News Article
Wacker Corners 300mm Investment
The official cornerstone laying ceremony marks progress on Wacker Siltronics new 300mm raw wafer production facility in Freiberg, Germany.
The official cornerstone laying ceremony marks progress on Wacker Siltronics new 300mm raw wafer production facility in Freiberg, Germany.
The plant is due to reach mass production by June 2004. Initial capacity will be 60,000 wafers per month, increasing to 150,000. The EUR430mn investment is expected to create more than 600 new jobs.
Epitaxial wafer finishing services are to be sited close to the companys Taiwan customers. The company puts its market share at 20% worldwide.