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Wednesday 1st January 2003
Axcelis Technologies announced additional workforce reductions, affecting 155 positions worldwide - 7% of the employee base. Axcelis estimates that these actions will save the company $12mn annually. The company is also implementing supply chain initiatives for an additional $10mn annual saving. With the addition of this recent action, Axcelis has eliminated 473 jobs bringing its worldwide total employment to 1825 people, down 21% since the peak of the last cycle.
Wednesday 1st January 2003
Rodel has joined the SiLKnet Alliance data network to develop chemical mechanical planarisation (CMP) processes and consumables that are compatible with Dow Chemical's SiLK low-k dielectric resin.
Wednesday 1st January 2003
Advantest has teamed up with design-for-test (DFT) technology company SynTest Technologies to deliver fast, accurate failure diagnostics for deep-submicron, high-speed system-on-chip (SoC) designs.
Wednesday 1st January 2003
ChipPAC and Advanced Semiconductor Manufacturing (ASMC), an analogue, power and smartcard wafer foundry in Shanghai, China, will provide customers with end-to-end solutions from wafer fab to wafer sort, packaging, final test and distribution in China, as well as to the global market.
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) is to transfer its all-copper, 0.13micron HiPerMOS7 (HiP7) technology to Tower Semiconductor's 200mm Fab 2 facility, under a transfer and licensing agreement
Wednesday 1st January 2003
Taiwan foundry TSMC is expected to share technology information with Barcelona to support the development of analogue IP. The resulting parts will be based on TSMC's Nexsys 90nm process technology.
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Wednesday 1st January 2003
SI Diamond Technology subsidiary Applied Nanotech has been issued two patents covering its HyFED (Hybrid Field Emission Display) concept (Nos.6,411,020,
Wednesday 1st January 2003
Brooks-PRI Automation says that a leading European semiconductor manufacturer has ordered its integrated Computer Integrated Manufacturing (CIM) software for a 300mm fab in Europe. The IC producer has also selected Brooks-PRI as its standard for CIM systems for all its future 300mm fabs.
Wednesday 1st January 2003
Thermal processing system producer BTU International will use Cimetrix's CIM300 and CIMConnect fab communications software in its integrated wafer bump reflow thermal systems. BTU recently completed total integration of their tool into a 300mm fab with the inclusion of Cimetrix software in 12 weeks. CIM300 supports the SEMI standards E39, E40, E87, E90 and E94 and can be used with existing GEM interfaces.
Wednesday 1st January 2003
PHS MEMS is to provide volume manufacturing of Microlab's line of high performance RF MEMS switches (MagLatch). Microlab has been using its own pilot fabrication line to develop products and produce samples.
Wednesday 1st January 2003
Toshiba's System LSI division has bought multiple Integra FLEX test systems from Terdayne. Toshiba will use the Universal Slot architecture of the Integra FLEX to configure device test coverage for a wide range of low-cost, high-volume devices including mixed signal LSIs.
Wednesday 1st January 2003
XinTec of Taiwan has ordered a full production line from EV Group (EVG), including an EVG 640 200mm production mask aligner and an EVG 150 automated resist coating system for advanced wafer level chip scale packaging (CSP). XinTec is an exclusive joint venture partner of Shellcase in the Asia-Pacific region, offering wafer-level CSP technology and service in Taiwan. This EVG order represents follow-on business.
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Wednesday 1st January 2003
University of South Florida's (USF) MicroElectroMechanical Systems (MEMS) and Nanotechnology centre has bought Intelligent Micro Patterning's SF-100 maskless photolithography system. This uses a
Wednesday 1st January 2003
MEMC Electronic Materials has responded to a comment in the Wall Street Journal by saying that it has not filed for bankruptcy protection. In Q2 2002, the company reported net income available to common stockholders of $6.0mn, after cumulative preferred stock dividends
Wednesday 1st January 2003
March 9-12, 2003, Santa Fe, NM, USA.
Wednesday 1st January 2003
October 28-29, 2002, Grenoble, France.
Wednesday 1st January 2003
Analog Devices (ADI) claims the world’s first MEMS-based gyroscope. The company says that it is the first commercially available device to integrate both an angular rate sensor and signal processing electronics onto a single piece of silicon.
Wednesday 1st January 2003
Nanosys has taken out an exclusive licence for semiconductor nanowire-based nanolaser technology from the University of California. The research on which the licence was based was conducted by Dr Peidong Yang, Scientific Founder of Nanosys. The lasers were developed by growing zinc oxide (ZnO2) nanowires on sapphire substrates (Science, June 8, 2001). The nanowires form laser cavities with diameters varying between 20-150nm and lengths up to 10microns. In the Science paper, optical excitation resulted in surface emission of laser light with a wavelength of 385nm and a linewidth less than 0.3nm.
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Wednesday 1st January 2003
Philips Electronics and Fairchild Semiconductor have formed a working relationship to become a multi-source supplier for small-scale logic packaging.
Wednesday 1st January 2003
Soitec is expanding its R&D partnership with the Laboratoire d'Electronique de Technologies et d'Instrumentation (LETI) in Grenoble, France
Wednesday 1st January 2003
Motorola has produced a single-chip assisted global positioning system (A-GPS) receiver small enough to fit into a wristwatch called Motorola Instant GPS. The chip was produced on IBM's 0.25micron silicon germanium (SiGe) technology. The companies worked together to integrate IBM's technology to optimise the design. IBM plans to manufacture the new GPS chips for Motorola.
Wednesday 1st January 2003
SZ Testsysteme's managing board has filed for bankruptcy. Negotiations with banks have not led to a satisfactory outcome with regard to a sufficient financing framework despite far-reaching agreements with key suppliers and the company's employees.
Wednesday 1st January 2003
Hitachi and Mitsubishi Electric have reached a basic agreement to establish a new semiconductor company, Renesas Technology, that will focus on system LSI operations. The new company will be established on April 1, 2003. This agreement is a result of discussions to integrate system LSI businesses agreed on March 18, 2002.
Wednesday 1st January 2003
Elpida Memory and Mitsubishi Electric have reached the basic agreement to start discussing the integration of Mitsubishi Electric's DRAM operations with Elpida. The agreement is expected to be reached by the end of this year, with the goal of integrating the DRAM business by April 2003. In addition, this agreement will allow Elpida Memory to form a new alliance with Powerchip Semiconductor. Powerchip would serve as a foundry for Elpida's DRAM production.

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