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News Article

Laser Dicing At Infineon

Saturday 30th November 2002

Infineon has ordered a 200mm laser dicing system (LDS 200A) from Swiss company Synova.
Infineon has ordered a 200mm laser dicing system (LDS 200A) from Swiss company Synova.


The Infineon facility is in the Austrian city of Villach and produces power semiconductors on 125mm, 150mm, and 200mm wafers thinned down to 70µm.


The water jet guided laser machine will be upgraded at a later stage with an integrated edge damage detector, allowing repairing of wafer edges at locations with visible cracks. The optical system permits the recognition of damage 50µm and bigger.

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