200% Improvement In Wafer Yield From DuPont Dow Elastomers
DuPont Dow Elastomers just launched Kalrez® Sahara 8085 at Semicon West 2002. The new compound has been specifically developed for very low particle generation and low weight loss in plasma processes such as HDPCVD and PECVD, and will enhance seal performance in highly aggressive environments like NF3 and oxygen plasma
NF3 is an efficient etching tool and a product of choice for many semiconductor chip fabricators, but under certain operating conditions may be damaging to elastomeric seals. Kalrez® Sahara 8085 was developed with NF3 plasma in mind.
Up to 200% improvement in wafer yield Customers who have used Kalrez® Sahara 8085 claim that it has improved wafer yield by as much as 200% in applications where NF3 plasma is used for cleaning. It has demonstrated excellent mechanical properties, and is well-suited for both static and dynamic sealing applications such as bonded slit valve doors, bonded gate valves, gas inlets, gas orifice seals and gas feed-through seals claims Chida.
Kalrez® Sahara 8085 complements Kalrez® Sahara 8575 to help improve productivity and increase wafer yields, while delivering extended seal life and reduced particle generation.
Find out more! and check our site:
http://www.dupont-dow.com/Products/Kalrez/indSemi.asp
or write to [email protected]
with new Kalrez® Sahara 8085 from DuPont Dow Elastomers
DuPont Dow Elastomers just launched Kalrez® Sahara 8085 at Semicon West
2002. The new compound has been specifically developed for very low
particle generation and low weight loss in plasma processes such as HDPCVD
and PECVD, and will enhance seal performance in highly aggressive
environments like NF3 and oxygen plasma
NF3 is an efficient etching tool and a product of choice for many
semiconductor chip fabricators, but under certain operating conditions may
be damaging to elastomeric seals. Kalrez® Sahara 8085 was developed with
NF3 plasma in mind.
Up to 200% improvement in wafer yield
Customers who have used Kalrez® Sahara 8085 claim that it has improved
wafer yield by as much as 200% in applications where NF3 plasma is used for
cleaning. It has demonstrated excellent mechanical properties, and is
well-suited for both static and dynamic sealing applications such as bonded
slit valve doors, bonded gate valves, gas inlets, gas orifice seals and gas
feed-through seals claims Chida.
Kalrez® Sahara 8085 complements Kalrez® Sahara 8575 to help improve
productivity and increase wafer yields, while delivering extended seal life
and reduced particle generation.
Find out more! and check our site:
http://www.dupont-dow.com/Products/Kalrez/indSemi.asp
or write to [email protected]