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Thursday 17th April 2003
Researchers from the University of California Berkeley and the Lawrence Berkeley US National Laboratory have produced single crystal gallium nitride nanotubes of inner diameters ranging from 30nm to 200mm (Nature, April 10, 2003).
Thursday 17th April 2003
TSMC announced new production data on its 0.13micron processes as well as a status report for 90nm. More than 230 product designs have been taped out to TSMCs 0.13micron processes and more than 100,000 0.1micron wafers shipped to date.
Thursday 17th April 2003
Intel has produced Flash memory products for cell phones with up to five ultra-thin stacked memory chips for lower power consumption and optimal space savings.
Thursday 17th April 2003
Semico Research believes that for many applications multi-chip system-in-packages (SiPs) will be preferred over system-on-chips (SoCs). The market researcher predicts that SiP contract packaging revenue will increase from $82.0mn in 2002 to $747.9bn in 2007, a compound annual growth rate (CAGR) of 55.6%
Thursday 17th April 2003
Tessera is claiming the world’s first chip-scale packaging technology for integrated radio frequency (RF) module production with its Pyxis platform. The technology builds upon Tessera’s microBGA package while integrating various other features such as flip-chip, integrated passives in silicon and on polyimide, as well as novel electromagnetic interference (EMI) shielding. Along with a new licence, Tessera is offering a full suite of RF services, design tools and libraries.
Thursday 17th April 2003
ASM International (ASMI) has reached a settlement agreement with Genus concerning patent litigation pending between them. Under the terms of the agreement, ASM has the right to immediately appeal the US District Court’s claim construction rulings on ASM’s US patents Nos.6,015,590 and 5,916,365 relating to atomic layer deposition (ALD).
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Wednesday 9th April 2003
ASM Internationals European subsidiary has shipped its first A4ALD vertical furnace for its proprietary Atomic Layer CVD (ALCVD) to a customer. The batch system was installed and qualification of the first process was successfully completed.
Wednesday 9th April 2003
Theoretical calculations from Belgiums Universite de Liege suggest a lower limit to the useful thickness of ferroelectric layers (Nature, April 3, 2003). The researchers modelled a BaTiO3 thin film between two electrodes (SrRuO3). The electrodes in short circuit lost their ferroelectric properties below a critical thickness of six unit cells (24Angstroms). The scientists say that dipoles at the ferroelectric-metal interface create a depolarising electrostatic field.
Wednesday 9th April 2003
Most semiconductor back-end manufacturers are still using obsolete analog cameras in their vision systems. You can reach your "analog goes digital" goal with the newest line of area scan cameras, the A600f series, recently developed by Basler Vision Components (Basler-VC). These CMOS sensor based cameras have a full frame shutter and an IEEE 1394 interface. At full (657 x 491) resolution, the cameras can operate at up to 100 frames per second or even more when the Area of Interest (AOI) feature is used. When combined with the Basler BCAM 1394 Driver and a standard 1394 PC adapter board, A600f cameras offer a low cost, plug and play solution. The cameras also feature user definable I/O ports, which add increased flexibility in industrial applications. The slim, compact shape of the A600f cameras (29 mm x 44 mm x 65.7 mm) means that they will easily fit into the space occupied by many common analog cameras without major changes to the mechanical mounting system. For more information, please contact us at +49 4102 463-500, e-mail us at [email protected] or visit us on the web at http://www.basler-vc.com Further information: Basler Vision Technologies An der Strusbek 60 - 62 22926 Ahrensburg Germany Dorothea Brandes - Vision Components Tel. +49 4102 - 463 551 Fax: +49 4102 - 463 599 E-Mail: [email protected] Internet: www.basler-vc.com
Wednesday 9th April 2003
European companies SUSS MicroTec and DELTA (Danish Electronics, Light & Acoustics) have launched MEMUNITY, a knowledge forum on micro-electro-mechanical system (MEMS) testing. Forum activity will include news, technical papers and conference dates. Members will be able to submit devices that will then be evaluated for their test suitability without obligation. If suitable, and so desired, equipment will be configured according to their specific testing needs.
Wednesday 9th April 2003
Agere Systems claims to be the world’s first company to deliver a production-qualified, communications chip using low-k dielectric 0.13micron technology. The ultra-high performance, all-copper semiconductor technology has been used to produce a digital signal processor (DSP). Lucent Technologies is among the first companies to use the new chip for wireless base station production.
Wednesday 9th April 2003
Intel and Taiwan’s VIA Technologies have reached a settlement agreement in a series of pending patent lawsuits related to chipsets and microprocessors. The agreement encompasses 11 pending cases in five countries involving 27 patents. Under the settlement, both companies will dismiss all pending legal claims in all jurisdictions. The companies also entered into a ten-year patent cross license agreement covering each company’s products. As part of the agreement Intel granted VIA a licence to sell microprocessors that are compatible with the x86 instruction set but not pin compatible or bus compatible with Intel microprocessors.
