Wednesday 1st January 2003
Thermal processing system producer BTU International will use Cimetrix's
CIM300 and CIMConnect fab communications software in its integrated wafer
bump reflow thermal systems. BTU recently completed total integration of
their tool into a 300mm fab with the inclusion of Cimetrix software in 12
weeks. CIM300 supports the SEMI standards E39, E40, E87, E90 and E94 and can
be used with existing GEM interfaces.
Wednesday 1st January 2003
PHS MEMS is to provide volume manufacturing of Microlab's line of high
performance RF MEMS switches (MagLatch). Microlab has been using its own
pilot fabrication line to develop products and produce samples.
Wednesday 1st January 2003
Toshiba's System LSI division has bought multiple Integra FLEX test systems
from Terdayne. Toshiba will use the Universal Slot architecture of the
Integra FLEX to configure device test coverage for a wide range of low-cost,
high-volume devices including mixed signal LSIs.
Wednesday 1st January 2003
XinTec of Taiwan has ordered a full production line from EV Group (EVG),
including an EVG 640 200mm production mask aligner and an EVG 150 automated
resist coating system for advanced wafer level chip scale packaging (CSP).
XinTec is an exclusive joint venture partner of Shellcase in the
Asia-Pacific region, offering wafer-level CSP technology and service in
Taiwan. This EVG order represents follow-on business.
Wednesday 1st January 2003
University of South Florida's (USF) MicroElectroMechanical Systems (MEMS)
and Nanotechnology centre has bought Intelligent Micro Patterning's SF-100
maskless photolithography system. This uses a
Wednesday 1st January 2003
MEMC Electronic Materials has responded to a comment in the Wall Street
Journal by saying that it has not filed for bankruptcy protection. In Q2
2002, the company reported net income available to common stockholders of
$6.0mn, after cumulative preferred stock dividends
Wednesday 1st January 2003
March 9-12, 2003, Santa Fe, NM, USA.
Wednesday 1st January 2003
October 28-29, 2002,
Grenoble, France.
Wednesday 1st January 2003
Analog Devices (ADI) claims the world’s first MEMS-based gyroscope. The company says that it is the first commercially available device to integrate both an angular rate sensor and signal processing electronics onto a single piece of silicon.
Wednesday 1st January 2003
Nanosys has taken out an exclusive licence for semiconductor nanowire-based nanolaser technology from the University of California. The research on which the licence was based was conducted by Dr Peidong Yang, Scientific Founder of Nanosys. The lasers were developed by growing zinc oxide (ZnO2) nanowires on sapphire substrates (Science, June 8, 2001). The nanowires form laser cavities with diameters varying between 20-150nm and lengths up to 10microns. In the Science paper, optical excitation resulted in surface emission of laser light with a wavelength of 385nm and a linewidth less than 0.3nm.
Wednesday 1st January 2003
Philips Electronics and Fairchild Semiconductor have formed a working
relationship to become a multi-source supplier for small-scale logic
packaging.
Wednesday 1st January 2003
Soitec is expanding its R&D partnership with the Laboratoire d'Electronique
de Technologies et d'Instrumentation (LETI) in Grenoble, France
Wednesday 1st January 2003
Motorola has produced a single-chip assisted global positioning system
(A-GPS) receiver small enough to fit into a wristwatch called Motorola
Instant GPS. The chip was produced on IBM's 0.25micron silicon germanium
(SiGe) technology. The companies worked together to integrate IBM's
technology to optimise the design. IBM plans to manufacture the new GPS
chips for Motorola.
Wednesday 1st January 2003
SZ Testsysteme's managing board has filed for bankruptcy. Negotiations with banks have not led to a satisfactory outcome with regard to a sufficient financing framework despite far-reaching agreements with key suppliers and the company's employees.
Wednesday 1st January 2003
Hitachi and Mitsubishi Electric have reached a basic agreement to establish
a new semiconductor company, Renesas Technology, that will focus on system
LSI operations. The new company will be established on April 1, 2003. This
agreement is a result of discussions to integrate system LSI businesses
agreed on March 18, 2002.
Wednesday 1st January 2003
Elpida Memory and Mitsubishi Electric have reached the basic agreement to
start discussing the integration of Mitsubishi Electric's DRAM operations
with Elpida. The agreement is expected to be reached by the end of this
year, with the goal of integrating the DRAM business by April 2003.
In addition, this agreement will allow Elpida Memory to form a new alliance
with Powerchip Semiconductor. Powerchip would serve as a foundry for
Elpida's DRAM production.
Wednesday 1st January 2003
Analog Devices (ADI) claims the world's first MEMS-based gyroscope. The
company says that it is the first commercially available device to integrate
both an angular rate sensor and signal processing electronics onto a single
piece of silicon. This integration allows the iMEMS ADXRS gyro to be
smaller, more accurate, more reliable, and more economical than other
angular rate sensors in its class, says ADI.
Wednesday 1st January 2003
Nanosys has taken out an exclusive licence for semiconductor nanowire-based
nanolaser technology from the University of California. The research on
which the licence was based was conducted by Dr Peidong Yang, Scientific
Founder of Nanosys.
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) is to transfer its
all-copper, 0.13micron HiPerMOS7 (HiP7) technology to Tower Semiconductor's
200mm Fab 2 facility, under a transfer and licensing agreement. Motorola
product prototyping by Tower customers could begin on HiP7-based technology
as early as Q1 2003.
Wednesday 1st January 2003
austriamicrosystems' Full Service Foundry unit announced availability of its
BiCMOS process,
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) has included low-power
improvements to its silicon germanium carbon (SiGe:C) technology for
battery-operated wireless applications.
Wednesday 1st January 2003
Mentor Graphics plans to support the yet unnamed GDSII replacement format in
its Calibre product family and the IC Station tool suite in commercial
release as soon as Q1 2003. GDSII has been used for decades in the
semiconductor industry to transfer physical design data to photomasks. The
new, non-proprietary, interchange file format will be used first on
leading-edge technology nodes - 130nm, 90nm and 65nm.
Wednesday 1st January 2003
Mattson Technology and Varian Semiconductor Equipment Associates have
installed equipment for a joint development programme on ultra-shallow
junction and other implant processes. A Mattson 3000 Plus advanced thermal
processing system has been fitted out at Varian Semiconductor's facility in
Massachusetts.
Wednesday 1st January 2003
Tundra Semiconductor has decided to withdraw its Tsi320 part from the market
because of significant costs and time required to fix specific design flaws.
The component is a PCI-X-to-PCI-X bridge. The company is also collaborating
with Intel to develop a high-performance system interconnect for the Intel
XScale microarchitecture.
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