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Friday 8th November 2002
STMicroelectronics has filed a US lawsuit for patent infringement against Broadcom.
Friday 8th November 2002
Italian company Elsag has ordered custom designed, infrared light-emitting diode (LED) illuminators from US company StockerYale.
Friday 8th November 2002
Epson Europe Electronics and Swedish Advanced Technology Systems (Swats) are developing a smartcard with integrated display. The Swats DisplayCard will use an electrophoretic dotmatrix display.
Thursday 7th November 2002
IBM claims the worlds fastest silicon-based transistor operating at speeds of 350GHz. The bipolar transistor uses a modified design and IBM’s fifth generation silicon germanium (SiGe) technology. IBMs new transistor performs nearly 300% faster than todays production devices, and is 65% faster than previously reported silicon transistors.
Thursday 7th November 2002
Applied Materials is to reduce its global work force by 1750 people or approximately 11% of its headcount. In August 2002, the company had about 16,000 workers. Employees were being notified starting November 5, 2002.
Thursday 7th November 2002
Philips Electronics says it has become one of the first companies to produce commercial quantities of highly complex system-on-chips (SoCs) using 0.12micron CMOS technology. The SoCs were produced at TSMC and Philips own facilities and feature multiple digital signal processors (DSPs) and almost 9Mbits of on-chip memory.
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Thursday 7th November 2002
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Thursday 7th November 2002
STMicroelectronics and Fujitsu have teamed up to develop the ST19ZR01, claimed as the first contactless smartcard IC with ferroelectric memory (FRAM) and ROM, but no standard RAM.
Thursday 7th November 2002
Fujitsu has stacked six chips in a high-density, large-scale multi-chip package (MCP). The assembly includes three flash, one SRAM, and two Fast Cycle RAM (FCRAM) devices in a single package for cellular phone applications.
Thursday 7th November 2002
European silicon germanium foundry venture Communicant Semiconductor Technologies has received approval from the European Union (EU) for federal and state government subsidies of $363mn in the form of cash grants and government loan guarantees. The subsidies are deemed commensurate with the jobs Communicant will create at its headquarters and manufacturing site in Frankfurt (Oder). Communicant has secured private equity of $325mn in addition to the $363mn in government grants.
Wednesday 6th November 2002
Raw wafer producer Wacker Siltronic has developed a float zone pulling process for 200mm silicon ingots.
Friday 1st November 2002
MEMSCAPs stockholders have approved the acquisition of JDS Uniphase’s Cronos MEMS division.
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Friday 1st November 2002
STMicroelectronics has presented a prototype silicon chip for DNA analysis. The micro-electro-mechanical system (MEMS) integrates both DNA amplification and detection on the same chip.
Friday 1st November 2002
Luxell Technologies has sold a Black Layer license agreement to Lite Array. Under the terms of the agreement, Lite Array has acquired a production licence to integrate Luxells proprietary contrast enhancement technology in organic light-emitting diode (OLED) flat panel display products based on small molecule organic electroluminescent diode (SMOLED) technology. Lite Array will pay Luxell technology transfer fees and on-going royalties based on display sales to their customers. No other terms of the agreement were disclosed.
Wednesday 9th January 2002
Microsystem producer PHS MEMS shareholders have approved a EUR10mn capital increase.
Tuesday 30th November 1999
A UK company has taken advantage of government subsidies to become the first UK manufacturer of solar panels
Tuesday 30th November 1999

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