News Article
SUSS MicroTec Receives Strategic 200mm Mask Aligner Order From Shipley Company
SUSS MicroTec announced a key order for its 200mm Mask Aligner from Shipley Company. Shipley a supplier of photoresist to the advanced packaging market, chose SUSS MicroTecs Mask Aligner technology over alternative technologies due to its low cost of ownership and flexibility for processing wafers of different sizes and photo resist thickness.
Shipley, a chemical supplier to the advanced packaging industry, is also an associate member of SECAP (Semiconductor Equipment Consortium for Advanced Packaging) and therefore, this order has great strategic significance to SUSS MicroTec.
Wafer-level packaging is an advanced packaging technology whereby the die and package are manufactured and tested on the wafer, then diced into individually packaged integrated circuits (ICs). Process and cost considerations in wafer level packaging are considerably different from front-end technology, which makes it unattractive to use front-end equipment. SUSS MicroTecs lithography systems therefore, are specifically designed for wafer level packaging to meet process and cost-of-ownership requirements of this technology
