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Monday 10th March 2003
A new in situ etch and regrowth process for uncooled InP buried heterostructure lasers with claimed 50 percent lower rates of burn in degradation is to be introduced by Bookham Technology at the Optical Fiber Communication Conference and Exposition (OFC) this month (March 2003). The burn-in improvement promises increasing long-term reliability of devices, which also exhibit 20 percent lower threshold currents. The new process is also compatible with newer aluminium gallium indium arsenide (AlGaInAs) materials.
Monday 10th March 2003
French president Jacques Chirac inaugurated the Crolles2 Alliance of Philips, Motorola and STMicroelectronics. The joint R&D centre will pioneer CMOS technology from 90nm processes to 32nm over the next five years and also includes a 300mm wafer semiconductor manufacturing pilot line, which is now beginning operation. Taiwan foundry TSMC also has participation in the work in terms of process development and alignment.
Monday 10th March 2003
French president Jacques Chirac inaugurated the Crolles2 Alliance of Philips, Motorola and STMicroelectronics. The joint R&D centre will pioneer CMOS technology from 90nm processes to 32nm over the next five years and also includes a 300mm wafer semiconductor manufacturing pilot line, which is now beginning operation. Taiwan foundry TSMC also has participation in the work in terms of process development and alignment.
Monday 10th March 2003
A new in-situ etch and regrowth process for uncooled InP buried-heterostructure lasers with claimed 50 per cent lower rates of burn-in degradation is to be introduced by Bookham Technology at the Optical Fiber Communication Conference and Exposition (OFC) this month (March 2003). The burn-in improvement promises increasing long-term reliability of devices, which also exhibit 20 percent lower threshold currents. The new process is also compatible with newer aluminium gallium indium arsenide (AlGaInAs) materials.
Monday 10th March 2003
French president Jacques Chirac inaugurated the Crolles2 Alliance of Philips, Motorola and STMicroelectronics. The joint R and D centre will pioneer CMOS technology from 90nm processes to 32nm over the next five years and also includes a 300mm wafer semiconductor manufacturing pilot line, which is now beginning operation. Taiwan foundry TSMC also has participation in the work in terms of process development and alignment.
Monday 10th March 2003
Agere Systems was claiming it has 21 breakthrough transistor products aimed at the wireless power amplifier market for 2-3G base station equipment. The transistor technology uses two key innovations aimed at improving performance and reliability the first resolves the issue of how to eliminate defects in chips when making ultra-thin silicon wafers and the other improves performance when amplifying wireless signals.
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Monday 10th March 2003
Philips Electronics has accelerated investment in and renamed its instrumentation divisions SurfaceWave technology branch. SurfaceWave will now be known as Philips Advanced Metrology Systems (Philips AMS). The business will specialise in the manufacture and marketing of semiconductor interconnect metal film thickness measurement tools for online monitoring of advanced semiconductor processes such as copper metallisation. Such processes include barrier/seed, electrochemical deposition (ECD) plating and chemical mechanical polishing (CMP) on blanket and patterned wafers.
Monday 10th March 2003
Design tool company Synopsys completed its acquisition of Numerical Technologies, a provider of subwavelength lithography enabling technology. Synopsys acquired 90.71 percent of the outstanding shares of Numerical common stock for a purchase price of 7.00 dollars per share in cash, without interest, through a tender offer by its wholly owned subsidiary, Neon Acquisition. As the final step of the acquisition, Synopsys caused Neon Acquisition to merge with and into Numerical on March 1, 2003. Numerical shares not purchased in the tender offer will be converted into the right to receive the same 7.00 dollars per share in cash, without interest. As a result, Numerical is now a wholly owned subsidiary of Synopsys.
Monday 10th March 2003
Infineon Technologies is considering a move of its corporate headquarters out of Germany. While the German weekly magazine Stern says firm plans to move have already been made, Reuters reports a spokeswoman saying No decision has yet been taken. High taxes and legal restrictions in Germany are said to be among the reasons for the development. The company could move to Switzerland, Singapore or the USA.
Monday 10th March 2003
The World Semiconductor Trade Statistics organisation reported a 22 percent year on year increase in its January 2003 world sales figures. The January total was 12.2bn dollars consisting of 2.47bn dollars for Europe (+16.0 percent), 2.71bn dollars for Japan (+34.0 percent), 4.51bn dollars for Asia-Pacific (+32.6 percent) and 2.54bn dollars for the Americas (+2.8 percent).
Monday 10th March 2003
A new in situ etch and regrowth process for uncooled InP buried heterostructure lasers with claimed 50 percent lower rates of burn in degradation is to be introduced by Bookham Technology at the Optical Fiber Communication Conference and Exposition (OFC) this month (March 2003). The burn-in improvement promises increasing long-term reliability of devices, which also exhibit 20 percent lower threshold currents. The new process is also compatible with newer aluminium gallium indium arsenide (AlGaInAs) materials.
