Nanosys has taken out an exclusive licence for semiconductor nanowire-based
nanolaser technology from the University of California. The research on
which the licence was based was conducted by Dr Peidong Yang, Scientific
Founder of Nanosys.
Motorola's Semiconductor Products Sector (SPS) is to transfer its
all-copper, 0.13micron HiPerMOS7 (HiP7) technology to Tower Semiconductor's
200mm Fab 2 facility, under a transfer and licensing agreement. Motorola
product prototyping by Tower customers could begin on HiP7-based technology
as early as Q1 2003.
Mentor Graphics plans to support the yet unnamed GDSII replacement format in
its Calibre product family and the IC Station tool suite in commercial
release as soon as Q1 2003. GDSII has been used for decades in the
semiconductor industry to transfer physical design data to photomasks. The
new, non-proprietary, interchange file format will be used first on
leading-edge technology nodes - 130nm, 90nm and 65nm.
Mattson Technology and Varian Semiconductor Equipment Associates have
installed equipment for a joint development programme on ultra-shallow
junction and other implant processes. A Mattson 3000 Plus advanced thermal
processing system has been fitted out at Varian Semiconductor's facility in
Tundra Semiconductor has decided to withdraw its Tsi320 part from the market
because of significant costs and time required to fix specific design flaws.
The component is a PCI-X-to-PCI-X bridge. The company is also collaborating
with Intel to develop a high-performance system interconnect for the Intel
A EUR3.5mn research program devoted exclusively to OVPD (organic vapour
phase deposition) technology for organic LED (OLED) display applications has
been granted by the German Ministry of Research and Education to a group of
researchers headed by Aixtron.
The focus of the research will be a
recently purchased UHV STM/SEM (ultra high vacuum scanning tunnelling
microscope combined with a scanning electron microscope and energy
analyser). This tool is one of only six worldwide.
Infineon Technologies has cancelled a shareholder agreement with Mosel
Vitelic on its ProMOS joint venture in Taiwan, effective January 1, 2003.
Infineon says this is due to repeated material breaches of contract by Mosel
Vitelic despite prior warning.
The two-year-old ULM Photonics has
built and developed research, design and manufacturing facilities for
vertical cavity surface emitting lasers (VCSEL).
Dr Karl-Peter Merz of Schott Glas and Schott Optovance reports:
Organic semiconductor developer Nanolayers closed a seed financing round led
by the Millennium Materials Technology Fund. Other investors participating
in this round included Intel Capital and Summit Technology. Financial
details were not disclosed. Nanolayers has an ultra thin film technology
called Molecular Layer Epitaxy (MLE). Initial applications may include
flat-panel displays (TFT-LCD and OLED) and semiconductor ICs.
Asyst Technologies has agreed a deal with a US commercial bank giving it a
$25mn credit facility. This will be combined with current balances of cash
and short-term investments and $20mn the company anticipates receiving for
certain inventory as a result of an outsourcing agreement. In total, the
company will have $120mn available in cash and short-term investments. The
company consumed $2mn in its Q1 ended June 2002 and $5mn in Q2. The company
anticipates its cash consumption will be at most $5-$10mn per quarter going
1st Silicon (Malaysia) has received a new round of financing, totalling
$614mn in equity and credit. The funds give 1st Silicon the capital to buy
manufacturing equipment to bring its manufacturing to capacity levels. Of
the $614mn, $290mn is additional equity raised since January 2002 thus
increasing the company's paid-up share capital from $322mn to $613mn. The
other portion of the company's funding is represented by two credit
facilities amounting to $324mn. The credit facilities are guaranteed by the
QinetiQ has agreed for use of its Microwave and Millimetre-wave IC design
services with TriQuint's GaAs IC foundry service, providing a UK based
turnkey Microwave and Millimetre-wave IC service and design presence.
Customers, while contracting with TriQuint, will have access to, and will be
supported by QinetiQ's Monolithic Microwave Integrated Circuit (MMIC) design
team. TriQuint will then move the design into production, providing wafer
manufacturing and IC test.
STMicroelectronics has upgraded its Open Mobile Alliance participation to
Sponsor Member status, the highest level of commitment. The company has also
joined the board of directors.
The organisation includes more than 200 companies and other bodies. The Open
Mobile Alliance delivers open standards for the mobile phone industry,
fostering interoperability across services, countries, networks and
RF Micro Devices and Jazz Semiconductor, an RF and mixed-signal silicon
wafer foundry, have agreed a strategic relationship for silicon
manufacturing and development.
RF Micro Devices will obtain a guaranteed, lower cost source of supply for
wafers fabricated on Jazz Semiconductor's manufacturing processes. These
include silicon germanium (SiGe), bipolar complementary metal oxide
semiconductor (BiCMOS) and RF CMOS.
AMI Semiconductor (AMIS) has bought Microsemi's Micro Power Products
division. This medical mixed-signal ASIC group is the second acquisition to
be completed by AMIS this year. The first buy was the mixed-signal business
activities of Alcatel Microelectronics.
Germany's Fraunhofer-Institut fur Angewandte Festkorperphysik IAF (Institute
for Applied Solid State Physics) has ordered a GEN200 molecular beam epitaxy
(MBE) system from Veeco-Applied Epi. The systems will be used for indium
phosphide-based microelectronics in a programme sponsored by the Federal
Ministry of Education and Research of the German government.