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Fujitsu Has Stacked Six Chips In A High-density
Fujitsu has stacked six chips in a high-density, large-scale multi-chip package (MCP). The assembly includes three flash, one SRAM, and two Fast Cycle RAM (FCRAM) devices in a single package for cellular phone applications.
Fujitsu has stacked six chips in a high-density, large-scale multi-chip package (MCP). The assembly includes three flash, one SRAM, and two Fast Cycle RAM (FCRAM) devices in a single package for cellular phone applications.
The MCP uses Fujitsus new Package Stacked Multi-chip Package (PS-MCP) technology to bond a pair of packages into a single unit that includes all six memory chips. The package is divided into two independent data buses, so data and programs can be processed simultaneously. PS-MCP was introduced in March 2002. The MB84VY6A4A1 measures 15x11x1.4mm. Ball pitch is 0.8mm. It is the same size as Fujitsus four-chip MCP. Memory capacity is increased by 20% in the new six-chip version. The MCP is divided into a four-chip upper package and a two-chip lower package.
The MCP can accommodate up to 100,000 erase/write repetitions. The PS-MCP will be available by the end of November.