Info
Info
News search:

< Page of 136 >

News


Monday 10th March 2003
US semiconductor equipment developer Silicon Genesis Corporation (SiGen) has successfully developed a new strained silicon method to create high carrier mobility layers. The process is applicable to the fabrication of strained-silicon bulk wafers and strained-silicon silicon-on-insulator (SOI) wafers.
Monday 10th March 2003
US semiconductor equipment developer Silicon Genesis Corporation (SiGen) has successfully developed a new strained silicon method to create high carrier mobility layers. The process is applicable to the fabrication of strained-silicon bulk wafers and strained-silicon silicon-on-insulator (SOI) wafers.
Friday 7th March 2003
Silicon-on-insulator (SOI) wafer manufacturer Soitec has acquired assets of the French epitaxial wafer supplier Picogiga. Soitec will support existing Picogiga customers and core business - growing epitaxial layers on compound-semiconductor substrates. The business mainly uses gallium arsenide (GaAs) substrates, with layers deposited via molecular beam epitaxy (MBE). Soitec plans to apply its Smart Cut technology to compound materials. Smart Cut uses wafer bonding with a hydrogen implant to cut off thin layers on a substrate.
Thursday 6th March 2003
Shipley Company, L.L.C., is a world leader in electronic materials and process technology development. As part of the $1 billion Rohm and Haas Company Electronic Materials Business Group (NYSE: ROH), Shipley delivers exceptionally innovative technologies across a broad range of applications. These platforms include advanced circuit board technology, semiconductor manufacturing and advanced packaging. Our products are integral elements in cell phones, smart cards, computers, flat panel displays, automotive electronics and equipment that power the internet, and much more. Additional information is available at www.shipley.com. Click here to access product guide downloads
Tuesday 4th March 2003
Optical switch array module maker OMM will cease operations as of Friday March 7, 2003. The company plans to release all of its 85 employees and assign the assets to the benefit of creditors.
Tuesday 4th March 2003
An Israeli organic semiconductor technology company, Nanolayers, has become the first firm to receive funding approval from Israels new Heznek programme, administered by the Office of the Chief Scientist.
Info
Tuesday 4th March 2003
The World Semiconductor Trade Statistics organisation reported a 22% year-on-year increase in its January 2003 world sales figures. The January total was $12.2bn consisting of $2.47bn for Europe (+16.0%), $2.71bn for Japan (+34.0%), $4.51bn for Asia-Pacific (+32.6%) and $2.54bn for the Americas (+2.8%).
Monday 3rd March 2003
Shipley Company, L.L.C., is a world leader in electronic materials and process technology development. As part of the $1 billion Rohm and Haas Company Electronic Materials Business Group (NYSE: ROH), Shipley delivers exceptionally innovative technologies across a broad range of applications. These platforms include advanced circuit board technology, semiconductor manufacturing and advanced packaging. Our products are integral elements in cell phones, smart cards, computers, flat panel displays, automotive electronics and equipment that power the internet, and much more. Additional information is available at www.shipley.com.
Monday 3rd March 2003
International Conference on the Commercialization of Micro and Nanosystems (COMS), September 8-11, 2003, Amsterdam, The Netherlands.
Monday 3rd March 2003
Ashland Electronic Chemicals is to be the primary outsourcing manufacturer for ASMLs Thermal division under a multi-year contract. The agreement includes responsibility for sourcing and procurement of all materials, and assembly and testing of all toolsets. ASML Thermal offers large-batch and single-wafer thermal process furnaces and atmospheric pressure chemical vapour deposition (APCVD) systems.
Monday 3rd March 2003
The worldwide semiconductor market is forecast to grow 8.9% in 2003, with revenue totalling $167bn, up from $153.4bn in 2002, according to quarterly forecast estimates from Gartner Dataquest. The slowdown at the end of 2002 is continuing in Q1 2003.
Monday 3rd March 2003
University of Illinois at Chicago (UIC) researchers have developed a method for growing conducting polymers called Surface Polymerisation of Ion-Assisted Deposition or SPIAD (Journal of the American Chemical Society, online since February 6 and in print March 5, 2003).
Info
Monday 3rd March 2003
