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Wednesday 1st January 2003
Nanosys has taken out an exclusive licence for semiconductor nanowire-based nanolaser technology from the University of California. The research on which the licence was based was conducted by Dr Peidong Yang, Scientific Founder of Nanosys.
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) is to transfer its all-copper, 0.13micron HiPerMOS7 (HiP7) technology to Tower Semiconductor's 200mm Fab 2 facility, under a transfer and licensing agreement. Motorola product prototyping by Tower customers could begin on HiP7-based technology as early as Q1 2003.
Wednesday 1st January 2003
austriamicrosystems' Full Service Foundry unit announced availability of its BiCMOS process,
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) has included low-power improvements to its silicon germanium carbon (SiGe:C) technology for battery-operated wireless applications.
Wednesday 1st January 2003
Mentor Graphics plans to support the yet unnamed GDSII replacement format in its Calibre product family and the IC Station tool suite in commercial release as soon as Q1 2003. GDSII has been used for decades in the semiconductor industry to transfer physical design data to photomasks. The new, non-proprietary, interchange file format will be used first on leading-edge technology nodes - 130nm, 90nm and 65nm.
Wednesday 1st January 2003
Mattson Technology and Varian Semiconductor Equipment Associates have installed equipment for a joint development programme on ultra-shallow junction and other implant processes. A Mattson 3000 Plus advanced thermal processing system has been fitted out at Varian Semiconductor's facility in Massachusetts.
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Wednesday 1st January 2003
Tundra Semiconductor has decided to withdraw its Tsi320 part from the market because of significant costs and time required to fix specific design flaws. The component is a PCI-X-to-PCI-X bridge. The company is also collaborating with Intel to develop a high-performance system interconnect for the Intel XScale microarchitecture.
Wednesday 1st January 2003
A EUR3.5mn research program devoted exclusively to OVPD (organic vapour phase deposition) technology for organic LED (OLED) display applications has been granted by the German Ministry of Research and Education to a group of researchers headed by Aixtron.
Wednesday 1st January 2003
The focus of the research will be a recently purchased UHV STM/SEM (ultra high vacuum scanning tunnelling microscope combined with a scanning electron microscope and energy analyser). This tool is one of only six worldwide.
Wednesday 1st January 2003
Japanese researchers report
Wednesday 1st January 2003
University of Chicago scientists claim to have produced a pn junction
Wednesday 1st January 2003
Infineon Technologies has cancelled a shareholder agreement with Mosel Vitelic on its ProMOS joint venture in Taiwan, effective January 1, 2003. Infineon says this is due to repeated material breaches of contract by Mosel Vitelic despite prior warning.
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Wednesday 1st January 2003
The two-year-old ULM Photonics has built and developed research, design and manufacturing facilities for vertical cavity surface emitting lasers (VCSEL). Dr Karl-Peter Merz of Schott Glas and Schott Optovance reports:
Wednesday 1st January 2003
Korea's Dongbu Group has completed the purchase of 20mn shares in Anam Semiconductor (ASI) from Amkor Technology at a price of KRW5700/share, for a total consideration of KRW114bn.
Wednesday 1st January 2003
Organic semiconductor developer Nanolayers closed a seed financing round led by the Millennium Materials Technology Fund. Other investors participating in this round included Intel Capital and Summit Technology. Financial details were not disclosed. Nanolayers has an ultra thin film technology called Molecular Layer Epitaxy (MLE). Initial applications may include flat-panel displays (TFT-LCD and OLED) and semiconductor ICs.
Wednesday 1st January 2003
Asyst Technologies has agreed a deal with a US commercial bank giving it a $25mn credit facility. This will be combined with current balances of cash and short-term investments and $20mn the company anticipates receiving for certain inventory as a result of an outsourcing agreement. In total, the company will have $120mn available in cash and short-term investments. The company consumed $2mn in its Q1 ended June 2002 and $5mn in Q2. The company anticipates its cash consumption will be at most $5-$10mn per quarter going forward.
Wednesday 1st January 2003
1st Silicon (Malaysia) has received a new round of financing, totalling $614mn in equity and credit. The funds give 1st Silicon the capital to buy manufacturing equipment to bring its manufacturing to capacity levels. Of the $614mn, $290mn is additional equity raised since January 2002 thus increasing the company's paid-up share capital from $322mn to $613mn. The other portion of the company's funding is represented by two credit facilities amounting to $324mn. The credit facilities are guaranteed by the Malaysian government.
Wednesday 1st January 2003
QinetiQ has agreed for use of its Microwave and Millimetre-wave IC design services with TriQuint's GaAs IC foundry service, providing a UK based turnkey Microwave and Millimetre-wave IC service and design presence. Customers, while contracting with TriQuint, will have access to, and will be supported by QinetiQ's Monolithic Microwave Integrated Circuit (MMIC) design team. TriQuint will then move the design into production, providing wafer manufacturing and IC test.
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Wednesday 1st January 2003
STMicroelectronics has upgraded its Open Mobile Alliance participation to Sponsor Member status, the highest level of commitment. The company has also joined the board of directors. The organisation includes more than 200 companies and other bodies. The Open Mobile Alliance delivers open standards for the mobile phone industry, fostering interoperability across services, countries, networks and terminals.
Wednesday 1st January 2003
RF Micro Devices and Jazz Semiconductor, an RF and mixed-signal silicon wafer foundry, have agreed a strategic relationship for silicon manufacturing and development. RF Micro Devices will obtain a guaranteed, lower cost source of supply for wafers fabricated on Jazz Semiconductor's manufacturing processes. These include silicon germanium (SiGe), bipolar complementary metal oxide semiconductor (BiCMOS) and RF CMOS.
Wednesday 1st January 2003
AMI Semiconductor (AMIS) has bought Microsemi's Micro Power Products division. This medical mixed-signal ASIC group is the second acquisition to be completed by AMIS this year. The first buy was the mixed-signal business activities of Alcatel Microelectronics.
Wednesday 1st January 2003
German company Schott is restructuring Schott Optovance based in Massachusetts. The plan is to sell,
Wednesday 1st January 2003
Brooks-PRI Automation announced further
Wednesday 1st January 2003
Germany's Fraunhofer-Institut fur Angewandte Festkorperphysik IAF (Institute for Applied Solid State Physics) has ordered a GEN200 molecular beam epitaxy (MBE) system from Veeco-Applied Epi. The systems will be used for indium phosphide-based microelectronics in a programme sponsored by the Federal Ministry of Education and Research of the German government.

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