Info
Info
News search:

< Page of 140 >

News


Wednesday 1st January 2003
The UMCi Singapore-based 300mm joint venture between UMC, Infineon Technologies and the local EDBI government agency has announced several contracts have been awarded for the next construction phase. These include waste water treatment from Hyflux Hydrochem, cleanroom installation by M+W Zander, gas supply from SOXAL (Singapore Oxygen Air Liquide), chemical supply by Sumitomo Chemical Engineering and ultrapure water supply from Vivendi Water Systems/USF. The contracts add up to a value of $68m. Total planned capacity is 40,000 wafers per month with production scheduled to begin in Q2 2003 on UMC's 130nm and 90nm copper/low k process technologies.
Wednesday 1st January 2003
FSI International's Surface Conditioning division has joined Dow Chemical's SiLKnet Alliance for developing the SiLK low-k spin-on dielectric resin.
Wednesday 1st January 2003
Virage Logic is to develop and license its NOVeA family of non-volatile embedded memories on Tower Semiconductor's 0.18-micron technology, under a multi-year licensing agreement. Tower expects the embedded memories to be available by Q4 2002. The agreement grants Tower the right to license Virage Logic's 0.13micron process technology for NOVeA in the future. NOVeA can be produced using standard logic processes without special steps and photomasks that increase costs and delivery time.
Wednesday 1st January 2003
The World Semiconductor Trade Statistics organisation reports April IC sales at $11.07bn, compared with $13.74bn for the same period last year. Asia-Pacific managed to grow its sales 12.6% year-on-year to yield $3.97bn. Europe was down 25.8% at $2.28bn, the Americas down 30.5% at $2.62bn and Japan down 34.5% at $2.20bn.
Wednesday 1st January 2003
Alcatel Optronics is to shed a quarter of its staff in plans announced this week. The company's industrial redeployment plan affects all of its manufacturing sites. In Nozay, and Lannion, France, the company will introduce part-time employment, early retirement and prolonged leaves in an effort to reduce headcount. Job cuts will also be made at its Plano, Texas site. In Canada, the fibre Bragg grating (FBG) manufacturing operation in Gatineau (Quebec, Canada) will be closed and the manufacturing activities transferred to Alcatel Optronics UK, based in Livingston, Scotland. Canada's R&D activities and commercial presence will remain.
Wednesday 1st January 2003
TSMC says that it has demonstrated working transistors with a 35nm gate length based on a new variation of the field effect transistor (FET) called a FinFET because it resembles the backfin of a fish.
Info
Wednesday 1st January 2003
Motorola's Semiconductor Products Sector (SPS) in collaboration with Motorola Labs has produced its first 1Mbit MRAM (magnetoresistive random access memory) universal memory chip. SPS' MRAM technology director, Saied Tehrani, comments:
Wednesday 1st January 2003
Seiko Epson and Cambridge Display Technology have agreed to form a joint venture company to offer technologies and services using ink-jet deposition for manufacturing light emitting polymer (LEP) displays. The deal comes after several years of joint development work involving the two companies. The new venture plans to produce an ink jet printing machine with Epson's print head. The inks will be produced from formulations specified by CDT for these heads. The new company is to be called
Wednesday 1st January 2003
Infineon Technologies is to buy Ericsson's core microelectronics business (MIC) for EUR400m in a share based deal, after reports of discussions last week (Bulletin 436, June 10, 2002). Approvals are pending, and closing is expected during summer 2002. MIC is one of the world's largest manufacturers for high end power amplifiers.
Wednesday 1st January 2003
The Institute for System Level Integration (Livingston, Scotland) and Lancaster University's Centre for Microsystems Engineering plan to jointly develop an international group specialising in design-for-test and reliability engineering. Both system-on-chip and microsystems (MEMS) are to be considered. The group will concentrate on research programmes, teaching, training activities and consultancy projects. Particular concerns will be manufacturing costs and quality of highly integrated, miniaturised electronic systems.
Wednesday 1st January 2003
Korean foundry Dongbu Electronics has set up a
Info
Wednesday 1st January 2003
IXYS has managed to get an injunction against it stayed in the US appeals court. The injunction was granted to International Rectifier against IXYS MOSFETs that were found to infringe patents. The dispute was begun in 2000 (Bulletin 342, July 10, 2000). Late last year International Rectifier was found guilty of infringing IXYS power module patents in a separate action dating from late 2000 (Bulletin 364, December 12, 2000).
Wednesday 1st January 2003
