Indium Corporation will be at Semicon Europa to exhibit a wide range of new and established high performance interconnect products. Distributors are worldwide with manufacturing facilities in USA, UK and Singapore. Indium has been supplying high quality products since 1934. NEW Lead free Chip Attachment Solder CP-6106 & CP6121 are nitrogen reflow, no clean solder pastes with Type 6 (15 – 5) powder, specifically formulated for flip clip attachment. Indium provides type 6 SnAg and SnAgCn lead-free solder powder to be compatible with the flux for excellent stencil release for ultra-fine pitch printing. Flip Chip Epoxy Fluxes PK-001 and PK-002 are Halide Free No-Clean fluxes for Flip Chip or CSP soldering, designed for use with Sn62 and Sn63 Eutectic Solders. They provide a powerful metal surface, oxide cleaning capability during reflow and help good soldering. Benefits include compatibility with standard underfill materials and conformal coating. PK-001 and PK-002 are VOC free and environmentally friendly. Precision Spheres Indium has for many years manufactured spheres with highly accurate diameters, bright shiny surfaces and highly spherical shapes. SPC supports sphere production. All spheres are made from pure metals, which combine to produce exact alloy compositions and are classified for size in an automated, high capacity process for smooth bright surfaces. A wide variety of alloys and sizes are available. Interconnect Flux WS-363 - Water-soluble, Halide-free for BGA bumps W-363 Interconnect Flux is a high viscosity paste-type flux for use in high yield BGA bumping, board level attachment and rework. Benefits include excellent cleanability. Residues are removed at room temperature with DI water. Also stencil printable with high tack, Halide-free with excellent solderability. Support Products from Indium Indium supplies a full range of chip-scale assembly products, including TACFLUX™ high viscosity fluxes to hold spheres in place during the attachment process, our patented INTEGRATED™ Solder Preform Arrays for BGA fabrication and repair applications. Flip Chip Fluxes, Die Attach Adhesives and a full range of solder pastes for attachment and bumping applications. Visit SEMICON Europa booth A1.621 or our website www.indium.com We look forward to seeing you. If you will not be present at the exhibition, please contact us at: Email : [email protected] Tel : + 44 (0) 1908 580400 Web : www.indium.com