News

Thursday 27th March 2003

Cambridge Display Technology (CDT) says that it has dramatically improved the life performance of display devices based on light emitting polymer (LEP) technology, achieving more than 11,000 hours of operation for its blue polymer research devices.

Thursday 27th March 2003

Infineon Technologies announced availability of "Flow-Thru" biochips and a matching complete analysis system. Infineon markets the products with its US partner company, MetriGenix. The biochips are miniaturised sample substrates made of silicon, on which hundreds of simultaneous biomolecular tests can be performed using optical evaluation techniques. The Infineon biochip uses a three-dimensional micro-array - a network of fine micro-channels that run between the upper and the lower side of the chip. In contrast, traditional planar biochips on glass substrates have a two-dimensional sensor surface. Analysis using the Flow-Thru Chip (FTC) is a multi-step process. The micro-channels of the biochip are prepared by MetriGenix, which populates the chip with segments of known genes that fix themselves on the walls of the micro-channels. Then the gene sample to be analysed is repeatedly pumped back and forth through the pores in the Flow-Thru technique. This causes matching genes of the sample to bind with known genes on the pore wall. A luminescent dye is added in another step, binding with the matched gene segments. The dye emits light that is captured by a CCD (charge coupled device) camera and forwarded to a computer.

Thursday 13th March 2003

US and European scholars are to converge on the University of South Carolina (USC) during March 20-23, 2003, for the first of two international conferences to discuss the social implications of nanoscale science and technology on a global scale. The conference will examine the philosophy, ethics, politics and culture of nanoscience.

Thursday 13th March 2003

Georgia Institute of Technology researchers will describe a nanometre scale optoelectronic device that can perform addition and other logical operations in the coming issue of the US Proceedings of the National Academy of Sciences (March 18).

Thursday 13th March 2003

Light emitting polymer (LEP) developer Cambridge Display Technology (CDT) is to provide its full colour ink-jet printing manufacturing technology and process knowledge to DuPont Displays for use in LEP organic light emitting diode (OLED) manufacturing.

Thursday 13th March 2003

Japanese company Seika is to become the exclusive distributor in China for products based on Soitecs proprietary Smart Cut technology. Seika will staff its Shanghai office with a sales force dedicated to Soitecs offerings.

Thursday 13th March 2003

Toshiba introduced a 2Gbit single-die NAND Flash memory with double the capacity of the companys present largest single-die NAND Flash device. Toshiba also announced a 4Gbit NAND Flash IC that stacks two of the 2Gbit NAND Flash dies in a single package.

Thursday 13th March 2003

Aixtron has delivered its first commercially available organic vapour phase deposition (OVPD) research system to Princeton University (PU). The researchers will use the tool for the deposition of state-of-the-art organic materials (plastics).

Thursday 13th March 2003

IMEC and International SEMATECH (ISMT) have agreed joint work together on advanced technology aimed at speeding the development of 157nm lithography. In parallel, several collaboration agreements between IMEC and leading IDMs are also under negotiation.

