Wednesday 1st January 2003
Cosmetic company L’Oreal has turned to STMicroelectronics to help develop its “next-generation” in skin care. A L’Oreal research project is using ST’s TouchChip silicon image sensor technology to develop methods to provide hydration analysis of human skin.
Wednesday 1st January 2003
Itemic AG have expanded out to the USA, itemic AG became itemic Corp as of October 2002.
Wednesday 1st January 2003
Itemic AG Europe’s fast growing APC lithography specialist expands into the USA.
Wednesday 1st January 2003
John Wiley & Sons are pleased to announce our partnership with European Semiconductor website, bringing you information and exclusive offers on the latest titles in Electrical Engineering.
We would like to offer you the chance to purchase any of the following titles at 15% off. To take advantage of this exclusive offer, simply choose your title, enter code BEX in the discount information field in the shopping cart and click submit to apply your discount.
Wednesday 1st January 2003
At their recent visit to the Semitool facility in Cambridge, UK, the board of directors and members of JEMI UK Ltd celebrated the organisations 10th anniversary. At a ceremony organised for the occasion Chris Walker JEMI UK’s current Chairman commented “The organisation has gone a long way since its inception 10 years ago and we should acknowledge the support which we have received by companies who have supported us along the way
Wednesday 1st January 2003
John Wiley & Sons are pleased to announce our partnership with European Semiconductor website, bringing you information and exclusive offers on the latest titles in Electrical Engineering.
We would like to offer you the chance to purchase any of the following titles at 15% off. To take advantage of this exclusive offer, simply choose your title, enter code BEX in the discount information field in the shopping cart and click submit to apply your discount.
To find out how to take advantage of the offer read more by clicking on the article title...
Wednesday 1st January 2003
A “Standard for Rechargeable Batteries for Portable Computers” is being developed under the auspices of the US Institute of Electrical and Electronics Engineers (IEEE).
Wednesday 1st January 2003
Kopin claims record performance results for its advanced GAIN-HBT transistor wafers. The HBT transistors consist of an InGaP emitter layer and a GaAs collector layer, while the base layer is composed of four elements: Ga, As, In, and N. These devices enable lower voltage operation, higher DC and RF gain, and improved temperature stability compared to standard InGaP and AlGaAs HBTs.
Wednesday 1st January 2003
Corning IntelliSense has been awarded a $2mn grant from the US Department of Commerce's Advanced Technology Program (ATP) to develop embedded digital interface and control circuits for micro-electro-mechanical systems (MEMS). The two-year programme will be funded with a total of $5.6mn.
Wednesday 1st January 2003
RF Micro Devices has agreed to buy Resonext Communications, a supplier of CMOS WLAN solutions for 802.11a and multi-band (802.11a/b/g) wireless networking platforms.
Wednesday 1st January 2003
Cambridge Display Technology (CDT) and Luxell Technologies are in dispute over a license agreement. Luxell is seeking damages in excess of $25mn for breach of contract. CDT failed to make a scheduled payment, it is claimed.
CDT signed an exclusive license agreement in November 2001 for Luxell's Black Layer technology for the global light emitting polymer (LEP) market (Bulletin 407, November 5, 2001), following earlier evaluation (Bulletin 383, May 21, 2001).
Wednesday 1st January 2003
In-Stat/MDR is looking to 18.1% growth in the world semiconductor market next year, according to reports on the Silicon Strategies web site. The 2002 increase is expected to be a marginal 0.1% to $139.1bn. The 2004 growth rate is forecast at 35% to $214.3bn with the 2005 market reaching $242.2bn.
In May, In-Stat/MDR was expecting the market to decline 4-5% this year leading in to a 30.7% increase in 2003.
Wednesday 1st January 2003
Intel reports Q3 revenues at $6.5bn, comparable with last year's figure. Net income was $686mn, a 547% increase on 2001. The company expects Q4 revenues in the range $6.5-6.9bn.
The other main PC processor maker AMD reports sales of $508mn in the quarter to September 29. Net losses were $254mn. The sales were 34% down on last year. Net losses in Q3 2001 were $187mn.
