News Article
Fraunhofer IMS Etches MEMS With SVR
The institute installs the latest memsstar Technology SVR etch capability.
memsstar Technology, etch and deposition equipment supplier to the global MEMS industry, announced the successful installation and process qualification of one of its SVR (Sacrificial Vapour Release) etch systems.
As part of a further expansion of advanced capabilities for microsystems, Fraunhofer IMS has selected and installed the latest memsstar SVR system. This will be used for in the latest MEMS devices for advanced isotropic etch “release” schemes. The need to create microsystems that are integrated with electronics and other technologies requires new approaches to etching and the memsstar SVR functionality enables this capability.
“We selected memsstar SVR to get the best MEMS etch process capabilities as well as excellent process control and repeatability” said Professor Holger Vogt from Fraunhofer IMS. The system will be used across a range of devices, materials and designs, and will be integrated with other process steps to offer complete process modules.
“The MEMS industry increasingly requires innovative research and manufacturing equipment solutions for release etching and coating, which were not available before memsstar” said Mike Leavy, CEO and co-founder. “Europe is a world leader in the development of advanced MEMS technology and we are proud to be working with the Fraunhofer Institute on this project.”
memsstar uses vapour phase single wafer processing for the release etch and surface modification process steps as required in most MEMS devices. With unique CCFT process control technology and an extensive range of chemistries, users get a wide process window and integrated process controls which far exceed other currently available systems and methods. memsstar systems deliver fast throughput, small footprint, low consumption and emissions, scalable platforms, process controls and high repeatability at a low entry level cost. System configurations can be matched to suit any situation from R&D to high throughput production, with seamless transfer between environments. Applications include motion sensors, micro displays, silicon microphones, fluidic channels, bolometer arrays, pressure sensors and many others.
As part of a further expansion of advanced capabilities for microsystems, Fraunhofer IMS has selected and installed the latest memsstar SVR system. This will be used for in the latest MEMS devices for advanced isotropic etch “release” schemes. The need to create microsystems that are integrated with electronics and other technologies requires new approaches to etching and the memsstar SVR functionality enables this capability.
“We selected memsstar SVR to get the best MEMS etch process capabilities as well as excellent process control and repeatability” said Professor Holger Vogt from Fraunhofer IMS. The system will be used across a range of devices, materials and designs, and will be integrated with other process steps to offer complete process modules.
“The MEMS industry increasingly requires innovative research and manufacturing equipment solutions for release etching and coating, which were not available before memsstar” said Mike Leavy, CEO and co-founder. “Europe is a world leader in the development of advanced MEMS technology and we are proud to be working with the Fraunhofer Institute on this project.”
memsstar uses vapour phase single wafer processing for the release etch and surface modification process steps as required in most MEMS devices. With unique CCFT process control technology and an extensive range of chemistries, users get a wide process window and integrated process controls which far exceed other currently available systems and methods. memsstar systems deliver fast throughput, small footprint, low consumption and emissions, scalable platforms, process controls and high repeatability at a low entry level cost. System configurations can be matched to suit any situation from R&D to high throughput production, with seamless transfer between environments. Applications include motion sensors, micro displays, silicon microphones, fluidic channels, bolometer arrays, pressure sensors and many others.
