AMD/IBM Joint Push For Performance
The work will be based on advanced structures and materials such as high-speed silicon-on-insulator (SOI) transistors, copper interconnects and improved low-k dielectrics. The agreement includes collaboration on 65 and 45nm processes.
AMD and chief scientist Bill Siegle reports: “We are set to commence production of our 90nm solutions in Q4 2003, so we are now expanding process-technology development efforts for our next generation of processors targeted at 65nm and below.”
The companies expect first products based on the new 65nm technology to appear in 2005. The development will be supported by AMD and IBM engineers working at IBM's Semiconductor Research and Development Center (SRDC) in East Fishkill, New York. Work is expected to begin by January 30, 2003.