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Wednesday 9th April 2003
German company XTREME technologies has shipped its first prototype of an extreme ultraviolet (EUV) light source to UK microstepper manufacturer Exitech. The source will be used under a strategic research partnership for next-generation lithography. XTREME is a nanotechnology 50-50 joint venture between Lambda Physik and Jenoptik. The EUV source uses a pulsed electrical high power discharge and the pinch effect to generate a 200,000C hot plasma to emit the light.
Wednesday 9th April 2003
The worldwide wafer fab equipment market showed signs of improvement early in 2002, but those early hopes never materialised, says market research company Gartner. Worldwide wafer fab equipment revenue in 2002 came to $16.5bn, a 31.6% decline from 2001 revenue of $24.1bn.
Tuesday 8th April 2003
STMicroelectronics reports that preliminary data show net revenues for Q1 2003 (ended March 29, 2003) are expected to be $1.618bn, just slightly below the low end of its guidance range of $1.620bn. Gross margin should be around 35%, below the bottom of the previous guidance range of 36%. ST says it experienced order push-outs in March relating to a number of its end markets, with the notable exception of digital consumer. It expects the majority of the affected products to be shipped in Q2 2003. Gross margin for Q1 2003 was penalised by greater-than-expected pricing pressure and a stronger Euro. Previous revenue guidance was given January 22, 2003. ST will report its full Q1 2003 earnings on April 23, 2003.
Tuesday 8th April 2003
The World Semiconductor Trade Statistics shows sales of $111.8bn in February, an 18% increase on February 2002.
Monday 7th April 2003
Tokyo Electron (TEL) has reached its 40th year in business. The company was established in 1963 in Tokyo as an affiliate of Tokyo Broadcasting Systems. TEL began as an exporter of VTRs and car radios and an importer of electronic equipment and parts. Forty years and multiple generations of technologies later, TEL has become a leading supplier to semiconductor production equipment and flat panel display (FPD) manufacturers. Its global infrastructure spans 12 countries and more than 80 locations. The official anniversary date is November 11, 2003, with various events planned in the build-up to this. Soitec has appointed Pascal Mauberger to the newly created position of chief operating officer (COO).
Monday 7th April 2003
Entegris has added manufacturing capabilities at its facility in Bad Rapaneau, Germany, with installation of a new automated manufacturing line. This capability enables Entegris to manufacture out of Germany both 150mm and 200mm Ultrapak wafer carriers for the semiconductor industry. Ultrapak is designed to protect and transport silicon wafers by eliminating wafer rotation and by reducing contamination. The products are constructed from ultrapure polypropylene materials to provide a clean shipping environment, decreasing particle generation and outgassing and increasing product shelf life.
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Monday 7th April 2003
Dialog Semiconductor is planning to close its Swedish subsidiary. The decision is designed to control both costs and headcount. The company says that it has decided to focus on its core competence, which is the design and manufacture of ICs. The Swedish facility has a staff of 40 people, the majority of whom are employed in auxiliary tasks such as development of evaluation boards and software. A company spokesman says that these activities can be covered at lower cost through staff at other company locations and through outsourcing.
Monday 7th April 2003
Infineon Technologies has developed with others a self-service system for users of Vienna’s new multimedia main library. The inventory includes 240,000 books as well as 60,000 CDs and DVDs. The items have been equipped with radio chips for data transmission. Use of the new RFID (radio frequency identification) chips permits library users to check out books, CDs or DVDs themselves, without waiting in line at a service counter. The RFID chips from Infineon also provide security functions to prevent theft. Seven read and write units are used to embed the RFID chips into the books and to store the information on the chips. Another six read and write units are available to the attendants to register the checked-out media. In addition, four self-service terminals, so-called EasyChecks, are available.
Monday 7th April 2003
Motorola says it has demonstrated the world’s first 4Mbit memory based on silicon nanocrystals. The company sees the fully functional test chip as a major milestone in the search for successors to floating gate-based flash memories. Many believe Flash will not continue to scale to smaller geometries.
Sunday 6th April 2003
IMEC has extended its industrial affiliation programme (IIAP) on high-k dielectrics for (sub)-65nm devices to provide solutions for the implementation of metal gate stacks in planar-scaled CMOS. The current standard gate stack uses polysilicon above the dielectric.
Sunday 6th April 2003
Renesas Technology has officially separated from its parents Hitachi and Mitsubishi Electric and commenced operations as a system IC company. Dr Koichi Nagasawa has been appointed chairman and CEO, and Satoru Ito was appointed as president and chief operations officer.
Sunday 6th April 2003
IMEC has described two developments in semiconductor R&D with the extension of its industrial affiliation programme (IIAP) on high-k dielectrics for (sub)-65nm devices to provide solutions for the implementation of metal gate stacks in planar-scaled CMOS and development of a post-processing technique to create high-Q inductors.

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