologies (IST) research agenda for the European Union
contains plans for pushing the limits of CMOS and preparing for
post-CMOS and micro and nano system development. The draft is in
the process of European Commission adoption and is not a binding
This week is the International Electron Devices Meeting (IEDM), December 8-11, in San Francisco, California. We have presented some of the research already in previous weeks. Here are some details of work at STMicroelectronics, IBM and of collaboration at
Toshiba and Sony.
SUSS MicroTec says it offers a cost-effective alternative to high-resolution electron beam lithography for printing sub-100nm geometries with three embossing tools based on its mask aligner and bonding tools.
Donaldson High Purity Products, a division of the Donaldson Company, Inc. focused on the design and manufacture of gas-phase contaminant filtration solutions for the semiconductor industry, today announced immediate availability of a new point-of-use filter. Designed in cooperation with major optical lithography tool manufacturers and employing multiple filtration mechanisms, the LITHOGUARD POU effectively controls gas-phase contamination that effects image quality and causes degradation of optical elements, thereby improving yield rates and increasing uptime of lithography exposure tools. With the capability for removing bases, acids and organic gas phase contaminants at high efficiencies, the LITHOGUARD POU is ideal for the chemical filtration of pressurized air streams in critical point-of-use applications.
For more information: http://www.donaldson.com/en/semiconductor/index.html
Or e-mail :
Donaldson is a supplier of chemical filtration solutions for
the Semiconductor industry with products targeted at high efficiency removal
of airborne molecular contaminants of concern to processes and tools. The
product range includes Point-of-Use filters with applications for process
air, CDA and nitrogen, chemical filtration systems for tools (Lithography,
Vertical Furnaces, Mask making... ) and a new range of laminar flow, low
pressure drop media for minienvironments (wafer stockers, reticle stockers,
laminar flow benches) All these applications require filtration to sub-ppb
levels of bases, organics and acid gases and careful selection of
Based in Leuven, Belgium, Donaldson Europe serves the
European Semiconductor market.
Please Click Here for more information.
Singapore foundry Chartered Semiconductor Manufacturing reports improved expectations in Q4. Revenues, shipments and fab utilisation levels are all set to be higher than previous guidance (October 25, 2002) suggested.