News Article
The UMCi Singapore-based 300mm Joint Venture Between UMC, Infineon
The UMCi Singapore-based 300mm joint venture between UMC, Infineon
Technologies and the local EDBI government agency has announced several
contracts have been awarded for the next construction phase. These include
waste water treatment from Hyflux Hydrochem, cleanroom installation by M+W
Zander, gas supply from SOXAL (Singapore Oxygen Air Liquide), chemical
supply by Sumitomo Chemical Engineering and ultrapure water supply from
Vivendi Water Systems/USF. The contracts add up to a value of $68m. Total
planned capacity is 40,000 wafers per month with production scheduled to
begin in Q2 2003 on UMC's 130nm and 90nm copper/low k process technologies.
Tokyo Electron's (TEL) PR200Z polymer removal system has been chosen as the
process tool of record for International SEMATECH's (ISMT) Advanced Tool
Development Facility (ATDF) Cu-oxide line.
IC packing company ASE Korea has ordered 16 2008 die bonders from European
chip assembly equipment producer ESEC.
process tool of record for International SEMATECH's (ISMT) Advanced Tool
Development Facility (ATDF) Cu-oxide line.
IC packing company ASE Korea has ordered 16 2008 die bonders from European
chip assembly equipment producer ESEC.
