News Article
German Plasma Etch Equipment Supplier ASYNTIS Has Raised EUR2mn In First
German plasma etch equipment supplier ASYNTIS has raised EUR2mn in first
round of financing with venture capital company Earlybird.
Dr Berthold Kegel, CEO and co-founder of ASYNTIS, reports:
National Semiconductor signed a memorandum of understanding (MOU) with the
Suzhou Industrial Park Administrative Committee to lease 14,500m2 of land
for an assembly and test plant. Construction is expected to begin in
November 2002. The facility is expected to be up and operational, with
around 500 employees, in 2004. National Semiconductor expects to invest up
to $200mn for construction, equipment, facilities and personnel during the
next five years.
The park is a joint development project between China and Singapore. The
official developer of the park, China-Singapore Suzhou Industrial Park
Development, is 65% owned by the Chinese consortium and 35% by the Singapore
consortium.
Assembly & test company ChipPAC plans to more than double its manufacturing
capacity in China. A new facility is to be built in the Shanghai region with
more than 27,000m2 of space. Construction will begin in Q4 of this year on
the campus of the company's existing manufacturing site. Capacity for
customer programs will be available starting Q3 2003.
Dennis McKenna, chairman and CEO, reports "We have invested more than $150mn
in manufacturing capabilities and already have greater than 2.5 times the
scale of our nearest competitors."
Robert Krakauer, chief financial officer, adds: "ChipPAC will be producing
over 10mn units per day as well as test and distribution services for these
units."
Suzhou Industrial Park Administrative Committee to lease 14,500m2 of land
for an assembly and test plant. Construction is expected to begin in
November 2002. The facility is expected to be up and operational, with
around 500 employees, in 2004. National Semiconductor expects to invest up
to $200mn for construction, equipment, facilities and personnel during the
next five years.
The park is a joint development project between China and Singapore. The
official developer of the park, China-Singapore Suzhou Industrial Park
Development, is 65% owned by the Chinese consortium and 35% by the Singapore
consortium.
Assembly & test company ChipPAC plans to more than double its manufacturing
capacity in China. A new facility is to be built in the Shanghai region with
more than 27,000m2 of space. Construction will begin in Q4 of this year on
the campus of the company's existing manufacturing site. Capacity for
customer programs will be available starting Q3 2003.
Dennis McKenna, chairman and CEO, reports "We have invested more than $150mn
in manufacturing capabilities and already have greater than 2.5 times the
scale of our nearest competitors."
Robert Krakauer, chief financial officer, adds: "ChipPAC will be producing
over 10mn units per day as well as test and distribution services for these
units."