News Article
Israeli Foundry Tower Semiconductor Has Ordered $45mn
Israeli foundry Tower Semiconductor has ordered $45mn worth of equipment
from Applied Materials. Tower plans to use the equipment for the production
of 0.18micron and 0.13micron CMOS digital logic, mixed signal, flash memory
and image sensor devices in its new Fab 2. The facility is expected to
produce up to 33,000 200mm wafers per month and employ 1100 people.
Tower's order includes multiple PVD (physical vapour deposition), RTP (rapid
thermal processing), etch, HDP-CVD (high-density plasma chemical vapour
deposition), WCVD (tungsten chemical vapour deposition), SACVD
(sub-atmospheric chemical vapour deposition), wafer inspection and defect
review systems.
Israeli foundry Tower Semiconductor has ordered $45mn worth of equipment
from Applied Materials. Tower plans to use the equipment for the production
of 0.18micron and 0.13micron CMOS digital logic, mixed signal, flash memory
and image sensor devices in its new Fab 2. The facility is expected to
produce up to 33,000 200mm wafers per month and employ 1100 people.
Tower's order includes multiple PVD (physical vapour deposition), RTP (rapid
thermal processing), etch, HDP-CVD (high-density plasma chemical vapour
deposition), WCVD (tungsten chemical vapour deposition), SACVD
(sub-atmospheric chemical vapour deposition), wafer inspection and defect
review systems.
from Applied Materials. Tower plans to use the equipment for the production
of 0.18micron and 0.13micron CMOS digital logic, mixed signal, flash memory
and image sensor devices in its new Fab 2. The facility is expected to
produce up to 33,000 200mm wafers per month and employ 1100 people.
Tower's order includes multiple PVD (physical vapour deposition), RTP (rapid
thermal processing), etch, HDP-CVD (high-density plasma chemical vapour
deposition), WCVD (tungsten chemical vapour deposition), SACVD
(sub-atmospheric chemical vapour deposition), wafer inspection and defect
review systems.