Arch Microelectronic Materials has been granted two US patents in the field of chemical mechanical planarisation (CMP) slurries.

STMicroelectronics has filed a US lawsuit for patent infringement against Broadcom.

Thomson Derwent launched a micro/nano-electro-mechanical systems (MEMS & NEMS) Industry and Technology Patents profile (ITP) service.

Arch Microelectronic Materials has been granted two US patents in the field
of chemical mechanical planarisation (CMP) slurries.
One patent is for a single-component slurry that can replace traditional
two-component slurries, which require an oxidiser to be mixed into a slurry
before CMP. The new slurry incorporates these needed oxidisers, eliminating
the mixing step. The second patent is for a two-component slurry that uses a
standard dispersion as a first component and an activator solution as the
second component. This allows different chemistries for different process
steps and applications, while using the same standard dispersion.
Arch Chemicals has granted exclusive rights for slurries using this
technology to Planar Solutions - a US-based joint venture between Arch
Microelectronic Materials and Germanys Wacker Chemical founded in 2000. The
patented technology is the basis for Planars Cu10K-2 product. The joint
venture grew out of a CMP product joint-development alliance that the two
companies initiated in 1998.

STMicroelectronics has filed a US lawsuit for patent infringement against
Broadcom. ST alleges that Broadcom infringes six patents covering technology
used in various semiconductor products, including products used in cable
modem, set top box, and high speed networking applications (Nos.5,031,092;
5,347,185; 5,515,225; 5,946,261; 6,025,746 and 6,087,709).

Thomson Derwent launched a micro/nano-electro-mechanical systems (MEMS &
NEMS) Industry and Technology Patents profile (ITP) service.