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Wednesday 19th February 2003
German company Singulus Technologies has launched a thin-film sputtering system aimed at production of magnetic RAM on 300mm wafers.
Wednesday 19th February 2003
University of California Santa Barbara scientists (Nature, February 6, 2003) have developed a photovoltaic device based on a Schottky diode structure (metal-semiconductor rather than semiconductor-semiconductor junction).
Wednesday 19th February 2003
International SEMATECH (ISMT) plans to co-ordinate industry-wide studies into the extension of chrome as mask absorber, other materials that could replace it and the economic impacts of both pathways.
Wednesday 19th February 2003
Osram Opto Semiconductors has produced its first optical pumped semiconductor (OPS) disk laser prototype. The company says that for the first time its developers have achieved an 8W optical output power with an optical pumping power of 19W at a wavelength of 980nm.
Tuesday 18th February 2003
Agilent Technologies has agreed to buy the intellectual property and certain other assets of Pixel Devices International, a developer of complementary metal oxide semiconductor (CMOS) image sensors. Upon the close of the transaction, Pixels key employees will join Agilents Semiconductor Products Group, including PDIs chief technical officer Boyd Fowler.
Tuesday 18th February 2003
Epitaxial wafer foundry IQE is to cut a further 60 jobs from its staffing, bringing the total to 250. The majority of the redundancies will be at IQE (Europe). The company reports that sales revenues for Q4 2002 are likely to be approximately 5% below the GBP5.6mn reported in the previous quarter.
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Tuesday 18th February 2003
Toshiba has developed high-frequency silicon germanium (SiGe) RF transistors that achieve a 0.52dB noise level - the lowest currently available in a SiGe transistor, it is claimed. The transistors are produced on an expitaxial bipolar process.
Tuesday 18th February 2003
Fairchild Semiconductor will supply US optical networking supplier OMM with micro-electro-mechanical system (MEMS) wafers under a long-term production agreement. OMM produces MEMS-based all-optical switching modules.
Tuesday 18th February 2003
Samsung Electronics has become a new shareholder in the Symbian operating system (OS). The OS is designed for handheld devices and was originally developed for the Psion electronic organiser. Since then Symbian has been promoted for smartphones, with backing from companies such as Nokia, Ericsson/Sony Ericsson and Motorola.
Tuesday 18th February 2003
STMicroelectronics has developed a three-axis linear accelerometer aimed primarily at applications in handheld terminals. The device combines a micro-electro-mechanical system (MEMS) sensor and an interface chip in a single package.
Friday 7th February 2003
IC Insights is forecasting an average annual growth rate for the compound semiconductor IC market of 22% for the period 2002-2007. The expectation for the total IC market is 10% for the same duration.
Friday 7th February 2003
Microsystem producer Corning IntelliSense and Northrop Grumman’s Electronic Systems sector are collaborating on a US Air Force Research Laboratory/ Defense Advanced Research Projects Agency (AFRL/DARPA) sponsored programme on RF MEMS (micro-electro-mechanical system) improvement.
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Thursday 6th February 2003
An IC design and software development centre has been set up in Rabat, Morocco, by STMicroelectronics. The decision to set up the centre expands on ST’s existing Moroccan presence from package, assembly and test.
Thursday 6th February 2003
X-FAB has released a new technology for inertial sensors from its new micro-electro-mechanical systems (MEMS) surface micromachining process on SOI wafer process generation.
Thursday 6th February 2003
University of California Santa Barbara scientists (Nature, February 6, 2003) have developed a photovoltaic device based on a Schottky diode structure (metal-semiconductor rather than semiconductor-semiconductor junction).
Thursday 6th February 2003
Infineon Technologies is to make seven presentations to the International Solid-State Circuits Conference (ISSCC 2003) next week (February 9-13, 2003) in the USA. Infineon’s topics include bio-sensor array chips, flexible organic circuits and smart textiles. The company is also presenting new developments in high-speed communications chips (SiGe and CMOS), and the results of two joint research projects in memory chip design (ferroelectric RAM and SRAM).
Wednesday 5th February 2003
The European Unions Competitiveness Council has agreed the creation of a Community Patent, based on a compromise from the Greek presidency. Discussions go back to 1975 when member states signed the "Luxembourg Convention". As reported earlier (February 28, 2003), one of the main differences concerned whether a central patent court would be established.
Tuesday 4th February 2003
amsung Electronics has ordered a FabGuard sensor integration and analysis system from INFICON Holding worth $2.6mn.
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Tuesday 4th February 2003
InStat/MDR forecast that 2002s 5.0 average micro-electo-mechanical systems per car will increase to 9.1 in 2007. MEMS revenues in the automotive sector will increase from $1bn to $1.5bn over the same period.
Tuesday 4th February 2003
TSMC reports net sales of TWD41.15bn in Q4 2002, compared with TWD33.13bn in Q4 2001. Net income was TWD2.55bn, down from Q4 2001s TWD4.51bn. Capacity utilisation was 61% against 50% in Q4 2001.
Tuesday 4th February 2003
Osram Opto Semiconductors has produced its first optical pumped semiconductor (OPS) disk laser prototype. The company says that for the first time its developers have achieved an 8W optical output power with an optical pumping power of 19W at a wavelength of 980nm.
Tuesday 4th February 2003
The World Semiconductor Trade Statistics put December 2002’s global sales of ICs at $12.5bn, closing the year at $140.7bn. December’s sales represent a 23.1% increase on December 2001.
Tuesday 4th February 2003
WAFERMAP is an award winning software package used to collect, edit, analyze and visualize measured physical parameters on semiconductor wafers. WAFERMAP can import data files from various metrology tools such as ellipsometers, thickness gauges and four point probes. The imported data can then be visualized or printed as line scans, contour plots, 2D or 3D plots or as a histogram. Several kinds of operations can be applied to the wafer maps such as rotation, shifting of the grid in the X or Y direction, or mirroring the data along the X or Y axis. A Sigma Filter allows for the elimination of sites that exceed a user-defined range (e.g. measurement errors). It is also possible to compare different sets of data by adding, subtracting or dividing entire wafer maps. Typical applications include map generation for manually operated metrology tools and standardized visualization for different automatic metrology equipment (e.g. different types of four point probes in the same fab). WAFERMAP allows users to work off-line and to analyze and edit metrology data outside of the clean room. Its the perfect solution for paperless fabs. Also, after your trial, if you purchase a license for this software and you are a Eurosemi Plus reader you will receive a discount! Click on the banner below to get your free download or find out more about WaferMap.
Tuesday 4th February 2003
Researchers at Caltech and Case Western Reserve University have developed nano-electro-mechanical systems (NEMS) with resonant frequencies greater than 1GHz (Nature, January 30).

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