News Article
Capacitive Sensing
X-FAB has released a new technology for inertial sensors from its new micro-electro-mechanical systems (MEMS) surface micromachining process on SOI wafer process generation.
X-FAB has released a new technology for inertial sensors from its new micro-electro-mechanical systems (MEMS) surface micromachining process on SOI wafer process generation.
Application sectors for the XM30 technology include automotive and industrial electronics - acceleration sensors for air bags and rotation-rate sensors for navigation systems. Other opportunities include medical and consumer product technologies.
The technology uses ‘capacitive sensor elements' - free-moving, three-dimensional structures that react to external movements caused by accelerational and rotational forces. These structures are produced using anisotropic and isotropic plasma-silicon etch processes.
Design rules and process specifications are available beginning immediately. X-FAB will begin a regular multi-product wafer service (MPW) in Q2 2003.