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Tiny Package Moves And Deals

Philips Electronics and Fairchild Semiconductor have formed a working relationship to become a multi-source supplier for small-scale logic packaging.
This aims at increasing the availability of Fairchild's MicroPak and

Philips' Depopulated very-thin Quad Flat-pack No-leads (DQFN) packages.

Target applications of these technologies include cellular phones, PDAs,

watches, cameras, and notebook computers.

The 1.45x1.00x0.55mm, 6-terminal MicroPak offers single and dual gate

products with a 65% space saving over SC70 packages. The 2.5x3.0mm 14-pin

DQFN is some 75% smaller than existing TSSOP packages. DQFN is also

available in 16- and 20-pin options. An exposed die paddle provides a 20%

improvement in heat dissipation over a comparable TSSOP.
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