The opto-device division of Hitachi's Semiconductor and Integrated Circuit (SIC) group is to be transfered to Hitachi's OpNext subsidiary. The transfer is anticipated to be effective October 1, 2002. The transaction will cover the opto-device division of SIC as well as the opto-electrical device development and manufacturing team and fabrication facilities from Hitachi Tohbu Semiconductor.
Wednesday 1st January 2003
In-Stat/MDR is looking forward to better times for the handset semiconductor market - in 2006.
Wednesday 1st January 2003
STMicroelectronics is to supply critical components for the Large Hadron Collider (LHC) being constructed by CERN, in Geneva, Switzerland. The LHC will smash extreme high energy particles to investigate fundamental particle theories such as the
Wednesday 1st January 2003
Clare Micronix, recently acquired by IXYS (Bulletin 437, June 17, 2002), claims to have the industry's first standard product driver for cholesteric liquid crystal display (Ch LCD) panels. The new display driver IC, the MXED401, targets the emerging non-volatile reflective LCD market, specifically bi-stable and multi-stable Ch LCDs. The device is manufactured in a high voltage (30V) CMOS process. Samples are due to be available in gold-bumped die form next month.
Wednesday 1st January 2003
Scientists at Princeton University are proposing direct imprint of nanostructures in silicon as an alternative to photolithography and etch (Nature, June 20, 2002). The team calls its new technique laser assisted direct imprint (LADI). An excimer laser pulse (308nm, 20ns) melts a thin surface layer of the silicon and a quartz mould is embossed into the resulting liquid. Structures with a 10nm resolution have been created. The embossing time is less than 250ns.
Info
Wednesday 1st January 2003
French microsystems producer MEMSCAP has relocated its registered French headquarters, and all Grenoble-area facilities, to its new production site located in Bernin, outside of Grenoble. Last week, management and design teams moved to the new offices, joining the production staff, who have been on-site since December 2001. The company now operates in 13,520m2 of space. The official inauguration of the site will be held at a later date.
Wednesday 1st January 2003
Communications IC producer TriQuint Semiconductor has acquired assets from IBM's wireless phone chipset business. TriQuint is taking over design, development, marketing and sales of certain standard and custom IBM semiconductor products used in wireless phones and other communications applications. IBM will continue to manufacture the components for TriQuint. The products being transferred to TriQuint include voltage-controlled oscillators (VCOs), receivers and wideband CDMA chipsets, all based on silicon germanium process technology. TriQuint will assume related product assets and be granted assignments and licenses to associated intellectual property. The transaction is expected to close by the end of June 2002. TriQuint will make an initial payment of $22m to IBM, with subsequent adjustments contingent upon business volumes.
Wednesday 1st January 2003
Fujitsu and Toshiba have agreed to explore comprehensive collaboration on system-on-chip (SoC) solutions at 100nm and finer. The companies will establish several joint working groups to investigate collaboration in areas such as standardisation of design and development platforms and silicon technology; co-development of processor cores and other intellectual property; and joint development of advanced large-scale integration (LSI) for communications and other fields. The two companies may later seek to expand the partnership, including the possibility of integrating operations. The companies have previously worked together - for example on the fast channel RAM (FCRAM) high-speed memory.
Wednesday 1st January 2003
A "key customer" for Entegris has completed conversion to wafer carriers made from a proprietary blend of polyetheretherketone (PEEK) and carbon fibre.
Wednesday 1st January 2003
SEMI produced its May book-to-bill figures for the North American semiconductor equipment industry. Bookings were $1.08bn and billings $0.862bn, giving a ratio of 1.26. The bookings were up 50% up on May 2001 and billings down 41%. April's book-to-bill was 1.22. VLSI Research confused matters for some by releasing its own
Wednesday 1st January 2003
US high tech company Motorola announced job reductions of 7000 people worldwide. The cut backs are due to hit all business segments and are designed to lower costs for manufacturing, R&D, sales and admin. The charges associated with the reorganisation are valued at $1.9bn. A total accounting charge of $3.5bn for this and other measures, including write-offs, is to be made. Total headcount by the end of the year is set to be 100,000 workers.

×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Smart Solar Magazine, the Smart Solar Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info
{taasPodcastNotification}