Swiss analogue IC producer EM Microelectronic says it is ready to start producing fully depleted silicon-on-insulator (FD SOI) ICs. EM believes that its ICs are the first FD SOIs operating at a guaranteed voltage lower than 0.5V over the whole voltage and temperature range.
Cambridge Display Technology (CDT) has bought UK-based Opsys' business related to the intellectual property (IP), commercialisation and technology development of organic light emitting diode (OLED) displays.
Aixtron says it has demonstrated MOCVD processes for multi-wafer 200mm GaAs
substrates with outstanding performance for the first time ever, Extensive
numerical modeling enabled the existing AIX 2600 G3 reactor to be upscaled
for 200mm use. Substrates from Freiberger Compound Materials were used in
the demonstration. Uniformities at the 1% level are reported across the
entire 200mm wafer. Material quality and homogeneity do not differ from
results obtained on the well established 150mm systems. Already several AIX
2600G3 systems have been installed at customers for the production of SiGe
epi structures, using multiple 200mm substrates.
LSI Logic claims an industry first for copper/low-k processes in wire bond
packaging with it Pad on I/O process. This places bond pads directly on top
of active I/O circuits in a chip design. Pad on I/O was developed for LSI
Logic's Gflx (0.11micron) and G90 (90nm) silicon processes. The Pad on I/O
technology can reduce die areas by up to 50% when compared with standard
wire bond designs.
QinetiQ has launched a new deep reactive ion etch (RIE) silicon service. The
company says the service is the first phase of providing access to a
comprehensive, state-of-the-art silicon micro-electro-mechanical system
(MEMS) design and prototyping facility, under its INTEGRAM programme. Prices
and operational turnaround depend on the complexity and level of
customisation. The Europractice Manufacturing Cluster INTEGRAM (Integrated
Microsystems) programme was launched earlier this year with EUR1.3M of
European Commission funding.
Technologies and Devices (TDI) has demonstrated production of 50mm diameter
GaN templates with p-type electrical conductivity. GaN is the compound
semiconductor material used for the fabrication of blue spectrum (blue,
green, and ultraviolet and white) light emitting diodes (LEDs), laser diodes
(LDs) and high-frequency/high-power transistors. Up to now n-type GaN
material technology has seen progress, but lack of a cost effective thick
p-type material has hampered development and commercial availability of many
types of advanced devices.
Mondiaquartz officially opened its new industrial site at Bernin near
Grenoble, France. Mondiaquartz will use the site to produce products for the
manufacturing of high purity 300mm quartz wafers. The new production unit
has an annual production capacity worth more than EUR20mn in turnover. Among
other applications quartz is used for holding silicon wafers in position in
high-temperature heat treatment operations during diffusion phases.
Deep UV laser producer Cymer is to build a new 24,000m2 manufacturing
facility for high-volume production, including the recently unveiled XL
Series line, as part of a new business strategy. The XL sources use a
dual-gas-discharge-chamber Master Oscillator Power Amplifier (MOPA)
Cambridge Display Technology (CDT) has bought UK-based Opsys' business
related to the intellectual property (IP), commercialisation and technology
development of organic light emitting diode (OLED) displays.
CDT receives ownership of all rights to Opsys' dendrimer OLED technology and
assumes management of the commercial and technical development of Opsys'
business. More than 25 highly-skilled scientists from Opsys have been added
to CDT's staff.
TriQuint Semiconductor is to buy a substantial portion of Agere
Systems'optoelectronics business for $40mn in cash. The transaction includes
products, technology and some facilities. The products include lasers,
detectors, modulators, passive components, arrayed waveguide-based
components, amplifiers, transmitters, receivers, transceivers, transponders,
and MEMS (micro-electro-mechanical systems).
French company Jobin Yvon has agree to buy the ellipsometry business line of
Philips Analytical. The transaction includes metrology tools such as the
table top PZ laser ellipsometer, which Philips had previously acquired from
German company Plasmos. Also in the deal is the PQ Ruby thin film metrology
platform. Jobin Yvon is a member of Japan's Horiba Group.
Israeli metrology company Nova Measuring Instruments is to consolidate its
IM (Integrated Metrology) products into two major product divisions (Thin
Films and Lithography). The workforce has been reduced by 14%. The company
says that all investments in its new Integrated Process Control (IPC)
products and solutions are continuing.