AMD says that its Q3 sales were adversely impacted by measures taken to align its supply chain for PC products to customer demand.
Wednesday 1st January 2003
Tokyo Electron (TEL) announced today the opening of a new Applications Centre devoted to test systems, based at the existing and enlarged facilities in Meylan, France.
Wednesday 1st January 2003
A new organic-thin film transistor (organic-TFT) technology on plastic substrates is to be developed as part of a federal US sponsored R&D initiative. The companies involved in the three-year National Institute of Standards and Technology's (NIST) Advanced Technology Program are DuPont and Sarnoff. Lucent Technologies' Bell Labs will be subcontracted to develop a new class of organic-TFT materials and design processes. Organic-TFTs could be used to produce full-colour polymer-based active matrix OLED (AM-OLED) displays.
Wednesday 1st January 2003
STMicroelectronics and Fujitsu have teamed up to develop the ST19ZR01, claimed as the first contactless smartcard IC with ferroelectric memory (FRAM) and ROM, but no standard RAM. The demonstrator product includes an on-board library of certified cryptographic algorithms. ST will market the technology from Q4 2002.
Wednesday 1st January 2003
STMicroelectronics says it has a ground-breaking technology that allows silicon-based light emitters to match the efficiency of traditional compound semiconductor materials such as gallium arsenide (GaAs). While silicon is an ideal material for building electronic circuits, it has an
Wednesday 1st January 2003
Swiss analogue IC producer EM Microelectronic says it is ready to start producing fully depleted silicon-on-insulator (FD SOI) ICs. EM believes that its ICs are the first FD SOIs operating at a guaranteed voltage lower than 0.5V over the whole voltage and temperature range.
Wednesday 1st January 2003
Cambridge Display Technology (CDT) has bought UK-based Opsys' business related to the intellectual property (IP), commercialisation and technology development of organic light emitting diode (OLED) displays.
Wednesday 1st January 2003
Aixtron says it has demonstrated MOCVD processes for multi-wafer 200mm GaAs
substrates with outstanding performance for the first time ever, Extensive
numerical modeling enabled the existing AIX 2600 G3 reactor to be upscaled
for 200mm use. Substrates from Freiberger Compound Materials were used in
the demonstration. Uniformities at the 1% level are reported across the
entire 200mm wafer. Material quality and homogeneity do not differ from
results obtained on the well established 150mm systems. Already several AIX
2600G3 systems have been installed at customers for the production of SiGe
epi structures, using multiple 200mm substrates.
Wednesday 1st January 2003
LSI Logic claims an industry first for copper/low-k processes in wire bond
packaging with it Pad on I/O process. This places bond pads directly on top
of active I/O circuits in a chip design. Pad on I/O was developed for LSI
Logic's Gflx (0.11micron) and G90 (90nm) silicon processes. The Pad on I/O
technology can reduce die areas by up to 50% when compared with standard
wire bond designs.
Wednesday 1st January 2003
QinetiQ has launched a new deep reactive ion etch (RIE) silicon service. The
company says the service is the first phase of providing access to a
comprehensive, state-of-the-art silicon micro-electro-mechanical system
(MEMS) design and prototyping facility, under its INTEGRAM programme. Prices
and operational turnaround depend on the complexity and level of
customisation. The Europractice Manufacturing Cluster INTEGRAM (Integrated
Microsystems) programme was launched earlier this year with EUR1.3M of
European Commission funding.
Wednesday 1st January 2003
Applied Nanotech (ANI) is to deliver a Phase II Small Business Innovation
Research programme on a
Wednesday 1st January 2003
Technologies and Devices (TDI) has demonstrated production of 50mm diameter
GaN templates with p-type electrical conductivity. GaN is the compound
semiconductor material used for the fabrication of blue spectrum (blue,
green, and ultraviolet and white) light emitting diodes (LEDs), laser diodes
(LDs) and high-frequency/high-power transistors. Up to now n-type GaN
material technology has seen progress, but lack of a cost effective thick
p-type material has hampered development and commercial availability of many
types of advanced devices.
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