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Thursday 21st November 2002
austriamicrosystems announced availability of its 0.35µm SiGe BiCMOS process, which is based on its 0.35µm CMOS mixed-signal base technology licensed from TSMC. The process offers high-speed 70GHz heterojunction bipolar (HBT) transistors. A variety of options include 5V I/O transistors, high precision linear capacitors metal2/metal3 (MIM), poly1/poly2 (PIP) capacitors and resistive poly. The company is aiming at high performance RF applications up to 20Gbit/s.
Thursday 21st November 2002
X-FAB Semiconductor Foundries is offering a new 0.8µm process CX08 for 42V PowerNet automotive applications. Brendan Bold, technology development director, reports: "New elements of our 0.8µm process include NMOS and PMOS transistors with gate-to-drain breakdown voltage of over 80V, allowing operating voltages of up to 60V."
Thursday 21st November 2002
Germany’s Infineon Technologies and Nanya Technology of Taiwan have signed final contracts for strategic cooperation on standard DRAM memory. The cooperation will share costs for joint DRAM development of advanced 0.09µm and 0.07µm production technologies on 300mm wafers. The companies have also set up a 50-50 joint venture for the production of DRAM chips. A new joint 300mm facility will be built in Taiwan. Maximum production capacity will approach 50,000 wafer starts a month once the facility is fully operational. Initial production of the first 300mm wafers in the new facility is expected in late 2003.
Thursday 21st November 2002
Cree and Nichia have entered into a patent cross license agreement, settling litigation between the companies concerning gallium nitride-based optoelectronic technology. The technology is used for next generation high brightness LEDs, laser diodes and LED based lighting.
Thursday 21st November 2002
UK-based fab equipment producer Trikon Technologies reports Q3 revenues down 77% on last year at $4.5mn. Revenues in Q3 2001 were $19.7mn. The Q3 2002 net loss is reported at $7.1mn, compared with a net income of $0.9mn last year.
Thursday 21st November 2002
MEMSCAP launched a one-stop software/service package for design and prototyping of MEMS-based product. Samsung Electronics will integrate Cognexs In-Sight 1700 wafer reader in all of its chip manufacturing plants in Hwasung, South Korea.
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Thursday 21st November 2002
AMD is to reduce its global workforce by 2000 people, representing 15% of its staff. The action is to be completed by the end of Q2 2003. The company wants to reduce its breakeven point and cut costs by $350mn in 2003.
Thursday 21st November 2002
Shipments of USB Flash drives are currently less than 10mn units a year, according to market researcher Semico Research - but by 2006 they will have mushroomed to nearly 50mn units, it is forecast. "The utility of this device has resonated with computer users, and adoption is growing quickly," says Jim Handy, director for the non-volatile memory sector.
Thursday 21st November 2002
X-FAB Semiconductor Foundries is offering a new 0.8micron process CX08 for 42V PowerNet automotive applications
Thursday 21st November 2002
Germanys Infineon Technologies and Nanya Technology of Taiwan have signed final contracts for strategic cooperation on standard DRAM memory. The cooperation will share costs for joint DRAM development of advanced 0.09micron and 0.07micron production technologies on 300mm wafers. The companies have also set up a 50-50 joint venture for the production of DRAM chips.
Wednesday 20th November 2002
Matsushita Electric Industrial Co and IMEC, Europe’s leading independent microelectronics R&D centre, will collaborate on the development and implementation of high-k gate stacks for (sub)-65nm devices.
Wednesday 20th November 2002
Wacker Siltronic’s 300 mm argon annealed wafers have been qualified at one of its customers production sites. Wacker Siltronic achieved the qualification of annealed wafers for a 300 mm volume production line.
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Wednesday 20th November 2002
SUSS MicroTec announced a key order for its 200mm Mask Aligner from Shipley Company. Shipley a supplier of photoresist to the advanced packaging market, chose SUSS MicroTecs Mask Aligner technology over alternative technologies due to its low cost of ownership and flexibility for processing wafers of different sizes and photo resist thickness.
