News Article
Fairchild Semiconductor Has Opened A Package And Technology Knowledge Center
Fairchild Semiconductor has opened a Package and Technology Knowledge Center
in South Korea. The centre will research new packaging materials to improve
thermal and mechanical performance and develop new assembly techniques.
Fairchild Semiconductor has opened a Package and Technology Knowledge Center
in South Korea. The centre will research new packaging materials to improve
thermal and mechanical performance and develop new assembly techniques.
in South Korea. The centre will research new packaging materials to improve
thermal and mechanical performance and develop new assembly techniques.
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