Smart Cut Partnership Expanded
Under the terms of the Smart Cut-Enabling Application Laboratory (SCEALAB)
partnership, Soitec will also gain exclusive rights to LETI's intellectual
property (IP)-related Smart Cut technology -- including full sub-licensing
rights to the technology -- to target applications beyond silicon and SOI
substrates. As a result, Soitec will be able to offer a broad range of new
materials related to silicon, silicon carbide, silicon germanium, sapphire
and III-V materials.
SCEALAB R&D activity will be conducted in LETI's facilities, as well as in
Soitec's R&D facility in Bernin, France. Soitec researchers will focus on
the development of strained SOI and silicon-on-quartz (SOQ) substrates
developed in conjunction with Soitec licensee Seiko Epson. Soitec's R&D
facility features a Class 1, 200mm, 540m2 cleanroom.