Thursday 14th November 2002
15% discount if you book your newsletter sponsorship for any dates in 2002/3! Newsletter is broadcast weekly every Monday, Details available on request!(email: [email protected])(Tel:+44 (0)1926 512424)What does your Sponsorship include?YOUR companies exclusive banner on the newsletterand news articles also found on our website"200 word article relating to your promotion!(leading article in the newsletter)Banner and article can link to data capture forms and/or pages on your websiteAll year round exposure on the European Semiconductor website
Thursday 14th November 2002
Arch Microelectronic Materials has been granted two US patents in the field of chemical mechanical planarisation (CMP) slurries. STMicroelectronics has filed a US lawsuit for patent infringement against Broadcom. Thomson Derwent launched a micro/nano-electro-mechanical systems (MEMS & NEMS) Industry and Technology Patents profile (ITP) service.
Thursday 14th November 2002
Infineon Technologies reports Q4 revenues at EUR1.38bn, up 28% year-on-year. Net losses come in at EUR506mn, compared with a EUR523mn loss in 2001. Aixtrons Q3 sales were EUR35.3mn, compared with EUR69.1 in 2001. Net income was EUR4.6mn, compared with 2001s EUR10.6mn. Excimer laser producer Lambda Physik reports sales of EUR98.5mn in the year ended September 30, 2002.
Thursday 14th November 2002
The US Semiconductor Industry Association has issued its 2002-2005 forecast. Growth this year of about 1.8% is expected to be followed by 19.8% in 2003 and 21.7% in 2004. In the latter year, sales are expected to surpass the peak in 2000. In 2005, flat growth is expected leaving the industry with global sales of $206bn.
Thursday 14th November 2002
Asymtek has joined the Advanced Packaging & Interconnect Alliance (APiA).
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Thursday 14th November 2002
DuPont completed acquisition of ChemFirst in a cash merger. Axsys Technologies has sold substantially all of its fibre automation assets to Palomar Technologies. Axsys discontinued its Automation Group activities in Q3 2002. Palomar Technologies intends to continue to operate the business and support all ongoing customer relationships. Daw Technologies has sold all of the assets of its Intelligent Enclosures business unit to a group of former managers.
Thursday 14th November 2002
Philips Electronics plans phased closure of its Albuquerque fab in New Mexico at the end of 2003. Kulicke & Soffa Industries is "exploring options for certain of its non-core business units". Infineon Technologies launched a Secure Mobile Solutions (SMS) group on November 1, 2002. Materials handling system company Entegris is to close a facility making fluid handling products for the semiconductor industry in California, shifting production to Minnesota. NEC Electronics Corporation has officially separated from NEC Corporation, forming a wholly owned subsidiary.
Thursday 14th November 2002
IBM claims the worlds fastest silicon-based transistor operating at speeds of 350GHz. The bipolar transistor uses a modified design and IBMs fifth generation silicon germanium (SiGe) technology. IBMs new transistor performs nearly 300% faster than todays production devices and is 65% faster than previously reported silicon transistors.
Thursday 14th November 2002
STMicroelectronics claims that its new Page Flash offers the worlds most advanced smartcard memory technology. Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are developing a smartcard with integrated display. Philips Electronics is aiming at the market for the industrys highest-speed DVD+R/RW (DVD+Recordable/ReWriteable) Infineon Technologies is pushing "multi-threaded execution" Texas Instruments has produced a 64Mbit ferroelectric RAM (FRAM) chip US company SiidTech has signed a joint technology development agreement with Japans Hitachi ULSI Systems to combine their respective semiconductor identification technologies.
Thursday 14th November 2002
Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are developing a smartcard with integrated display. The Swats DisplayCard will use an electrophoretic dotmatrix.
Thursday 14th November 2002
The US Semiconductor Industry Association has issued its 2002-2005 forecast. Growth this year of about 1.8% is expected to be followed by 19.8% in 2003 and 21.7% in 2004. In the latter year, sales are expected to surpass the peak in 2000. In 2005, flat growth is expected, leaving the industry with global sales of $206bn.

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