News Article
Tiny Package Moves And Deals
Philips Electronics and Fairchild Semiconductor have formed a working
relationship to become a multi-source supplier for small-scale logic
packaging.
This aims at increasing the availability of Fairchild's MicroPak and
Philips' Depopulated very-thin Quad Flat-pack No-leads (DQFN) packages.
Target applications of these technologies include cellular phones, PDAs,
watches, cameras, and notebook computers.
The 1.45x1.00x0.55mm, 6-terminal MicroPak offers single and dual gate
products with a 65% space saving over SC70 packages. The 2.5x3.0mm 14-pin
DQFN is some 75% smaller than existing TSSOP packages. DQFN is also
available in 16- and 20-pin options. An exposed die paddle provides a 20%
improvement in heat dissipation over a comparable TSSOP.
