News Article
300mm Plans In Japan
Toshiba has decided "in principle" to build 300mm wafer production facilities. Production lines will be set up in two major Japanese facilities in Oita and Yokkaichi. The investment program will extend over four years from 2003 and is expected to total JPY350bn.
Toshiba has decided "in principle" to build 300mm wafer production facilities. Production lines will be set up in two major Japanese facilities in Oita and Yokkaichi. The investment program will extend over four years from 2003 and is expected to total JPY350bn.
The production line at Oita will mass-produce cutting-edge system LSIs for broadband network applications, using the companys embedded DRAM process technology. The facility is expected to adopt 45nm process technology in the future. Mass production is scheduled to start in 2004.
The facility at Yokkaichi will mass-produce NAND-type Flash memories. Mass production is expected to begin in 2006.
