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Amkor Technology is expanding its VisionPak CMOS image sensor assembly
Air Products has brought on-stream what is claimed as the worlds largest
ultra-high-purity bulk gas production facility
Agere Systems has fallen below the New York Stock Exchanges continued
listing standard relating to minimum share price
Up to 200% improvement in wafer yield
with new Kalrez® Sahara 8085 from DuPont Dow Elastomers
DuPont Dow Elastomers just launched Kalrez® Sahara 8085 at Semicon West
2002. The new compound has been specifically developed for very low
particle generation and low weight loss in plasma processes such as HDPCVD
and PECVD, and will enhance seal performance in highly aggressive
environments like NF3 and oxygen plasma
NF3 is an efficient etching tool and a product of choice for many
semiconductor chip fabricators, but under certain operating conditions may
be damaging to elastomeric seals. Kalrez® Sahara 8085 was developed with
NF3 plasma in mind.
Up to 200% improvement in wafer yield
Customers who have used Kalrez® Sahara 8085 claim that it has improved
wafer yield by as much as 200% in applications where NF3 plasma is used for
cleaning. It has demonstrated excellent mechanical properties, and is
well-suited for both static and dynamic sealing applications such as bonded
slit valve doors, bonded gate valves, gas inlets, gas orifice seals and gas
feed-through seals claims Chida.
Kalrez® Sahara 8085 complements Kalrez® Sahara 8575 to help improve
productivity and increase wafer yields, while delivering extended seal life
and reduced particle generation.
Find out more! and check our site:
or write to [email protected]
VLSI Research puts FormFactor at the top of its league table of
semiconductor probe card suppliers with sales of $70.9m. The company has
moved up three places from No.4 last year. Last year's leader, Japan
Electronic Materials, came in at No.2 with $64.4m. The top five was
completed by (in order): Kulicke & Soffa ($60.5m), Micronics Japan ($48.5m)
and Wentworth Laboratories ($30.6m). The total market was $392.5m compared
with $484.8m in 2000.
A Bell Labs researcher into nanotechnology faces an inquiry into claims that
some of the data in his papers have been falsified (Nature, May 23, and
Science, May 24). Scientists noticed similar looking graphs in different
papers by Jan Hendrick Schoen and others. He denies the charges.
Lydia Sohn of Princeton studied graphs from Science (December 7, 2001) and
Nature (October 18, 2001).
Wafer carrier producer Entegris has officially opened a newly upgraded
4500m2 facility in Gilroy CA. The $3m plant is designed to clean products
that protect and transport critical materials for the microelectronics and
medical industries such as silicon wafers, computer hard disks and
medical-related items. Initially, 160 employees will work at the plant, with
expansion expected in the coming years.
Mentor Graphics' Calibre division has reached an agreement with IMEC to
cooperate on subwavelength lithography. IMEC will use Calibre's resolution
enhancement technology (RET) software on high-numerical aperture (NA) 193nm
and 157nm processes. The organisations have collaborated informally since
1999. The new three-year agreement makes Mentor Graphics a formal member of
IMEC's industrial affiliation programs (IIAPs) for the development of
high-NA 193nm and 157nm lithography.
Intel will conduct microprocessor R&D at the Universitat Polittecnica de
Catalunya (UPC) in Barcelona, Spain. The Intel Labs Barcelona (ILB) research
centre will be operated by UPC on behalf of Intel. Intel's microprocessor
researchers will collaborate with researchers from UPC on technologies for
future Itanium (64-bit) and Pentium (32-bit) processor family designs in
terms of performance, power consumption and battery life.
SEZ has received two volume orders for its spin-processor wafer cleaning
systems within the last few weeks. The combined value of the orders is about
CHF22.2m ($13.3m). The orders are for tools for the treatment of 200mm and
300mm wafers and are expected for delivery this year. One follow-on order
came from a foundry in Singapore for the 200mm double chamber Spin-Processor
223. Orders for the 300mm Spin-Processor 304 came from the US.
Infineon Technologies's Munich Research Labs has extended present integrated
circuit wiring to smaller feature sizes. The resulting wiring met electrical
reliability requirements for future chip generations extending to the 2010
timeframe. The electrical assessment covered sub-70nm metal lines down to
40nm line widths, embedded in grooves of a dielectric film. Metal lines as
narrow as 55nm are expected to be used for IC production in 2010.
Fujitsu Microelectronics is introducing a 90nm process technology which will
require $700m to develop from now until 2005. Prototype production of 90nm
devices has begun at Fujitsu's Akiruno technology centre in Japan.
IBM has developed RF MEMS (micro-electro-mechanial system) resonator and
filter components, aiming at the wireless market. The company says it has
used standard production materials and a low-temperature BiCMOS compatible
fabrication process (no more than 400C). IBM believes device manufacturers
could roll out wireless devices integrated with such MEMS components in
Building work on the Advanced Mask Technology Center (AMTC) in Dresden,
Germany, kicked off with laying of the cornerstone. The AMTC is an
equally-owned joint venture of AMD, Infineon Technologies and DuPont
Photomasks (Bulletin 433, May 20, 2002) aimed at the development and pilot
manufacturing of advanced photomasks.
French microsystems producer TRONIC'S and CEA Leti (the Laboratory for
Electronic and Information Technologies of the French Atomic Energy
Commission) have signed a three years R&D contract concerning SOI-based MEMS
Advanced Power Technology has formed Advanced Power Technology RF (APT-RF)
as a result of the integration of the RF businesses of APT and of two RF
acquisitions - GHz Technology (January 2002) and Microsemi RF Products
(completed at the end of May 2002).
APT-RFproduces VDMOS (vertical diffusion metal oxide semiconductor), LDMOS
(lateral DMOS) and bipolar devices for high and very/ultra high frequency