SZ Testsysteme successfully finalised negotiations with its creditors. A
court appointed administrator, Dr Michael Miersch, has a wide range of
powers to continue negotiations with all business partners. As a result of
its reorganisation and recapitalisation efforts, SZ Testsysteme may now
resume production at full capacity, preserving the company and its
Singapore foundry Chartered Semiconductor Manufacturing is reducing its
workforce by 300 people, about 7% of its total headcount. About 60% of those
hit by the cutback will be manufacturing operators in Singapore. About 25
people in the company's operation outside of Singapore will lose their job.
Spending on new equipment is to drop by 10%.
The Silterra Malaysia foundry has purchased additional Brooks-PRI automation
equipment as the result of a planned capacity expansion for its 200mm fab.
This latest order from Silterra is for an expansion of its automated
material handling System (AMHS), that includes wafer stockers, track and
integration services. Brooks-PRI expects to begin equipment and services
delivery in its Q2 2003.
Northrop Grumman's Electronic Systems sector will be using Bede Scientific's
D1 high resolution x-ray diffractometer. The tool will be used at Northrop
Grumann's Advanced Materials and Semiconductor Device Technology Center in
Maryland, USA. This instrument will be used primarily for the
characterisation of GaN-based epitaxial structures for high-speed electronic
devices. The instrument will incorporate Bede's latest version of its
control and data acquisition software - Bede Control 2.
Israeli foundry Tower Semiconductor has ordered $45mn worth of equipment
from Applied Materials. Tower plans to use the equipment for the production
of 0.18micron and 0.13micron CMOS digital logic, mixed signal, flash memory
and image sensor devices in its new Fab 2. The facility is expected to
produce up to 33,000 200mm wafers per month and employ 1100 people.
Tower's order includes multiple PVD (physical vapour deposition), RTP (rapid
thermal processing), etch, HDP-CVD (high-density plasma chemical vapour
deposition), WCVD (tungsten chemical vapour deposition), SACVD
(sub-atmospheric chemical vapour deposition), wafer inspection and defect
International SEMATECH (ISMT) and DuPont Photomasks have combined their
intellectual property for producing test photomasks to be used in
establishing leading edge technology nodes, under a recently signed
Luxell Technologies has sold a Black Layer license agreement to Lite Array.
Under the terms of the agreement, Lite Array has acquired a production
licence to integrate Luxell's proprietary contrast enhancement technology in
organic light-emitting diode (OLED) flat panel display products based on
small molecule organic electroluminescent diode (SMOLED) technology. Lite
Array will pay Luxell technology transfer fees and on-going royalties based
on display sales to their customers. No other terms of the agreement were
Philips Electronics says it has become one of the first companies to produce commercial quantities of highly complex system-on-chips (SoCs) using 0.12micron CMOS technology. The SoCs were produced at TSMC and Philips own facilities and feature multiple digital signal processors (DSPs) and almost 9Mbits of on-chip memory.
Infineon - Dresden 300mm plant are ramping up to produce 20,000 wafers per Month in 2003 from 4,000. They are going to require equipment.
Intel - Lexlip Fab 24 300mm plant tool install restarted for Q3 03 - they will be buying in 1st half of next year $1.6 billion spend.
STM / Philips / Motorola - Crolles 2 in Crolles France will spend between $200m and $400m to produce 4000 wafers per month.
Communicant - Germany Have funding for 200mm fab, will be buying this year.
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Oxford Instruments Plasma Technology (OIPT) announced three sales orders.
The company delivered GaN LED production tools to two Taiwan companies -
Epitech in June 2002 and to ITE Compound Semiconductor in October 2002.
The European Business Team distribution company is to provide product
distribution and service support to Sagitta, manufacturer of an electron
microscope sample preparation system used for semiconductor yield
enhancement, failure analysis, and process development.
South Korean supplier of silicon and epitaxial wafers LG Siltron has ordered
the first BedeScan x-ray topography tool worth $265,000 from Bede plc.
Australian chemical supplier Silex Systems made an initial order for
isotopically pure silicon-28 trichlorosilane from Isonics.