News Article
Two New STMicroelectronics Tiny Packages
STMicroelectronics has two new tiny packages in its portfolio - the MSOP8
(meeting the TSSOP8 3x3mm JEDEC standard) and the 5x3mm MLP8 (VFQFPN8 JEDEC
standard).
The MSOP8 provides a reduction in size of 23% compared with its predecessor,
the TSSOP8. The package thickness is +0.85±0.1mm. The MSOP8 will be
available from ST's 1-32kbit EEPROM I2C bus, the 1-8kbit SPI bus and the
1-16kbit MICROWIRE bus portfolios. Samples and volume production are
expected during Q4, 2002.
The MLP8 (Micro LeadFrame Package 8) has the same overall footprint as the
standard SO8N package with a 118% larger die area possible in the MLP-8LD
SOIC package over that of the S08N. Typical overall thickness is 0.85mm with
a 1.27mm pitch. The MLP8 will be available from ST's 512k-16Mbit serial
Flash SPI portfolio. Samples and volume production are planned for Q4, 2002.
the TSSOP8. The package thickness is +0.85±0.1mm. The MSOP8 will be
available from ST's 1-32kbit EEPROM I2C bus, the 1-8kbit SPI bus and the
1-16kbit MICROWIRE bus portfolios. Samples and volume production are
expected during Q4, 2002.
The MLP8 (Micro LeadFrame Package 8) has the same overall footprint as the
standard SO8N package with a 118% larger die area possible in the MLP-8LD
SOIC package over that of the S08N. Typical overall thickness is 0.85mm with
a 1.27mm pitch. The MLP8 will be available from ST's 512k-16Mbit serial
Flash SPI portfolio. Samples and volume production are planned for Q4, 2002.
