US MEMS Foundry Upgrades And Expands

This project, to be completed in mid-2003, has started with the relocation of a portion of the companys silicon etch operations, previously located at a separate location in California. In addition, an upgrade of facility infrastructure and the purchase and installation of new equipment adds capacity to pressure sensor and MEMS foundry business.

This facility expansion project has been designed in phases to maintain full on-going production and qualification of new equipment.

The facility expansion program will also support previously announced plans to establish full capability for production of MEMS devices on 200mm wafers. Processes that had previously been subcontracted, such as some metal and thin film depositions, will now be performed in-house.