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Multi- Vs. System-chip

Semico Research believes that for many applications multi-chip system-in-packages (SiPs) will be preferred over system-on-chips (SoCs). The market researcher predicts that SiP contract packaging revenue will increase from $82.0mn in 2002 to $747.9bn in 2007, a compound annual growth rate (CAGR) of 55.6%
(SiPs) will be preferred over system-on-chips (SoCs). The market researcher predicts that SiP contract packaging revenue will increase from $82.0mn in 2002 to $747.9bn in 2007, a compound annual growth rate (CAGR) of 55.6%.


Although it is now possible to integrate some systems onto an SoC, there are many problems in combining different process technologies, isolating noise generated by RF or analogue sections, high non-recurring engineering (NRE) costs, a long time to market and so on.


SiPs are being used extensively in applications such as cell phones, Bluetooth modules, 802.11 modules, CMOS image sensors, computer graphics and network packet switching. In the future, there is a very large potential for SiPs in embedded micrologic applications. Some companies are already offering combinations of a microcontroller chip and memory chips in one package. SiPs can combine a micrologic chip, one or more memory chips, analogue chips and other components in one package with Semico Research believes that for many applications multi-chip system-in-packages NRE costs that are insignificant compared with ASICs (application specific integrated circuit) or SoCs.
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