Entegris has added manufacturing capabilities at its facility in Bad
Rapaneau, Germany, with installation of a new automated manufacturing line.
This capability enables Entegris to manufacture out of Germany both 150mm
and 200mm Ultrapak wafer carriers for the semiconductor industry. Ultrapak
is designed to protect and transport silicon wafers by eliminating wafer
rotation and by reducing contamination. The products are constructed from
ultrapure polypropylene materials to provide a clean shipping environment,
decreasing particle generation and outgassing and increasing product shelf
Dialog Semiconductor is planning to close its Swedish subsidiary. The decision is designed to control both costs and headcount. The company says that it has decided to focus on its core competence, which is the design and manufacture of ICs.
The Swedish facility has a staff of 40 people, the majority of whom are employed in auxiliary tasks such as development of evaluation boards and software. A company spokesman says that these activities can be covered at lower cost through staff at other company locations and through outsourcing.
Infineon Technologies has developed with others a self-service system for users of Vienna’s new multimedia main library. The inventory includes 240,000 books as well as 60,000 CDs and DVDs. The items have been equipped with radio chips for data transmission. Use of the new RFID (radio frequency identification) chips permits library users to check out books, CDs or DVDs themselves, without waiting in line at a service counter. The RFID chips from Infineon also provide security functions to prevent theft.
Seven read and write units are used to embed the RFID chips into the books and to store the information on the chips. Another six read and write units are available to the attendants to register the checked-out media. In addition, four self-service terminals, so-called EasyChecks, are available.
Motorola says it has demonstrated the world’s first 4Mbit memory based on silicon nanocrystals. The company sees the fully functional test chip as a major milestone in the search for successors to floating gate-based flash memories. Many believe Flash will not continue to scale to smaller geometries.
IMEC has extended its industrial affiliation programme (IIAP) on high-k
dielectrics for (sub)-65nm devices to provide solutions for the
implementation of metal gate stacks in planar-scaled CMOS. The current
standard gate stack uses polysilicon above the dielectric.
Renesas Technology has officially separated from its parents Hitachi and
Mitsubishi Electric and commenced operations as a system IC company. Dr
Koichi Nagasawa has been appointed chairman and CEO, and Satoru Ito was
appointed as president and chief operations officer.
IMEC has described two developments in semiconductor R&D with the extension of its industrial affiliation programme (IIAP) on high-k dielectrics for (sub)-65nm devices to provide solutions for the implementation of metal gate stacks in planar-scaled CMOS and development of a post-processing technique to create high-Q inductors.
QinetiQ has developed an optical hybrid technology that uses a hollow waveguide (HWG) to improve performance while reducing expenditure. The HWG has the potential to cut more than 50% off the cost of complete optical circuits, says Qinetiq.
Infineon Technologies and Chinas Semiconductor Manufacturing International have signed an agreement to expand co-operation on production of standard memory (DRAMs). Under the terms of the additional agreement, Infineon will transfer its 0.11micron DRAM trench technology and 300mm wafer know-how to SMIC. In return, SMIC will manufacture products in this technology exclusively for Infineon.
Infineon expects to increase its overall capacity by 15,000 wafer starts per month through SMIC’s 300mm plant, which is currently being built in Beijing. In December 2002, the two companies signed an agreement whereby SMIC would manufacture memory chips in its 200mm plant in Shanghai using Infineon’s 0.14micron DRAM trench technology exclusively for Infineon. Following ramp-up at Beijing, the additional 300mm wafer starts to the 20,000 in 200mm will result in a total capacity of 58,000 wafer starts in 200mm wafer equivalents. First products from the new 300mm plant are expected for summer 2004.
A new GBP4.2mn facility is to be built in Scotland dedicated to the commercialisation of research in packaging technology for complex optoelectronic chips. The new facility will be located in Livingston and will commence operating in the summer of this year.
Processes will be developed to align delicate circuitry to optical fibres and electronic connections. Solutions that can be transferred to other emerging technologies such as biochips for diagnosis and treatment of illness will also be sought.
Samsung Electronics has signed a licensing agreement for ASML’s technology to be deployed at Samsung’s semiconductor production facilities worldwide. The patented ASML technology is designed to significantly enhance the imaging performance for current and future technology generations. Samsung is licensing the technology through the life of the patents.
Cambridge Display Technology (CDT) says that it has dramatically improved the life performance of display devices based on light emitting polymer (LEP) technology, achieving more than 11,000 hours of operation for its blue polymer research devices.
Infineon Technologies announced availability of "Flow-Thru" biochips and a matching complete analysis system. Infineon markets the products with its US partner company, MetriGenix. The biochips are miniaturised sample substrates made of silicon, on which hundreds of simultaneous biomolecular tests can be performed using optical evaluation techniques. The Infineon biochip uses a three-dimensional micro-array - a network of fine micro-channels that run between the upper and the lower side of the chip. In contrast, traditional planar biochips on glass substrates have a two-dimensional sensor surface.
Analysis using the Flow-Thru Chip (FTC) is a multi-step process. The micro-channels of the biochip are prepared by MetriGenix, which populates the chip with segments of known genes that fix themselves on the walls of the micro-channels. Then the gene sample to be analysed is repeatedly pumped back and forth through the pores in the Flow-Thru technique. This causes matching genes of the sample to bind with known genes on the pore wall. A luminescent dye is added in another step, binding with the matched gene segments. The dye emits light that is captured by a CCD (charge coupled device) camera and forwarded to a computer.
US and European scholars are to converge on the University of South Carolina (USC) during March 20-23, 2003, for the first of two international conferences to discuss the social implications of nanoscale science and technology on a global scale. The conference will examine the philosophy, ethics, politics and culture of nanoscience.
Georgia Institute of Technology researchers will describe a nanometre scale optoelectronic device that can perform addition and other logical operations in the coming issue of the US Proceedings of the National Academy of Sciences (March 18).
Light emitting polymer (LEP) developer Cambridge Display Technology (CDT) is to provide its full colour ink-jet printing manufacturing technology and process knowledge to DuPont Displays for use in LEP organic light emitting diode (OLED) manufacturing.
Japanese company Seika is to become the exclusive distributor in China for products based on Soitecs proprietary Smart Cut technology. Seika will staff its Shanghai office with a sales force dedicated to Soitecs offerings.
Toshiba introduced a 2Gbit single-die NAND Flash memory with double the capacity of the companys present largest single-die NAND Flash device. Toshiba also announced a 4Gbit NAND Flash IC that stacks two of the 2Gbit NAND Flash dies in a single package.
Aixtron has delivered its first commercially available organic vapour phase deposition (OVPD) research system to Princeton University (PU). The researchers will use the tool for the deposition of state-of-the-art organic materials (plastics).
IMEC and International SEMATECH (ISMT) have agreed joint work together on advanced technology aimed at speeding the development of 157nm lithography. In parallel, several collaboration agreements between IMEC and leading IDMs are also under negotiation.