News Article
A New Star For MEMS
Fraunhofer IMS and Point 35;Microstructures announce integrated a-SI process module for MEMS
Point 35 Microstructures inconjunction with the Fraunhofer Institut, has announce a new memsstar processmodule solution for advanced MEMS processing. The module uses amorphous silicon, which is more commonly known as a-Si,as a sacrificial layer in the construction of MEMS.
"We have developed a full equipmentand process solution for MEMS developers and manufacturers based upon excellentPECVD and SVR etch performance supplied by the memsstar brand, which we can nowjointly take into the market," said Professor Holger Vogt from Fraunhofer IMS. "Wehave developed thin and thick film technology which can be doped or undoped andwill enable MEMS devices to be created using standard materials within existingwafer fabs and on standard equipment."
"We are already seeing fast growingsales and a pipeline of development projects, as a direct result of our jointdevelopment with Fraunhofer IMS" said Mike Leavy, CEO and co-founder of Point35 Microstructures. "The ability to implement qualified sacrificial etchschemes using efficient proven equipment, enables MEMS organisations to reducedevelopment time and get their new devices to market faster. The world classprocessing capability of memsstar in conjunction with Fraunhofer IMS is verypowerful for customers who are developing new MEMS products."
The new module enables the a-Sifilm to be deposited in a modified industry standard PECVD reactor as asacrificial etch layer, for subsequent isotropic release etching using thememsstar SVR system. The module has fully characterized etch selectivity tomany other materials, fast etch rates and excellent uniformity andrepeatability. This integrated process sequence can be used within standardCMOS facilities and on top of CMOS wafers if required which will enable manypossible new applications.
The memsstar system uses vapourphase single wafer processing for the release etch and surface modification processsteps as required in most MEMS devices. With unique CCFT™ process controltechnology and an extensive range of chemistries, users get a wide processwindow and integrated process controls which far exceed other currentlyavailable systems and methods.
memsstar systems deliver fastthroughput, small footprint, low consumption and emissions, scalable platforms,process controls and high repeatability at a low entry level cost. Systemconfigurations can be matched to suit any situation from R&D to highthroughput production - with seamless transfer between environments. Applicationsinclude motion sensors, micro displays, silicon microphones, fluidic channels,bolometer arrays, pressure sensors and many others.
"We have developed a full equipmentand process solution for MEMS developers and manufacturers based upon excellentPECVD and SVR etch performance supplied by the memsstar brand, which we can nowjointly take into the market," said Professor Holger Vogt from Fraunhofer IMS. "Wehave developed thin and thick film technology which can be doped or undoped andwill enable MEMS devices to be created using standard materials within existingwafer fabs and on standard equipment."
"We are already seeing fast growingsales and a pipeline of development projects, as a direct result of our jointdevelopment with Fraunhofer IMS" said Mike Leavy, CEO and co-founder of Point35 Microstructures. "The ability to implement qualified sacrificial etchschemes using efficient proven equipment, enables MEMS organisations to reducedevelopment time and get their new devices to market faster. The world classprocessing capability of memsstar in conjunction with Fraunhofer IMS is verypowerful for customers who are developing new MEMS products."
The new module enables the a-Sifilm to be deposited in a modified industry standard PECVD reactor as asacrificial etch layer, for subsequent isotropic release etching using thememsstar SVR system. The module has fully characterized etch selectivity tomany other materials, fast etch rates and excellent uniformity andrepeatability. This integrated process sequence can be used within standardCMOS facilities and on top of CMOS wafers if required which will enable manypossible new applications.
The memsstar system uses vapourphase single wafer processing for the release etch and surface modification processsteps as required in most MEMS devices. With unique CCFT™ process controltechnology and an extensive range of chemistries, users get a wide processwindow and integrated process controls which far exceed other currentlyavailable systems and methods.
memsstar systems deliver fastthroughput, small footprint, low consumption and emissions, scalable platforms,process controls and high repeatability at a low entry level cost. Systemconfigurations can be matched to suit any situation from R&D to highthroughput production - with seamless transfer between environments. Applicationsinclude motion sensors, micro displays, silicon microphones, fluidic channels,bolometer arrays, pressure sensors and many others.
