austriamicrosystems announced availability of its 0.35µm SiGe BiCMOS process, which is based on its 0.35µm CMOS mixed-signal base technology licensed from TSMC. The process offers high-speed 70GHz heterojunction bipolar (HBT) transistors. A variety of options include 5V I/O transistors, high precision linear capacitors metal2/metal3 (MIM), poly1/poly2 (PIP) capacitors and resistive poly. The company is aiming at high performance RF applications up to 20Gbit/s.
X-FAB Semiconductor Foundries is offering a new 0.8µm process CX08 for 42V PowerNet automotive applications. Brendan Bold, technology development director, reports: "New elements of our 0.8µm process include NMOS and PMOS transistors with gate-to-drain breakdown voltage of over 80V, allowing operating voltages of up to 60V."
Germany’s Infineon Technologies and Nanya Technology of Taiwan have signed final contracts for strategic cooperation on standard DRAM memory. The cooperation will share costs for joint DRAM development of advanced 0.09µm and 0.07µm production technologies on 300mm wafers. The companies have also set up a 50-50 joint venture for the production of DRAM chips. A new joint 300mm facility will be built in Taiwan. Maximum production capacity will approach 50,000 wafer starts a month once the facility is fully operational. Initial production of the first 300mm wafers in the new facility is expected in late 2003.
Cree and Nichia have entered into a patent cross license agreement, settling litigation between the companies concerning gallium nitride-based optoelectronic technology. The technology is used for next generation high brightness LEDs, laser diodes and LED based lighting.
UK-based fab equipment producer Trikon Technologies reports Q3 revenues down 77% on last year at $4.5mn. Revenues in Q3 2001 were $19.7mn. The Q3 2002 net loss is reported at $7.1mn, compared with a net income of $0.9mn last year.
MEMSCAP launched a one-stop software/service package for design and
prototyping of MEMS-based product.
Samsung Electronics will integrate Cognexs In-Sight 1700 wafer reader in all of its chip manufacturing plants in Hwasung, South Korea.
AMD is to reduce its global workforce by 2000 people, representing 15% of its staff. The action is to be completed by the end of Q2 2003. The company wants to reduce its breakeven point and cut costs by $350mn in 2003.
Shipments of USB Flash drives are currently less than 10mn units a year, according to market researcher Semico Research - but by 2006 they will have mushroomed to nearly 50mn units, it is forecast. "The utility of this device has resonated with computer users, and adoption is growing quickly," says Jim Handy, director for the non-volatile memory sector.
Germanys Infineon Technologies and Nanya Technology of Taiwan have signed final contracts for strategic cooperation on standard DRAM memory. The cooperation will share costs for joint DRAM development of advanced 0.09micron and 0.07micron production technologies on 300mm wafers. The companies have also set up a 50-50 joint venture for the production of DRAM chips.
Matsushita Electric Industrial Co and IMEC, Europe’s leading independent microelectronics R&D centre, will collaborate on the development and implementation of high-k gate stacks for (sub)-65nm devices.
Wacker Siltronic’s 300 mm argon annealed wafers have been qualified at one of its customers production sites. Wacker Siltronic achieved the qualification of annealed wafers for a 300 mm volume production line.
SUSS MicroTec announced a key order for its 200mm Mask Aligner from Shipley Company. Shipley a supplier of photoresist to the advanced packaging market, chose SUSS MicroTecs Mask Aligner technology over alternative technologies due to its low cost of ownership and flexibility for processing wafers of different sizes and photo resist thickness.
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Arch Microelectronic Materials has been granted two US patents in the field
of chemical mechanical planarisation (CMP) slurries.
STMicroelectronics has filed a US lawsuit for patent infringement against
Thomson Derwent launched a micro/nano-electro-mechanical systems (MEMS &
NEMS) Industry and Technology Patents profile (ITP) service.
Infineon Technologies reports Q4 revenues at EUR1.38bn, up 28% year-on-year.
Net losses come in at EUR506mn, compared with a EUR523mn loss in 2001.
Aixtrons Q3 sales were EUR35.3mn, compared with EUR69.1 in 2001. Net income
was EUR4.6mn, compared with 2001s EUR10.6mn.
Excimer laser producer Lambda Physik reports sales of EUR98.5mn in the year
ended September 30, 2002.
The US Semiconductor Industry Association has issued its 2002-2005 forecast.
Growth this year of about 1.8% is expected to be followed by 19.8% in 2003
and 21.7% in 2004. In the latter year, sales are expected to surpass the
peak in 2000. In 2005, flat growth is expected leaving the industry with
global sales of $206bn.
DuPont completed acquisition of ChemFirst in a cash merger.
Axsys Technologies has sold substantially all of its fibre automation assets
to Palomar Technologies. Axsys discontinued its Automation Group activities
in Q3 2002.
Palomar Technologies intends to continue to operate the business and support
all ongoing customer relationships.
Daw Technologies has sold all of the assets of its Intelligent Enclosures
business unit to a group of former managers.
Philips Electronics plans phased closure of its Albuquerque fab in New
Mexico at the end of 2003.
Kulicke & Soffa Industries is "exploring options for certain of its non-core
Infineon Technologies launched a Secure Mobile Solutions (SMS) group on
November 1, 2002.
Materials handling system company Entegris is to close a facility making
fluid handling products for the semiconductor industry in California,
shifting production to Minnesota.
NEC Electronics Corporation has officially separated from NEC Corporation,
forming a wholly owned subsidiary.
IBM claims the worlds fastest silicon-based transistor operating at speeds
of 350GHz. The bipolar transistor uses a modified design and IBMs fifth
generation silicon germanium (SiGe) technology. IBMs new transistor
performs nearly 300% faster than todays production devices and is 65%
faster than previously reported silicon transistors.
STMicroelectronics claims that its new Page Flash offers the worlds most
advanced smartcard memory technology.
Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are
developing a smartcard with integrated display.
Philips Electronics is aiming at the market for the industrys highest-speed
Infineon Technologies is pushing "multi-threaded execution"
Texas Instruments has produced a 64Mbit ferroelectric RAM (FRAM) chip
US company SiidTech has signed a joint technology development agreement with
Japans Hitachi ULSI Systems to combine their respective semiconductor
The US Semiconductor Industry Association has issued its 2002-2005 forecast. Growth this year of about 1.8% is expected to be followed by 19.8% in 2003 and 21.7% in 2004. In the latter year, sales are expected to surpass the peak in 2000. In 2005, flat growth is expected, leaving the industry with global sales of $206bn.