Monday 10th March 2003
Theta 300 provides the perfect solution for characterizing thin films on tomorrows semiconductor devices. Its unique, non-destructive, technology provides dose, distribution, layer thickness, purity, uniformity and composition measurements from any point on the wafer. Not only will it measure elemental compositions but it will also provide chemical state information. It detects the presence, nature and thickness of buried interface layers. Theta 300 measures contaminants in the layer, at the surface and at the interfaces. Theta 300 is ideally suited to the metrology of gate dielectrics, including oxynitrides and newer materials such as hafnium oxide. Theta 300 accommodates wafers up to 300mm and thicker specimens, such as packaged devices. It provides metrology, QC and R&D facilities with a powerful new tool to accelerate the development of tomorrow’s semiconductor devices. Theta 300 can also be configured with an additional, side-mounted transfer chamber for FOUP, cassette, or clean-room applications. Click here for the application form for a copy of the Theta 300 interactive presentation CD.
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Monday 10th March 2003
US semiconductor equipment developer Silicon Genesis Corporation (SiGen) has successfully developed a new strained silicon method to create high carrier mobility layers. The process is applicable to the fabrication of strained-silicon bulk wafers and strained-silicon silicon-on-insulator (SOI) wafers.
Monday 10th March 2003
US semiconductor equipment developer Silicon Genesis Corporation (SiGen) has successfully developed a new strained silicon method to create high carrier mobility layers. The process is applicable to the fabrication of strained-silicon bulk wafers and strained-silicon silicon-on-insulator (SOI) wafers.
Friday 7th March 2003
Silicon-on-insulator (SOI) wafer manufacturer Soitec has acquired assets of the French epitaxial wafer supplier Picogiga. Soitec will support existing Picogiga customers and core business - growing epitaxial layers on compound-semiconductor substrates. The business mainly uses gallium arsenide (GaAs) substrates, with layers deposited via molecular beam epitaxy (MBE). Soitec plans to apply its Smart Cut technology to compound materials. Smart Cut uses wafer bonding with a hydrogen implant to cut off thin layers on a substrate.
Thursday 6th March 2003
Shipley Company, L.L.C., is a world leader in electronic materials and process technology development. As part of the $1 billion Rohm and Haas Company Electronic Materials Business Group (NYSE: ROH), Shipley delivers exceptionally innovative technologies across a broad range of applications. These platforms include advanced circuit board technology, semiconductor manufacturing and advanced packaging. Our products are integral elements in cell phones, smart cards, computers, flat panel displays, automotive electronics and equipment that power the internet, and much more. Additional information is available at www.shipley.com. Click here to access product guide downloads
Tuesday 4th March 2003
Optical switch array module maker OMM will cease operations as of Friday March 7, 2003. The company plans to release all of its 85 employees and assign the assets to the benefit of creditors.
Tuesday 4th March 2003
An Israeli organic semiconductor technology company, Nanolayers, has become the first firm to receive funding approval from Israels new Heznek programme, administered by the Office of the Chief Scientist.
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Tuesday 4th March 2003
The World Semiconductor Trade Statistics organisation reported a 22% year-on-year increase in its January 2003 world sales figures. The January total was $12.2bn consisting of $2.47bn for Europe (+16.0%), $2.71bn for Japan (+34.0%), $4.51bn for Asia-Pacific (+32.6%) and $2.54bn for the Americas (+2.8%).
Monday 3rd March 2003
Shipley Company, L.L.C., is a world leader in electronic materials and process technology development. As part of the $1 billion Rohm and Haas Company Electronic Materials Business Group (NYSE: ROH), Shipley delivers exceptionally innovative technologies across a broad range of applications. These platforms include advanced circuit board technology, semiconductor manufacturing and advanced packaging. Our products are integral elements in cell phones, smart cards, computers, flat panel displays, automotive electronics and equipment that power the internet, and much more. Additional information is available at www.shipley.com.
Monday 3rd March 2003
International Conference on the Commercialization of Micro and Nanosystems (COMS), September 8-11, 2003, Amsterdam, The Netherlands.
Monday 3rd March 2003
Ashland Electronic Chemicals is to be the primary outsourcing manufacturer for ASMLs Thermal division under a multi-year contract. The agreement includes responsibility for sourcing and procurement of all materials, and assembly and testing of all toolsets. ASML Thermal offers large-batch and single-wafer thermal process furnaces and atmospheric pressure chemical vapour deposition (APCVD) systems.
Monday 3rd March 2003
The worldwide semiconductor market is forecast to grow 8.9% in 2003, with revenue totalling $167bn, up from $153.4bn in 2002, according to quarterly forecast estimates from Gartner Dataquest. The slowdown at the end of 2002 is continuing in Q1 2003.
Monday 3rd March 2003
University of Illinois at Chicago (UIC) researchers have developed a method for growing conducting polymers called Surface Polymerisation of Ion-Assisted Deposition or SPIAD (Journal of the American Chemical Society, online since February 6 and in print March 5, 2003).

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