Test system producer Agilent Technologies has opened two new facilities on the Malaysian island of Penang.
Monday 3rd March 2003
National Semiconductor is seeking to sell its Information Appliance unit, consisting primarily of the Geode family of products, as well as its cellular baseband business.
Saturday 1st March 2003
Agere Systems was claiming it has 21 "breakthrough" transistor products aimed at the wireless power amplifier market for 2-3G base station equipment.
Friday 28th February 2003
Work on a unified European Union patent continues, according to an interview with the Greek R&D general secretary Demetrios Deniozos. Germany has proposed an initial stage of mobile judges and the establishment of specialised patent courts in member states to be used in a transitional period to a centralised court based in Luxembourg.
Thursday 27th February 2003
French president Jacques Chirac inaugurated the Crolles2 Alliance of Philips, Motorola and STMicroelectronics. The joint R&D centre will pioneer CMOS technology from 90nm processes to 32nm over the next five years and also includes a 300mm wafer semiconductor manufacturing pilot line, which is now beginning operation. Taiwan foundry TSMC also has participation in the work in terms of process development and alignment.
Thursday 27th February 2003
This year Europa is being held much earlier - April 1st to April 3rd so dont miss out on getting some exposure, for there is only one email newsletter people will be looking at! European Semiconductor will be the publication that most visitors will use to keep up with the important European events and we have several channels which will help you get the right exposure running up to Semicon Europa. Our weekly email newsletter Eurosemi PLUS has now established itself as Europes primary weekly news vehicle with over 6,000 ACTIVE subscribers. On a Weekly basis, companies such as Dupont Dow Elastomers, Applied Materials, Donaldson and many more regularly utilise our newsletter to meet both awareness and lead generation needs. CLICK HERE TO REQUEST A NEWSLETTER SPONSORSHIP OR MAGAZINE ADVERTISING QUOTE
Info
Thursday 27th February 2003
Electron microscope and ion-beam system producer FEI opened a new 8600m2 site in Brno, Czech Republic. This new facility replaces a previous building in Brno and features extensive space for expanded production, research and development capabilities, and enhanced field service and support. FEI currently has 164 employees in the city.
Wednesday 26th February 2003
Researchers from Munich-based universities and from German chemical company Covion have developed a class of electroluminescent (EL) polymers that can be patterned in a way similar to standard lithography photoresists (Nature, February 20, 2003).
Wednesday 26th February 2003
Infineon Technologies and Saifun Semiconductors of Israel have set up Infineon Technologies Flash GmbH & Co. KG to develop Flash memory products. The joint venture has plans to integrate DRAM and Flash expertise.
Wednesday 26th February 2003
Micron Technology announced a series of cost-reduction initiatives including a 10% cut (approximately 1800 people) in its global workforce. The company says it wants to capitalise on the its aggressive migration to 0.11micron manufacturing process technology. The company will focus on products based on its latest generation process technology and will lower costs and expenses.
Wednesday 26th February 2003
SEMIs book-to-bill ratio for North American semiconductor equipment suppliers was 0.92 in January 2003 (preliminary). Three month average bookings were worth $742mn, 15% up on January 2002. Billings were $806mn, a nominal growth of 1% on January 2002. The final ratio for December 2002 was 0.94.
Wednesday 26th February 2003
VLSI Research released its top ten semiconductor equipment suppliers for 2002 based on revenues. US and Japanese companies dominated the listing with only one European company - lithography system producer ASML at No.3 with $1.875bn in revenues.

Your First Name
Your Email Address
Next »Close
 
×
Search the news archive

To close this popup you can press escape or click the close icon.
Logo
×
Logo
×
Register - Step 1

You may choose to subscribe to the Smart Solar Magazine, the Smart Solar Newsletter, or both. You may also request additional information if required, before submitting your application.


Please subscribe me to:

 

You chose the industry type of "Other"

Please enter the industry that you work in:
Please enter the industry that you work in:
 
X
Info
X
Info