News Article
ChipPAC Teams Up With Advanced Semiconductor Manufacturing (ASMC)
ChipPAC and Advanced Semiconductor Manufacturing (ASMC), an analogue, power
and smartcard wafer foundry in Shanghai, China, will provide customers with
end-to-end solutions from wafer fab to wafer sort, packaging, final test and
distribution in China, as well as to the global market.
The companies have
worked together for nearly a year and have already established logistics for
a turnkey supply chain for the analogue and power IC market.
ChipPAC's capacity with the construction of a new manufacturing facility and
full equipment operating over time will be in excess of 100mn units/week in
China. Separately, ASMC started construction of its Fab 3, a 200mm wafer
facility, which will commence production in 2003. ASMC already operates
125mm and 150mm fabs. ASMC expects its total wafer fab capacity will reach
100,000 wafers/month.
worked together for nearly a year and have already established logistics for
a turnkey supply chain for the analogue and power IC market.
ChipPAC's capacity with the construction of a new manufacturing facility and
full equipment operating over time will be in excess of 100mn units/week in
China. Separately, ASMC started construction of its Fab 3, a 200mm wafer
facility, which will commence production in 2003. ASMC already operates
125mm and 150mm fabs. ASMC expects its total wafer fab capacity will reach
100,000 wafers/month.
