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Monday 3rd February 2003
Epitaxial wafer foundry IQE is to cut a further 60 jobs from its staffing. The majority of the redundancies will be at IQE (Europe). The company reports that sales revenues for Q4 2002 are likely to be approximately 5% below the GBP5.6mn reported in the previous quarter.
Friday 31st January 2003
Intergraph has filed a US patent infringement lawsuit against Texas Instruments with respect to its digital signal processors (DSPs).
Friday 31st January 2003
SANYO Electric is to establish a new 10,000m2 JPY4.5bn factory for the production of heterojunction with intrinsic thin layer (HIT) photovoltaic cells and modules. The new factory is to be built in Osaka, Kaizuka City. Production is to start January 2004.
Wednesday 29th January 2003
IMECs board of directors announced the construction of a new 300mm cleanroom based on a detailed engineering study made in 2002 and positive signals of industry and local government support. Construction of the new 2200m2 research fab will begin in February 2003, with completion due in 18 months.
Wednesday 29th January 2003
Infineon claims to be the first to install a compact discharge extreme ultraviolet (EUV) laboratory exposure system for photoresist development at a research facility in Erlangen, Germany.
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Wednesday 29th January 2003
Rockwood Specialties is to make a $7mn expansion and refurbishment investment at its Gréasque wafer reclaim facility in the South of France. The project focuses on increasing capacity and enhancing capabilities, particularly 200mm reclaimed silicon wafers.
Monday 27th January 2003
Now you can monitor where it matters - at the critical surface. Whether its a wafer, a lens, an optical mirror or a metallic surface, AiM from Particle Measuring Systems gives you whats important: a highly sensitive, real-time measurement of contamination as it deposits on the surface. 1. WAFER SURFACES As feature sizes continue to shrink, surface damage from molecular contamination becomes a larger and larger problem. AiM gives you real-time monitoring of incremental depositions of condensables as small as 0.02Ng/cm2. 2. OPTICAL COMPONENTS Both aerospace and photolithography suffer from hazing of critical optics, sometimes even requiring replacement instead of cleaning. In fabs this problem will grow exponentially in the move to 193nm systems and beyond. AiM measures deposition of organic condensables that can form haze on mirrors and lenses. 3. METALLIC SURFACES Sensitive disk drive heads can be ruined by exposure to trace concentrations of acidic vapors. Similarly, increased use of copper makes the semiconductor industry more and more vulnerable. Particle Measuring Systems now offers AiM sensors coated with copper or other metals to provide real-time monitoring of critical metallic surfaces. 4. FILTER BREAKTHROUGH Industry is increasingly using chemical filtering to reduce the surface damage caused by molecular contamination. With selectable surfaces for detecting either condensables or acids, AiM can monitor and alarm as the deleterious molecules break through the filters. For more information, call +44 1684 581000 or visit at www.surfacemc.com. For application notes regarding molecular contamination go to http://www.pmeasuring.com/particle/education/appNotes/molecular
Monday 27th January 2003
The Singapore-based 300mm joint venture, UMCi, has begun equipment move-in. The venture brings together UMC, Infineon Technologies and EDB Investments, the investment arm of the Singapore governments Economic Development Board.
Monday 27th January 2003
EMCORE has acquired Agere Systems West Coast USA optoelectronics business for $25mn. The transaction includes assets, products, technology and intellectual property related to Ageres cable TV optical components, telecom access and satellite communications operations.
Monday 27th January 2003
SEMIs book-to-bill ratio for the North American semiconductor equipment came in at 0.98 in December 2002. Three-month average bookings were 39% up on December 2001 at $839mn and billings were 5% up at $853mn. The final book-to-bill ratio for November 2002 is given as 0.80.
Monday 27th January 2003
STMicroelectronics reports Q4 2002 sales at $1.79bn, up 23.4% year-on-year. Net income was $160.6mn, almost three times that of the previous year.
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Monday 27th January 2003
SUSS MicroTec is to install a lithography line at Taiwans National Nano Device Laboratories (NDL) for thin and thick resist MEMS (micro-electro mechanical systems) applications.
Monday 27th January 2003
A federal district court has ruled that Genus does not infringe two US patents (Nos.6,015,590 and 5,916,365) on atomic layer deposition (ALD) technology owned by European company ASM International. The judge ruled that Genus products do not meet the "evacuating" limitation of the 590 patent.
Monday 27th January 2003
Texas Instruments has produced fully-functional wireless digital baseband devices on its next generation, 90nm process. The process features transistors as small as 37nm, giving the ability to pack more than 400mn on a single chip.
Monday 27th January 2003
The UK University of Newcastle upon Tyne has joined forces with Amtel to create strained silicon microchips.
Monday 27th January 2003
Communicant Semiconductor Technologies announced immediate availability of its 0.25micron carbon-doped silicon germanium (SiGe:C) BiCMOS design kit. The process offers three heterobipolar NPN transistors with transition frequencies (fT) from 80GHz to 30GHz and maximum oscillation frequencies (fMAX) from 90GHz to 70GHz at voltages of 2.4V to 7.0V.
Monday 27th January 2003
A court in Taiwan has approved two Infineon injunction applications. The ruling reinstates two Infineon employees to office at the ProMOS joint venture with Mosel Vitelic.
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Friday 24th January 2003
Aixtron has acquired the patent and license portfolio for its TriJet Technology, from the French company J.I.P.ELEC. TriJet technology concerns the delivery and evaporation of liquid precursors and is used in Aixtrons Tricent and "Atomic Vapor Deposition" (AVD) systems. AVD techniques can be used to deposit high-k materials for gate and capacitor oxide replacements. AVD is designed to combine the advantage of metallorganic chemical vapour deposition (MOCVD) with the control of atomic layer thicknesses.
Thursday 23rd January 2003
Texas Instruments has produced fully-functional wireless digital baseband devices on its next generation, 90nm process. The process features transistors as small as 37nm, giving the ability to pack more than 400mn on a single chip.
Thursday 23rd January 2003
STMicroelectronics reports Q4 2002 sales at $1.79bn, up 23.4% year-on-year. Net income was $160.6mn, almost three times that of the previous year.
Wednesday 22nd January 2003
EMCORE has acquired Agere Systems West Coast USA optoelectronics business for $25mn. The transaction includes assets, products, technology and intellectual property related to Ageres cable TV optical components, telecom access and satellite communications operations.
Wednesday 22nd January 2003
The Singapore-based 300mm joint venture, UMCi, has begun equipment move-in. The venture brings together UMC, Infineon Technologies and EDB Investments, the Singapore governments Economic Development Boards investment arm.
Wednesday 22nd January 2003
SEMIs book-to-bill ratio for the North American semiconductor equipment came in at 0.98 in December 2002. Three-month average bookings were 39% up on December 2001 at $839mn and billings were 5% up at $853mn. The final book-to-bill ratio for November 2002 is given as 0.80.

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