Thursday 13th March 2003

Indium Corporation will be at Semicon Europa to exhibit a wide range of new and established high performance interconnect products. Distributors are worldwide with manufacturing facilities in USA, UK and Singapore. Indium has been supplying high quality products since 1934. NEW Lead free Chip Attachment Solder CP-6106 & CP6121 are nitrogen reflow, no clean solder pastes with Type 6 (15 – 5) powder, specifically formulated for flip clip attachment. Indium provides type 6 SnAg and SnAgCn lead-free solder powder to be compatible with the flux for excellent stencil release for ultra-fine pitch printing. Flip Chip Epoxy Fluxes PK-001 and PK-002 are Halide Free No-Clean fluxes for Flip Chip or CSP soldering, designed for use with Sn62 and Sn63 Eutectic Solders. They provide a powerful metal surface, oxide cleaning capability during reflow and help good soldering. Benefits include compatibility with standard underfill materials and conformal coating. PK-001 and PK-002 are VOC free and environmentally friendly. Precision Spheres Indium has for many years manufactured spheres with highly accurate diameters, bright shiny surfaces and highly spherical shapes. SPC supports sphere production. All spheres are made from pure metals, which combine to produce exact alloy compositions and are classified for size in an automated, high capacity process for smooth bright surfaces. A wide variety of alloys and sizes are available. Interconnect Flux WS-363 - Water-soluble, Halide-free for BGA bumps W-363 Interconnect Flux is a high viscosity paste-type flux for use in high yield BGA bumping, board level attachment and rework. Benefits include excellent cleanability. Residues are removed at room temperature with DI water. Also stencil printable with high tack, Halide-free with excellent solderability. Support Products from Indium Indium supplies a full range of chip-scale assembly products, including TACFLUX™ high viscosity fluxes to hold spheres in place during the attachment process, our patented INTEGRATED™ Solder Preform Arrays for BGA fabrication and repair applications. Flip Chip Fluxes, Die Attach Adhesives and a full range of solder pastes for attachment and bumping applications. Visit SEMICON Europa booth A1.621 or our website www.indium.com We look forward to seeing you. If you will not be present at the exhibition, please contact us at: Email : [email protected] Tel : + 44 (0) 1908 580400 Web : www.indium.com

Thursday 13th March 2003

Click Here To Receive 2004 Catalogue... VAT is the worlds largest manufacturer of vacuum valves. Design and manufacture is based in Switzerland. A network of regional customer support, sales and distribution offices are located around the world. VAT employs around 500 people globally. Customer service is the most important focus in all activities within the company. VAT is a well established and key supplier to the Semiconductor Industry. The main product ranges supplied within the industry are Gate Valves, Angle Valves, Adaptive Pressure Control Valves, Wafer Transfer Valves, Edge Welded Bellows and Seals. VAT devotes a high level of resources and people to product innovation and development. With the fast technology cycles within the industry, bringing new products to the market quickly, whilst still ensuring total reliability, with the highest possible level of support is the basis on which VAT have built its excellent reputation on. Gate Valves: High and ultra high vacuum valves from DN16 to DN1000 and above. These valves are typically used for pump isolation or chamber to chamber isolation. Angle Valves: In the size range DN16 to DN160 and above. These valves are used in a variety of applications from gauge and backing line isolation to gas inlet systems and rough pumping. Adaptive Pressure Control Valves: A very wide range of butterfly, gate and pendulum valves for downstream pressure control. Wafer Transfer Valves: Rectangular slit valves typically used to between process chambers and load locks or robot chambers. These valves are available in a range of sizes suiting all standard wafers up to 300mm and larger on request. Edge Welded Bellows: VAT run a bellows manufacturing facility that is able to produce custom bellows to exactly meet each individual requirement. Bellows are produced to either customer drawings or VAT produced drawings. Seals: VAT has nearly 40 years experience with specifying, designing and manufacturing sealing systems. During the last few years many semiconductor processes have become significantly more aggressive in terms of seal degradation. This has led to an ever increasing number of seal compounds being available on the market. VAT has extensive experience in working with these materials. Contact VAT to discuss the valve and sealing requirements for your process. You will be assured of the highest quality solution with the lowest possible cost-of-ownership". Click Here To Receive 2004 Catalogue...

Wednesday 12th March 2003

NuTool has delivered its 300mm LuminaCu integrated system to "a leading European semiconductor manufacturer". The tool is configured with the companys patented Electrochemical Mechanical Deposition (ECMD) and Reverse Linear CMP (RL-CMP) process modules for Cu damascene technology development at the 65nm technology node and beyond.

Wednesday 12th March 2003

RF IC supplier Sirenza Microdevices has received a US patent for a "Microwave Field Effect Transistor Structure on Silicon Carbide" No. 6,521,923. This is Sirenzas first patent for the "silicon on silicon carbide" (SiSiC) class of semiconductors.

