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SUSS MicroTec is to install a lithography line at Taiwans National Nano
Device Laboratories (NDL) for thin and thick resist MEMS (micro-electro
mechanical systems) applications.
SUSS MicroTec is to install a lithography line at Taiwans National Nano
Device Laboratories (NDL) for thin and thick resist MEMS (micro-electro
mechanical systems) applications. The line consists of an MA150 production
mask aligner and an ACS200 coating cluster. MEMS require thick resist
layers in order to pattern three-dimensional structures.
From February 2003, the line will be open to customers and prospective
customers for equipment demonstration and evaluation of process
technology.
Device Laboratories (NDL) for thin and thick resist MEMS (micro-electro
mechanical systems) applications. The line consists of an MA150 production
mask aligner and an ACS200 coating cluster. MEMS require thick resist
layers in order to pattern three-dimensional structures.
From February 2003, the line will be open to customers and prospective
customers for equipment demonstration and evaluation of process
technology.