News Article
French Microsystems Producer MEMSCAP Has Relocated Its Registered French
French microsystems producer MEMSCAP has relocated its registered French
headquarters, and all Grenoble-area facilities, to its new production site
located in Bernin, outside of Grenoble. Last week, management and design
teams moved to the new offices, joining the production staff, who have been
on-site since December 2001. The company now operates in 13,520m2 of space.
The official inauguration of the site will be held at a later date.
SUSS MicroTec subsidiary Image Technology is expanding its precision
photomask operations into Taiwan. Image Technology plans to manufacture
9-inch and 14-inch masks for full field exposure of 200-mm and 300-mm wafers
on SUSS MicroTec's full field mask aligners. The new facility will begin
operations by Q4 2002. Full-field lithography is used for wafer-level
bumping and redistribution processes for IC packaging.
ChipMOS TECHNOLOGIES (Bermuda) broke ground for an IC test and assembly
25,000m2 facility in Shanghai, China. Construction is to begin by September
2002 and full-scale production is expected to start Q3 2005, with a planned
capacity of 50m units per month. The initial services will include testing
and assembly of memory, liquid crystal display driver ICs, and module and
sub-system manufacturing.
Memory developer T-RAM completed a $35m second round of funding. The company
plans to replace six-transitor (6T) static RAM memory (SRAM) with a
thyristor, single-transistor structure. Thyristors use a bipolar sequence of
three junctions between four alternating p- and n-doped layers (pnpn). The
previous round raised $11m. New Enterprise Associates supplies $15m of the
new money.
A micro and nanotechnology centre is to be built at the French CEA atomic
energy organisation's research centre in Grenoble in a EUR152.45m project.
The Minatec Innovation Centre will cover an area of 8hectares (80,000m2),
housing 1000 students, 500 trainees, 400 teachers and more than 2000
researchers, engineers and technicians. The completion of the centre is
expected in 2005. Support comes from the French national and local
government, the CEA, the Polytechnic Institute of Grenoble (INPG) and the
French Caisse de Depots et Consignations fund.
photomask operations into Taiwan. Image Technology plans to manufacture
9-inch and 14-inch masks for full field exposure of 200-mm and 300-mm wafers
on SUSS MicroTec's full field mask aligners. The new facility will begin
operations by Q4 2002. Full-field lithography is used for wafer-level
bumping and redistribution processes for IC packaging.
ChipMOS TECHNOLOGIES (Bermuda) broke ground for an IC test and assembly
25,000m2 facility in Shanghai, China. Construction is to begin by September
2002 and full-scale production is expected to start Q3 2005, with a planned
capacity of 50m units per month. The initial services will include testing
and assembly of memory, liquid crystal display driver ICs, and module and
sub-system manufacturing.
Memory developer T-RAM completed a $35m second round of funding. The company
plans to replace six-transitor (6T) static RAM memory (SRAM) with a
thyristor, single-transistor structure. Thyristors use a bipolar sequence of
three junctions between four alternating p- and n-doped layers (pnpn). The
previous round raised $11m. New Enterprise Associates supplies $15m of the
new money.
A micro and nanotechnology centre is to be built at the French CEA atomic
energy organisation's research centre in Grenoble in a EUR152.45m project.
The Minatec Innovation Centre will cover an area of 8hectares (80,000m2),
housing 1000 students, 500 trainees, 400 teachers and more than 2000
researchers, engineers and technicians. The completion of the centre is
expected in 2005. Support comes from the French national and local
government, the CEA, the Polytechnic Institute of Grenoble (INPG) and the
French Caisse de Depots et Consignations fund.