Wednesday 12th March 2003

Toshiba is planning to invest JPY350bn in 300mm before March 2007. With other investments, the companys annual spend on semiconductor technology is expected to be JPY130bn. This compares with Toshibas total 2002 spending of JPY204bn and projected investments of JPY840bn in the three years to March 2006.

Wednesday 12th March 2003

The official cornerstone laying ceremony marks progress on Wacker Siltronics new 300mm raw wafer production facility in Freiberg, Germany.

Wednesday 12th March 2003

Intel plans to push its way into the wireless networking market with its "Centrino" mobile technology. Centrino combines the Pentium M processor, Intels 855 Chipset Family and the Intel PRO/Wireless 2100 Network Connection.

Tuesday 11th March 2003

Amkor Technology and Sharp have agreed to unify the design for 3D system in package assembly for the stacking of very thin packages. Target markets are ASICs, DSPs and memories for cell phones, PDAs, digital still cameras.

Tuesday 11th March 2003

Oxford Instruments Superconductivity is joining the UK Cryogenic Instrumentation for Quantum Electronics Collaboration. The company will supply cryogenic consultancy and an ultra low temperature (ULT) system to enable the extremely low temperature environments essential for research into quantum electronics, quantum computing and quantum nanotechnology.

Tuesday 11th March 2003

US semiconductor equipment developer Silicon Genesis Corporation (SiGen) has successfully developed a new strained silicon method to create high carrier mobility layers. The process is applicable to the fabrication of strained-silicon bulk wafers and strained-silicon silicon-on-insulator (SOI) wafers.

Tuesday 11th March 2003

Hynix Semiconductor introduced what it says is commercially applicable FeRAM (ferroelectric RAM) - a non-volatile, low power, high-density and high-speed memory. Hynix has used the ferroelectric material BLT (bismuth lanthanum titanate).

Monday 10th March 2003

Cypress Semiconductor achieved functional silicon for highest-density static memory (SRAM) on its six-transistor 90nm RAM9 process technology. The 72Mbit synchronous SRAM is designed to operate at the speeds needed for the OC-48 optical networking standard.

Monday 10th March 2003

Theta 300 provides the perfect solution for characterizing thin films on tomorrows semiconductor devices. Its unique, non-destructive, technology provides dose, distribution, layer thickness, purity, uniformity and composition measurements from any point on the wafer. Not only will it measure elemental compositions but it will also provide chemical state information. It detects the presence, nature and thickness of buried interface layers. Theta 300 measures contaminants in the layer, at the surface and at the interfaces. Theta 300 is ideally suited to the metrology of gate dielectrics, including oxynitrides and newer materials such as hafnium oxide. Theta 300 accommodates wafers up to 300mm and thicker specimens, such as packaged devices. It provides metrology, QC and R&D facilities with a powerful new tool to accelerate the development of tomorrow’s semiconductor devices. Theta 300 can also be configured with an additional, side-mounted transfer chamber for FOUP, cassette, or clean-room applications. Click here for the application form for a copy of the Theta 300 interactive presentation CD.

Monday 10th March 2003

Theta 300 provides the perfect solution for characterizing thin films on tomorrows semiconductor devices. Its unique, non-destructive, technology provides dose, distribution, layer thickness, purity, uniformity and composition measurements from any point on the wafer. Not only will it measure elemental compositions but it will also provide chemical state information. It detects the presence, nature and thickness of buried interface layers. Theta 300 measures contaminants in the layer, at the surface and at the interfaces. Theta 300 is ideally suited to the metrology of gate dielectrics, including oxynitrides and newer materials such as hafnium oxide. Theta 300 accommodates wafers up to 300mm and thicker specimens, such as packaged devices. It provides metrology, QC and R&D facilities with a powerful new tool to accelerate the development of tomorrow’s semiconductor devices. Theta 300 can also be configured with an additional, side-mounted transfer chamber for FOUP, cassette, or clean-room applications. Click here for the application form for a copy of the Theta 300 interactive presentation CD.