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Monday 13th January 2003
The agreement to work with IBM on future chip-making technologies puts in question AMDs relationships with other companies including Taiwan foundry UMC.
Monday 13th January 2003
Tokyo Electron Arizona (TAZ) has settled its claims of misappropriation of trade secrets and other claims against New Horizon Machine - a supplier of replacement parts that was named in pending US litigation.
Monday 13th January 2003
Toshiba launched its new 90nm TC300 process package based on its CMOS4 process. The process uses 11-layers of copper wire and a low-k dielectric. Logic densities can reach 400,000 gates/mm2
Thursday 9th January 2003
AMD and IBM have agreed to jointly develop future chip-making technologies. The new processes will be aimed at improving microprocessor performance and reducing power consumption.
Tuesday 7th January 2003
The Semiconductor Research Corporation (SRC)and North Carolina State University (NCSU)have announced a joint licensing and commercialisation partnership,focused on commercialising selected inventions arising from SRC-sponsored university research programs at North Carolina State University.
Tuesday 7th January 2003
Veeco and FEI report that they will not be able to complete their previously announced merger by December 31,2002.
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Tuesday 7th January 2003
Infineon Technologies and independent memory module manufacturer Kingston Technology have signed a long-term agreement (LTA)and a non-binding memorandum of understanding (MoU)concerning memory products.
Tuesday 7th January 2003
Nichia and Sony have reached a basic agreement to jointly develop blue-violet laser diodes for mass production.
Tuesday 7th January 2003
Mitsubishi is to act as exclusive agent for AmberWave Systems’ strained silicon technology in Japan. Strained silicon increases the speed of ICs by some 20-30% and reduces power consumption.
Tuesday 7th January 2003
SEMI has calculated a preliminary book-to-bill ratio for North American semiconductor equipment makers of 0.79 in November 2002.The three-month average for orders were worth $779mn,39%improvement on 2001.Billings were at $991mn,up 21%.
Friday 3rd January 2003
Microsystem producer PHS MEMS shareholders have approved a EUR10mn capital increase.
Friday 3rd January 2003
Credence Systems has acquired all of the assets of German mixed-signal IC test system producer SZ Testsysteme for a total of $4.7mn.
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Friday 3rd January 2003
BOC Edwards and Micell Integrated Systems (MIS) are to jointly develop and commercialise technology for dense and supercritical CO2 semiconductor wafer cleaning.
Friday 3rd January 2003
Dutch researchers have fabricated an organic electroluminescent device that shows a fully reversible voltage-dependent switch between green and red light emission (Nature, January 2, 2003).
Thursday 2nd January 2003
The World Semiconductor Trade Statistics (WSTS) organisation issued IC sales figures for November 2002. The world total came to $12.680bn, up 19.6% on November 2001.
Thursday 2nd January 2003
ON Semiconductor plans additional restructuring aiming at a return to profitability in Q4 2003. Some 4% of its world-wide staff - roughly 300 employees - is to be lost over the next twelve months.
Thursday 2nd January 2003
Tegal has sold a 903e plasma etch system into the biochip industry. Zyomyx will use the tool to produce high-throughput, massively parallel protein analysis systems based on micro-electro-mechanical system technologies.
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Wednesday 1st January 2003
The European Commission has imposed a provisional countervailing duty of 33% on imports of DRAMs (dynamic random access memories) produced by the Korean producer Hynix Semiconductor. An investigation into Hynix found that the company benefited from subsidies in the form of financing provided by government-owned or controlled Korean banks to the detriment of Europe’s chip industry, which suffered severe losses.
Wednesday 1st January 2003
The SHUTTLELINE Mission is to provide our entry-level and R&D customers with the world’s most cost effective solution for their thin-film etching and dielectric deposition requirements. All SHUTTLELINE process chambers are vacuum loadlocked. Years of experience show process-chamber isolation is necessary in order to guarantee repeatable performance. This is as true in the lab as it is in manufacturing. Process technologies available on the SHUTTLELINE include inductively coupled plasma (ICP) etching, reactive ion etching (RIE), plasma enhanced chemical vapour deposition (PECVD) and high density plasma (microwave) etching (HDP). In addition to the deposition of thin films including SiO2, Si3N4 and SiOxNy, Unaxis Semiconductors addresses etching requirements over a broad variety of materials. The following is a partial listing of materials for which starting-point etch processes exist: Dielectrics – SiO2, Si3N4, Al2O3, AlTiC, photoresist, polyimide Metals – Al, Cr, molybdenum, Ti, W, Ta Semiconductors – Si, SiC, TaSi Compound Semiconductors – GaAs, InP, AlGaAs, InGaP, InSb, GaN Due to the built-in flexibility of the SHUTTLELINE, its process technologies find applications in many markets for various device types including heterojunction bipolar (HBT) and high electron mobility (HEMT) transistors, surface acoustic wave (SAW) devices, lasers, gratings, lenses, LEDs and waveguides, along with implementation of the Bosch process for various micro-electro-mechanical system (MEMS) applications.
Wednesday 1st January 2003
SEMI made a series of awards at its SEMICON Europa trade show. The European SEMI award went to Dr Carola Blaesing of Leica Microsystems and Dr Joel Monnier of STMicroelectronics.
Wednesday 1st January 2003
BOC Edwards and Micell Integrated Systems (MIS) are to jointly develop and commercialise technology for dense and supercritical CO2 wafer cleaning.

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