New tools and processes designed to enable next generation MEMS development.

To meet the need for advanced micro
electromechanical systems (MEMS) tools, SVTC Technologies, a
semiconductor process development foundry, announced that it has
expanded its capabilities to enable customers to move toward the next
generation of MEMS processing.



In particular, new equipment from Lam
Research Corp. and SUSS MicroTec is adding deep silicon etch, wafer
bonding, proximity alignment and additional microlithography
capabilities at SVTC's facilities. Most MEMS developers still use 5
inch and 6 inch operational fabs, which lack compatibility with
advanced CMOS processing equipment and foundries. SVTC offers the
latest 200mm (8 inch) CMOS fab tools and processes, making its
facilities a valuable R&D asset for MEMS developers.



“MEMS developers are looking for the
ability to explore new processes using new materials, and we are
committed to supporting the continued advancement of new MEMS
structures,” said Dave Bergeron, CEO of SVTC Technologies. “While
it might be obvious that smaller MEMS developers would appreciate a
facility like SVTC's to develop their leading edge processes and
materials, large companies also come here to take advantage of our
specialized MEMS equipment for tasks such as pathfinding, product
validation and pilot production.”



“SVTC offers its customers an
innovative, cost effective, real time environment to accelerate the
transfer of MEMS and other emerging technologies from R&D to high
volume production,” said Steve Lassig, Senior Product Marketing
Manager of Lam Research. “Lam Research is a leading supplier of
high volume, deep silicon etch tools, which are crucial for the
rapidly growing MEMS market. By including our TCP 9400DSiE system in
their facilities, SVTC is ideally positioned to spur 200mm wafer MEMS
development efforts.”



“SVTC is providing an increasingly
sophisticated environment for MEMS development, as evidenced by our
becoming a more integral part of SVTC's MEMS activities,” said
Stephen Kay, president, North American Sales and Customer Support,
for SUSS MicroTec. “Achieving the next generation of MEMS products
requires tool sets that are difficult to justify for MEMS developers,
during initial prototyping and preproduction. We believe that SVTC
will be a crucial enabler of the next wave of important MEMS
development on 200mm wafers and we are excited to lend our expertise
in the area of MEMS development and manufacturing to this effort.”



These new additions enhance SVTC's
existing ability to support MEMS development activities. For example,
equipment from Aviza, Vesta, Applied Materials and others enables
SVTC to offer processes, tools and capabilities including: Atomic
layer deposition (ALD), including for new materials such as aluminum
oxide (Al2O3), silicon germanium (SiGe), amorphous silicon (a-Si),
amorphous carbon (a-C), and metals such as nickel (Ni) and copper
(Cu); Low-temperature SiGe; MEMS masks and the ability to integrate
MEMS structures on top of CMOS wafers.