Tessera is claiming the world’s first chip-scale packaging technology for integrated radio frequency (RF) module production with its Pyxis platform. The technology builds upon Tessera’s microBGA package while integrating various other features such as flip-chip, integrated passives in silicon and on polyimide, as well as novel electromagnetic interference (EMI) shielding. Along with a new licence, Tessera is offering a full suite of RF services, design tools and libraries.

Tessera is claiming the world's first chip-scale packaging technology for integrated radio frequency (RF) module production with its Pyxis platform. The technology builds upon Tessera's microBGA package while integrating various other features such as flip-chip, integrated passives in silicon and on polyimide, as well as novel electromagnetic interference (EMI) shielding. Along with a new licence, Tessera is offering a full suite of RF services, design tools and libraries.


The platform is designed to support and integrate a multitude of functions such as power amplifiers, transceivers, filters and switches. The first implementation of the technology family - the Pyxis Power Amplifier (PA) platform - integrates tri-band GSM/GPRS power amplifiers with surrounding passive components. By suppressing the need for expensive gallium arsenide (GaAs) thermal vias and integrating inductors on low-cost polyimide tape and capacitors on a low-grade silicon chip, the Pyxis PA delivers significant size and cost advantages. When compared with competitive alternatives, such as ceramic and laminate modules, the platform is claimed to provide 50% cost, 60% height, and 75% area reductions.


Pyxis is aimed at handset makers for new revenue-generating features- such as MP3, GPS, Wi-Fi and digital imaging. Licences are available today. Production ramp-up technology, design kits/libraries and associated assembly line support services will be widely available for transfer in mid-2003.