Germany's Fraunhofer-Institut fur Angewandte Festkorperphysik IAF (Institute
for Applied Solid State Physics) has ordered a GEN200 molecular beam epitaxy
(MBE) system from Veeco-Applied Epi. The systems will be used for indium
phosphide-based microelectronics in a programme sponsored by the Federal
Ministry of Education and Research of the German government.
OMM has been awarded four US patents for micro-electro-mechanical system
(MEMS) photonic switching technology (Nos.6,445,841, 6,445,840, 6,449,406,
6,453,083). The patents cover micro-machined optical switching devices,
matrix switches and collimator designs for two-dimensional (2-D) MEMS
IQE and Rockwell Automation have settled a legal dispute relating to MOCVD
process patents held by Rockwell Automation.
The patents were part of a licensing agreement between the companies during
the period October 1991 to January 2000.
In-Stat/MDR reports that some 60 micro-electro-mechanical system (MEMS)
fabs/foundries are operating with several hundred start-ups also coming into
the industry (many of which have their own in-house prototyping and/or
fabrication facilities). Countless universities and government labs
worldwide research MEMS technology.
World chip increases of 14% year-on-year in August 2002, is again fuelled by
a 38.4% increase in Asia Pacific. Total sales in August 2002 are reported at
$11.93bn, according to the World Semiconductor Trade Statistics (WSTS). Asia
Pacific's share was $4.38bn. The US market declined 0.8% to $2.58bn. Europe
and Japan showed modest increases of 4.9% and 7.1% to $2.21bn and $2.75bn,
IMEC is setting up a 300mm silicon research platform initiative. The aim is to perform advanced process research at least two generations ahead of manufacturing. IMEC’s local Flemish government will provide funding of EUR37.18mn for the construction of the cleanroom.
The goal of the research platform is to demonstrate novel device architectures and to perform research on process steps and modules. It will be built around the world’s most advanced lithography clusters such as 157nm and extreme ultraviolet (EUV).
The new fab will be located next to current IMEC facilities. Strategic long-term partnerships with a core set of equipment suppliers and major IC manufacturers will be set up to carry the investments.
This new lab will also allow the freeing up of space in the current 200mm cleanroom for research into a broad range of nanotechnology domains.
Bookham Technology has agreed to acquire the Optical Transmitter and Receiver and Optical Amplifier businesses of Nortel Networks. As part of the combination, Nortel Networks has also agreed to enter into a $120mn supply agreement with Bookham.
Motorola’s Semiconductor Products Sector (SPS) is to transfer its all-copper, 0.13µm HiPerMOS7 (HiP7) technology to Tower Semiconductor’s 200mm Fab 2 facility, under a transfer and licensing agreement. Motorola product prototyping by Tower customers could begin on HiP7-based technology as early as Q1 2003.
Tower intends to use HiP7 as the 0.13µm technology platform for its analogue, digital and mixed-signal processes, as well as for its proprietary CMOS Image Sensor and microFLASH technologies. The transfer of HiP7-based technology to Fab 2 is due for completion in Q4 2003.
Austriamicrosystems’ Full Service Foundry unit announced availability of its BiCMOS process, which is based on a 0.35µm CMOS mixed-signal base technology licensed from Taiwan Semiconductor Manufacturing (TSMC). The 3.3V RF process offers high-speed npn-transistors with an fmax of more than 35GHz, as well as CMOS transistors with the option of 5V I/Os.
IMEC is setting up a 300mm silicon research platform initiative. The aim is to perform advanced process research at least two generations ahead of manufacturing. IMEC’s local Flemish government will provide funding of EUR37.18mn for the cleanroom construction.
STMicroelectronics’ first 0.13µm Flash memories are being supplied in engineering sample quantities. Ramp to volume will begin in Q4, 2002. The devices were developed at ST’s Center of Excellence for Non Volatile Memories in Agrate, Italy.
Wacker has decided on a new production location for 300mm silicon wafers - Freiberg, Germany. From August 2004, the initial capacity will be 60,000 wafers per month. This could ultimately increase to 150,000 per month.
Philips Electronics is to dissolve its Components division. Telecom speaker activity will be combined with Mobile Display Systems (MDS) and moved to Philips Semiconductors, offering a single source for the telecom and PDA markets.
Bookham Technology has agreed to acquire the Optical Transmitter and Receiver and Optical Amplifier businesses of Nortel Networks. As part of the combination, Nortel Networks has also agreed to enter into a $120mn supply agreement with Bookham. Approval of the deal by Bookham’s shareholders is need at an extraordinary general meeting to be held on November 5, 2002.
Cambridge Display Technology (CDT) and Luxell Technologies are in dispute over a license agreement. Luxell is seeking damages in excess of $25mn for breach of contract. CDT failed to make a scheduled payment, it is claimed.
Aneric is to be exclusive distributor in Asia for German company iCADA, a producer of reticle management solutions. Aneric has already supported the first installation of an iCADA system in December 1999 at a Singaporean customer.
JSR Micro is to officially open its new manufacturing plant in Leuven, Belgium, on the November 20, 2002. The plant will focus on the production of advanced deep ultraviolet (DUV) photoresists and developers.
IMEC is setting up a 300mm silicon research platform initiative. The aim is
to perform advanced process research at least two generations ahead of
manufacturing. IMEC's local Flemish government will provide funding of
EUR37.18mn for the cleanroom construction.