Amkor Technology is expanding its MicroLeadFrame capacity to more than 75mn
units/month by Q4, 2002. When introduced in 1999, the packages production
reached a 1mn units/week three months after qualification.
Lambda Physik is to invest up to EUR5mn until 2004 in the development of
157nm laser technology for microlithography. Up to 38% of the development
and research expenses for the European 157nm microlithography consortion
will come from the German Federal Ministry of Education and Research (BMBF).
A EUR3.5mn research program devoted exclusively to OVPD (Organic Vapor Phase
Deposition) technology for organic LED (OLED) display applications has been
granted by the German Ministry of Research and Education to a group of
researchers headed by Aixtron.
The Fabless Semiconductor Association (FSA) and JEDEC have produced a
Foundry Process Qualification Guideline. The standard is the work of the FSA
Foundry Process Qualification Subcommittee and the JEDEC JC-14.2 Wafer Level
Silicon-on-insulator design specialist SOISIC (Silicon on Insulator Systems
and Integrated Circuits) has produced CMOS/SOI-Xpert, claimed as the first
commercially available characterisation product integrating all SOI
power rated at 30W and 60W have been released to production with 85W and
125W parts are targeted for released in October. Spectrian is currently in
the process of completing system evaluation of these devices.
An independent committee investigating the validity of certain Bell Labs
research concludes that one member of its research staff - Jan Hendrick
Schoen - had engaged in scientific misconduct by falsifying and fabricating
experimental data between 1998 and 2001 (Bulletin 434, May 27, 2002).
Mitsubishi Electric is reported to be in merger talks that could result in
its DRAM operation being put into the Elpida joint venture between NEC and
Hitachi. Mitsubishi is also talking with other IC producers.
Varian Semiconductor Equipment Associates has taken further actions to
restructure its business and reduce costs. Included in the company's actions
is a reduction of its worldwide workforce by 15% to 1370 people.
Axcelis Technologies announced additional workforce reductions, affecting
155 positions worldwide - 7% of the employee base. Axcelis estimates that
these actions will save the company $12mn annually. The company is also
implementing supply chain initiatives for an additional $10mn annual saving.
With the addition of this recent action, Axcelis has eliminated 473 jobs
bringing its worldwide total employment to 1825 people, down 21% since the
peak of the last cycle.
ChipPAC and Advanced Semiconductor Manufacturing (ASMC), an analogue, power
and smartcard wafer foundry in Shanghai, China, will provide customers with
end-to-end solutions from wafer fab to wafer sort, packaging, final test and
distribution in China, as well as to the global market.
Motorola's Semiconductor Products Sector (SPS) is to transfer its
all-copper, 0.13micron HiPerMOS7 (HiP7) technology to Tower Semiconductor's
200mm Fab 2 facility, under a transfer and licensing agreement
Brooks-PRI Automation says that a leading European semiconductor
manufacturer has ordered its integrated Computer Integrated Manufacturing
(CIM) software for a 300mm fab in Europe. The IC producer has also selected
Brooks-PRI as its standard for CIM systems for all its future 300mm fabs.