News Article
Amkor Technology Is Expanding Its MicroLeadFrame Capacity
Amkor Technology is expanding its MicroLeadFrame capacity to more than 75mn
units/month by Q4, 2002. When introduced in 1999, the packages production
reached a 1mn units/week three months after qualification.
The package
technology has applications for high-frequency RF and other wireless
devices.
MicroLeadFrame is Amkor's version of a quad, flat, no-lead (QFN)
semiconductor package. MLF production has seen unit shipments of 13mn in
1999 with expectations of more than 350mn in 2002 and 600mn in 2003.
Amkor made a multi-year agreement with Philips getting access to MLF
technology. MLF technology is used in Philips' recently introduced DQFN
package.
technology has applications for high-frequency RF and other wireless
devices.
MicroLeadFrame is Amkor's version of a quad, flat, no-lead (QFN)
semiconductor package. MLF production has seen unit shipments of 13mn in
1999 with expectations of more than 350mn in 2002 and 600mn in 2003.
Amkor made a multi-year agreement with Philips getting access to MLF
technology. MLF technology is used in Philips' recently introduced DQFN
package.
