News Article
U-IT Buys Cluster Tool From Oerlikon
First 8'' MEMS cluster tool from Oerlikon on its way to Korea.
In June, u-IT Cluster Centre, a Korean RFID/USN infrastructure facility providing foundry service of MEMS Sensors (USN Fab) and RFID/USN related activities from design to testing of RFID/USN products (RFID/USN Engineering Lab), signed a contract for purchasing a CLUSTERLINE 200 II manufacturing tool from Oerlikon for 6" & 8" MEMS R&D and mass production.
With this decision, u-ITC is positioning to be one of the leaders in next generation wafer processing development in North east Asia. The CLUSTERLINE will be installed at USN Fab located in the u-IT Cluster Centre, Songdo, Korea.
"We've evaluated the available wafer production equipment and were primarily impressed by Oerlikon," says Dr. Sang-Chul Shin, President at u-IT Cluster Centre. The CLUSTERLINE is approved by major MEMS and Semiconductor manufacturers worldwide, featuring excellent process capabilities for production, not only for MEMS but also for UBM, BSM, TFH, IC and other compound applications, where Oerlikon has demonstrated technology and CoO leadership for many years.
"This high volume production platform of choice for highly sophisticated and specialised applications offers many new opportunities to the manufacturers," says Andreas Dill, Head of Systems within Oerlikon. "We are proud that we have been selected as the partner of choice. The fact that we have been rewarded with the distinction 'VLSI 10 Best Award' for the ninth consecutive year proves our dedication for making our customers successful. This is another great reward for all our efforts to provide the semiconductor industry with superior process and production solutions."
CLUSTERLINE 200 II has a large installed base around the world with major semiconductor manufacturers. The tool provides state of the art process capabilities coupled with flexibility to enhance the system with additional customised features. The open systems architecture allows easy tool configuration for PVD, Soft Etch and PECVD. The new generation CLUSTERLINE is fully process compatible to previous CLUSTERLINE tools installed in the market place while providing extendibility through innovative features that are evident in improved overall performance.
With this decision, u-ITC is positioning to be one of the leaders in next generation wafer processing development in North east Asia. The CLUSTERLINE will be installed at USN Fab located in the u-IT Cluster Centre, Songdo, Korea.
"We've evaluated the available wafer production equipment and were primarily impressed by Oerlikon," says Dr. Sang-Chul Shin, President at u-IT Cluster Centre. The CLUSTERLINE is approved by major MEMS and Semiconductor manufacturers worldwide, featuring excellent process capabilities for production, not only for MEMS but also for UBM, BSM, TFH, IC and other compound applications, where Oerlikon has demonstrated technology and CoO leadership for many years.
"This high volume production platform of choice for highly sophisticated and specialised applications offers many new opportunities to the manufacturers," says Andreas Dill, Head of Systems within Oerlikon. "We are proud that we have been selected as the partner of choice. The fact that we have been rewarded with the distinction 'VLSI 10 Best Award' for the ninth consecutive year proves our dedication for making our customers successful. This is another great reward for all our efforts to provide the semiconductor industry with superior process and production solutions."
CLUSTERLINE 200 II has a large installed base around the world with major semiconductor manufacturers. The tool provides state of the art process capabilities coupled with flexibility to enhance the system with additional customised features. The open systems architecture allows easy tool configuration for PVD, Soft Etch and PECVD. The new generation CLUSTERLINE is fully process compatible to previous CLUSTERLINE tools installed in the market place while providing extendibility through innovative features that are evident in improved overall performance.
