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Thursday 14th November 2002
Asymtek has joined the Advanced Packaging & Interconnect Alliance (APiA).
Thursday 14th November 2002
DuPont completed acquisition of ChemFirst in a cash merger. Axsys Technologies has sold substantially all of its fibre automation assets to Palomar Technologies. Axsys discontinued its Automation Group activities in Q3 2002. Palomar Technologies intends to continue to operate the business and support all ongoing customer relationships. Daw Technologies has sold all of the assets of its Intelligent Enclosures business unit to a group of former managers.
Thursday 14th November 2002
Philips Electronics plans phased closure of its Albuquerque fab in New Mexico at the end of 2003. Kulicke & Soffa Industries is "exploring options for certain of its non-core business units". Infineon Technologies launched a Secure Mobile Solutions (SMS) group on November 1, 2002. Materials handling system company Entegris is to close a facility making fluid handling products for the semiconductor industry in California, shifting production to Minnesota. NEC Electronics Corporation has officially separated from NEC Corporation, forming a wholly owned subsidiary.
Thursday 14th November 2002
IBM claims the worlds fastest silicon-based transistor operating at speeds of 350GHz. The bipolar transistor uses a modified design and IBMs fifth generation silicon germanium (SiGe) technology. IBMs new transistor performs nearly 300% faster than todays production devices and is 65% faster than previously reported silicon transistors.
Thursday 14th November 2002
STMicroelectronics claims that its new Page Flash offers the worlds most advanced smartcard memory technology. Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are developing a smartcard with integrated display. Philips Electronics is aiming at the market for the industrys highest-speed DVD+R/RW (DVD+Recordable/ReWriteable) Infineon Technologies is pushing "multi-threaded execution" Texas Instruments has produced a 64Mbit ferroelectric RAM (FRAM) chip US company SiidTech has signed a joint technology development agreement with Japans Hitachi ULSI Systems to combine their respective semiconductor identification technologies.
Thursday 14th November 2002
Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are developing a smartcard with integrated display. The Swats DisplayCard will use an electrophoretic dotmatrix.
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Thursday 14th November 2002
The US Semiconductor Industry Association has issued its 2002-2005 forecast. Growth this year of about 1.8% is expected to be followed by 19.8% in 2003 and 21.7% in 2004. In the latter year, sales are expected to surpass the peak in 2000. In 2005, flat growth is expected, leaving the industry with global sales of $206bn.
Thursday 14th November 2002
STMicroelectronics claims that its new Page Flash offers the world’s most advanced smartcard memory technology. Page Flash aims to remove the need for EEPROM (electrically erasable programmable read-only memory) in high memory density smartcard chips.
Thursday 14th November 2002
Power management IC producer National Semiconductor and chipless intellectual property designer ARM want to jointly develop power efficient systems. The aim is to increase battery life in handheld devices in several stages from 25% up to 400%. The first phase of products will increase the efficiency of the digital baseband by 25-75%.
Friday 8th November 2002
STMicroelectronics has filed a US lawsuit for patent infringement against Broadcom.
Friday 8th November 2002
Italian company Elsag has ordered custom designed, infrared light-emitting diode (LED) illuminators from US company StockerYale.
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Friday 8th November 2002
Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are developing a smartcard with integrated display. The Swats DisplayCard will use an electrophoretic dotmatrix display.
Thursday 7th November 2002
IBM claims the worlds fastest silicon-based transistor operating at speeds of 350GHz. The bipolar transistor uses a modified design and IBM’s fifth generation silicon germanium (SiGe) technology. IBMs new transistor performs nearly 300% faster than todays production devices, and is 65% faster than previously reported silicon transistors.
Thursday 7th November 2002
Applied Materials is to reduce its global work force by 1750 people or approximately 11% of its headcount. In August 2002, the company had about 16,000 workers. Employees were being notified starting November 5, 2002.
Thursday 7th November 2002
Philips Electronics says it has become one of the first companies to produce commercial quantities of highly complex system-on-chips (SoCs) using 0.12micron CMOS technology. The SoCs were produced at TSMC and Philips own facilities and feature multiple digital signal processors (DSPs) and almost 9Mbits of on-chip memory.
Thursday 7th November 2002
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Thursday 7th November 2002
STMicroelectronics and Fujitsu have teamed up to develop the ST19ZR01, claimed as the first contactless smartcard IC with ferroelectric memory (FRAM) and ROM, but no standard RAM.
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Thursday 7th November 2002
Fujitsu has stacked six chips in a high-density, large-scale multi-chip package (MCP). The assembly includes three flash, one SRAM, and two Fast Cycle RAM (FCRAM) devices in a single package for cellular phone applications.
Thursday 7th November 2002
European silicon germanium foundry venture Communicant Semiconductor Technologies has received approval from the European Union (EU) for federal and state government subsidies of $363mn in the form of cash grants and government loan guarantees. The subsidies are deemed commensurate with the jobs Communicant will create at its headquarters and manufacturing site in Frankfurt (Oder). Communicant has secured private equity of $325mn in addition to the $363mn in government grants.
Wednesday 6th November 2002
Raw wafer producer Wacker Siltronic has developed a float zone pulling process for 200mm silicon ingots.
Friday 1st November 2002
MEMSCAPs stockholders have approved the acquisition of JDS Uniphase’s Cronos MEMS division.
Friday 1st November 2002
STMicroelectronics has presented a prototype silicon chip for DNA analysis. The micro-electro-mechanical system (MEMS) integrates both DNA amplification and detection on the same chip.
Friday 1st November 2002
Luxell Technologies has sold a Black Layer license agreement to Lite Array. Under the terms of the agreement, Lite Array has acquired a production licence to integrate Luxells proprietary contrast enhancement technology in organic light-emitting diode (OLED) flat panel display products based on small molecule organic electroluminescent diode (SMOLED) technology. Lite Array will pay Luxell technology transfer fees and on-going royalties based on display sales to their customers. No other terms of the agreement were disclosed.

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