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Wednesday 1st January 2003
A EUR3.5mn research program devoted exclusively to OVPD (Organic Vapor Phase Deposition) technology for organic LED (OLED) display applications has been granted by the German Ministry of Research and Education to a group of researchers headed by Aixtron.
Wednesday 1st January 2003
Lambda Physik is to invest up to EUR5mn until 2004 in the development of 157nm laser technology for microlithography. Up to 38% of the development and research expenses for the European 157nm microlithography consortion will come from the German Federal Ministry of Education and Research (BMBF).
Wednesday 1st January 2003
Philips Electronics and Fairchild Semiconductor have formed a working relationship to become a multi-source supplier for small-scale logic packaging.
Wednesday 1st January 2003
STMicroelectronics has two new tiny packages in its portfolio - the MSOP8 (meeting the TSSOP8 3x3mm JEDEC standard) and the 5x3mm MLP8 (VFQFPN8 JEDEC standard).
Wednesday 1st January 2003
Amkor Technology is expanding its MicroLeadFrame capacity to more than 75mn units/month by Q4, 2002. When introduced in 1999, the packages production reached a 1mn units/week three months after qualification.
Wednesday 1st January 2003
Soitec is expanding its R&D partnership with the Laboratoire d'Electronique de Technologies et d'Instrumentation (LETI) in Grenoble, France.
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Wednesday 1st January 2003
Motorola has produced a single-chip assisted global positioning system (A-GPS) receiver small enough to fit into a wristwatch
Wednesday 1st January 2003
Lambda Physik is to invest up to EUR5mn until 2004 in the development of 157nm laser technology for microlithography. Up to 38% of the development and research expenses for the European 157nm microlithography consortion will come from the German Federal Ministry of Education and Research (BMBF).
Wednesday 1st January 2003
A EUR3.5mn research program devoted exclusively to OVPD (Organic Vapor Phase Deposition) technology for organic LED (OLED) display applications has been granted by the German Ministry of Research and Education to a group of researchers headed by Aixtron.
Wednesday 1st January 2003
The Fabless Semiconductor Association (FSA) and JEDEC have produced a Foundry Process Qualification Guideline. The standard is the work of the FSA Foundry Process Qualification Subcommittee and the JEDEC JC-14.2 Wafer Level Reliability Committee.
Wednesday 1st January 2003
Isonics has established a thick-film silicon-on-insulator (SOI) wafer fabrication facility in Washington state.
Wednesday 1st January 2003
Silicon-on-insulator design specialist SOISIC (Silicon on Insulator Systems and Integrated Circuits) has produced CMOS/SOI-Xpert, claimed as the first commercially available characterisation product integrating all SOI structures.
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Wednesday 1st January 2003
Device power rated at 30W and 60W have been released to production with 85W and 125W parts are targeted for released in October. Spectrian is currently in the process of completing system evaluation of these devices.
Wednesday 1st January 2003
An independent committee investigating the validity of certain Bell Labs research concludes that one member of its research staff - Jan Hendrick Schoen - had engaged in scientific misconduct by falsifying and fabricating experimental data between 1998 and 2001 (Bulletin 434, May 27, 2002).
Wednesday 1st January 2003
With $1.9mn in funding from Asian investors, MEMSIC will use the initial investment to expand its manufacturing capacity in anticipation of rapid expansion.
Wednesday 1st January 2003
The peak worth of the market was EUR234.25bn in March 2000. The current valuation is around EUR12.6bn.
Wednesday 1st January 2003
Rudolph Technologies has completed an all-cash acquisition of ISOA, a defect control company, for approximately $24.2mn.
Wednesday 1st January 2003
Mitsubishi Electric is reported to be in merger talks that could result in its DRAM operation being put into the Elpida joint venture between NEC and Hitachi. Mitsubishi is also talking with other IC producers.
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Wednesday 1st January 2003
Varian Semiconductor Equipment Associates has taken further actions to restructure its business and reduce costs. Included in the company's actions is a reduction of its worldwide workforce by 15% to 1370 people.
Wednesday 1st January 2003
Axcelis Technologies announced additional workforce reductions, affecting 155 positions worldwide - 7% of the employee base. Axcelis estimates that these actions will save the company $12mn annually. The company is also implementing supply chain initiatives for an additional $10mn annual saving. With the addition of this recent action, Axcelis has eliminated 473 jobs bringing its worldwide total employment to 1825 people, down 21% since the peak of the last cycle.
Wednesday 1st January 2003
Rodel has joined the SiLKnet Alliance data network to develop chemical mechanical planarisation (CMP) processes and consumables that are compatible with Dow Chemical's SiLK low-k dielectric resin.
Wednesday 1st January 2003
Advantest has teamed up with design-for-test (DFT) technology company SynTest Technologies to deliver fast, accurate failure diagnostics for deep-submicron, high-speed system-on-chip (SoC) designs.
Wednesday 1st January 2003
ChipPAC and Advanced Semiconductor Manufacturing (ASMC), an analogue, power and smartcard wafer foundry in Shanghai, China, will provide customers with end-to-end solutions from wafer fab to wafer sort, packaging, final test and distribution in China, as well as to the global market.
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) is to transfer its all-copper, 0.13micron HiPerMOS7 (HiP7) technology to Tower Semiconductor's 200mm Fab 2 facility, under a transfer and licensing agreement

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