News Article
Investment & Expansion
The Singapore-based 300mm joint venture, UMCi, has begun equipment
move-in. The venture brings together UMC, Infineon Technologies and EDB
Investments, the investment arm of the Singapore governments Economic
Development Board.
The Singapore-based 300mm joint venture, UMCi, has begun equipment
move-in. The venture brings together UMC, Infineon Technologies and EDB
Investments, the investment arm of the Singapore governments Economic
Development Board.
Among the first tools to arrive was copper processing equipment from
Applied Materials and Tokyo Electron (TEL). Total planned capacity for the
facility is 40,000 wafers per month and overall investment is expected to
be $3.6bn. Current installation will primarily focus on copper
back-end-of-line processing equipment, with front-end-of-line equipment
expected to follow later this year.
UMCs first 300mm fab in Taiwan is currently in volume production for
customer products.
move-in. The venture brings together UMC, Infineon Technologies and EDB
Investments, the investment arm of the Singapore governments Economic
Development Board.
Among the first tools to arrive was copper processing equipment from
Applied Materials and Tokyo Electron (TEL). Total planned capacity for the
facility is 40,000 wafers per month and overall investment is expected to
be $3.6bn. Current installation will primarily focus on copper
back-end-of-line processing equipment, with front-end-of-line equipment
expected to follow later this year.
UMCs first 300mm fab in Taiwan is currently in volume production for
customer products.
