News Article
Alliances
Asymtek has joined the Advanced Packaging & Interconnect Alliance (APiA).
Asymtek has joined the Advanced Packaging & Interconnect Alliance (APiA).
The alliances steering members are August Technology, Ebara, Ultratech
Stepper and Unaxis.
"We are excited about becoming a new member and the opportunity to apply our
technology in underfills, wafer applied materials, low-k dielectric coatings
using traditional needles and jetting technology," says Alec Babiarz, senior
vice president.
The alliances steering members are August Technology, Ebara, Ultratech
Stepper and Unaxis.
"We are excited about becoming a new member and the opportunity to apply our
technology in underfills, wafer applied materials, low-k dielectric coatings
using traditional needles and jetting technology," says Alec Babiarz, senior
vice president.