News Article
3D Package Alliance
Amkor Technology and Sharp have agreed to unify the design for 3D system in package assembly for the stacking of very thin packages. Target markets are ASICs, DSPs and memories for cell phones, PDAs, digital still cameras.
Amkor Technology and Sharp have agreed to unify the design for 3D system in package assembly for the stacking of very thin packages. Target markets are ASICs, DSPs and memories for cell phones, PDAs, digital still cameras.
The two companies will develop and enhance a standard industry stacked package format using Amkors stackable etCSP package and Sharps package stacked CSP. The first proposal for the new package format, coined 3D-SiP, will be to standardise the terminal position of individual, stackable packages containing ASIC and memory devices.
Using the 3D-SiP format, individual packages can be stacked onto one another. By stacking existing packaged ICs that have already been qualified individually speeds the development process.
